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HSPHV24-01KTG-C

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HXY MOSFET Electrostatic And Surge Protection (TVS/ESD), DFN1006-2L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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docs Publish 0.1.0 · Ray 11d ago
viewers hsphv24-01ktg-c: symbol repaired (bidirectional TVS (the page says so)) · Ray 4d ago
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hsphv24-01ktg-c-etched.step hsphv24-01ktg-c: factory component page (tier=lcsc) · Ray 11d ago
hsphv24-01ktg-c-hero.glb hsphv24-01ktg-c: hero GLB from the etched model (keeps the MPN mark) · Ray 11d ago
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hsphv24-01ktg-c.kicad_mod Publish 0.1.0 · Ray 11d ago
hsphv24-01ktg-c.kicad_sym hsphv24-01ktg-c: symbol repaired (bidirectional TVS (the page says so)) · Ray 4d ago
hsphv24-01ktg-c.lbr hsphv24-01ktg-c: symbol repaired (bidirectional TVS (the page says so)) · Ray 4d ago
hsphv24-01ktg-c.step Publish 0.1.0 · Ray 11d ago
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README.md Publish 0.1.0 · Ray 11d ago

HSPHV24-01KTG-C

HXY MOSFET · Electrostatic And Surge Protection (TVS/ESD) · DFN1006-2L

HSPHV24-01KTG-C from HXY MOSFET, in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive One terminal of the bidirectional ESD protection line, rated for a 24 V reverse working voltage and 300 W peak pulse power (8/20 µs) across the device.
2 2 passive The other terminal of the bidirectional ESD protection line, rated for a 24 V reverse working voltage and 300 W peak pulse power (8/20 µs) across the device.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package DFN1006-2L
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Pulse Power PPP 300 W tp = 8/20 μs 1
Maximum junction temperature Tj 150 °C 1
Storage Temperature Range Tstg -55 150 °C 1
Maximum lead temperature for soldering TL 260 °C 10 s 1
ESD immunity, IEC 61000-4-2 contact discharge 15 kV IEC 61000-4-2, contact discharge (printed ±15 kV) 1
ESD immunity, IEC 61000-4-2 air discharge 20 kV IEC 61000-4-2, air discharge (printed ±20 kV) 1
EFT immunity, IEC 61000-4-4 40 A IEC 61000-4-4, 5/50 ns 1
Reverse Working Voltage VRWM 24 V 2
Reverse Breakdown Voltage VBR 26.5 V IT = 1 mA 2
Reverse Leakage Current IR 0.1 μA VRWM = 24 V 2
Clamping Voltage VC 40 60 V IPP = 4 A, tp = 8/20 μs 2
Junction Capacitance CJ 10 pF VR = 0 V, f = 1 MHz 2

CAD (KiCad official)

  • Symbol: HSPHV24-01KTG-C
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: DFN1006-2L (KiCad packages3D, STEP)
  • 3D model files: hsphv24-01ktg-c-etched.step / hsphv24-01ktg-c-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hsphv24-01ktg-c.step / hsphv24-01ktg-c.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (4 pp, sha256 9fde12af13d36cfe, retrieved 2026-10-28, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF