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HSP044N25

HUASHUO · MOSFETs · TO-220

HSP044N25 from HUASHUO, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limited to ±20 V, with threshold of 3 V min to 5 V max at ID=250uA.
2 D passive Drain (also the tab); drain-source voltage rated 250 V, with continuous drain current of 50 A at TC=25℃.
3 S passive Source; continuous source current is 50 A max, with diode forward voltage of 1.2 V max at IS=20A.

Key specifications

Parameter Value
Manufacturer HUASHUO
Package TO-220
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 250 V VGS=0V, ID=250uA 2
Gate Threshold Voltage VGS(th) 3 5 V VGS=VDS, ID=250uA 2
Static Drain-Source On-Resistance RDS(ON) 34 44 mΩ VGS=10V, ID=5A 2
Drain-Source Leakage Current IDSS 1 uA VDS=150V, VGS=0V, TJ=25℃ 2
Drain-Source Leakage Current IDSS 100 uA VDS=150V, VGS=0V, TJ=125℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Continuous Source Current IS 50 A VG=VD=0V, Force Current 2
Diode Forward Voltage VSD 1.2 V VGS=0V, IS=20A, TJ=25℃ 2
Drain-Source Voltage VDS 250 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID@TC=25℃ 50 A VGS @ 10V 1
Continuous Drain Current ID@TC=100℃ 34 A VGS @ 10V 1
Pulsed Drain Current IDM 195 A 1
Single Pulse Avalanche Energy EAS 165 mJ VDD=40V, VGS=10V, L=0.5mH, Rg=25Ω 1
Total Power Dissipation PD@TC=25℃ 325 W TC=25℃ 1
Storage Temperature Range TSTG -55 175 ℃ 1
Operating Junction Temperature Range TJ -55 175 ℃ 1
Thermal Resistance Junction-ambient RθJA 60 ℃/W 1
Thermal Resistance Junction-Case RθJC 0.48 ℃/W 1

CAD (KiCad official)

  • Symbol: HSP044N25
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220 (KiCad packages3D, STEP)
  • 3D model files: hsp044n25-etched.step / hsp044n25-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hsp044n25.step / hsp044n25.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HUASHUO datasheet (5 pp, sha256 ac7d13680de79e50, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF