# HSM6006

**HUASHUO** · MOSFETs · SOP-8

HSM6006 from HUASHUO, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S | passive | Source of the N-channel MOSFET, tied with pins 2 and 3 (VDS 60 V, ID 6.3 A at TA=25℃ total device rating). |
| 2 | S | passive | Source of the N-channel MOSFET, tied with pins 1 and 3 (VDS 60 V, ID 6.3 A at TA=25℃ total device rating). |
| 3 | S | passive | Source of the N-channel MOSFET, tied with pins 1 and 2 (VDS 60 V, ID 6.3 A at TA=25℃ total device rating). |
| 4 | G | input | Gate of the N-channel MOSFET, rated at ±20 V VGS maximum with threshold 1.2 V min to 2.5 V max. |
| 5 | D | passive | Drain of the N-channel MOSFET, tied with pins 6, 7 and 8 (60 V VDS maximum, RDS(ON) 18 mΩ max at VGS=10V). |
| 6 | D | passive | Drain of the N-channel MOSFET, tied with pins 5, 7 and 8 (60 V VDS maximum, RDS(ON) 18 mΩ max at VGS=10V). |
| 7 | D | passive | Drain of the N-channel MOSFET, tied with pins 5, 6 and 8 (60 V VDS maximum, RDS(ON) 18 mΩ max at VGS=10V). |
| 8 | D | passive | Drain of the N-channel MOSFET, tied with pins 5, 6 and 7 (60 V VDS maximum, RDS(ON) 18 mΩ max at VGS=10V). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HUASHUO |
| Package | SOP-8 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS |  |  | 60 | V |  | 1 |
| Gate-Source Voltage | VGS | -20 |  | 20 | V |  | 1 |
| Continuous Drain Current | ID@TA=25℃ |  |  | 6.3 | A | VGS @ 10V | 1 |
| Continuous Drain Current | ID@TA=70℃ |  |  | 5 | A | VGS @ 10V | 1 |
| Pulsed Drain Current | IDM |  |  | 32 | A |  | 1 |
| Single Pulse Avalanche Energy | EAS |  |  | 39 | mJ | VDD=25V,VGS=10V,L=0.1mH,IAS=28A | 1 |
| Avalanche Current | IAS |  |  | 28 | A |  | 1 |
| Total Power Dissipation | PD@TA=25℃ |  |  | 1.5 | W |  | 1 |
| Storage Temperature Range | TSTG | -55 |  | 150 | ℃ |  | 1 |
| Operating Junction Temperature Range | TJ | -55 |  | 150 | ℃ |  | 1 |
| Thermal Resistance Junction-Ambient | RθJA |  |  | 85 | ℃/W |  | 1 |
| Thermal Resistance Junction-Case | RθJC |  |  | 25 | ℃/W |  | 1 |
| Drain-Source Breakdown Voltage | BVDSS | 60 |  |  | V | VGS=0V , ID=250uA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) |  |  | 18 | mΩ | VGS=10V , ID=6A | 2 |
| Static Drain-Source On-Resistance | RDS(ON) |  |  | 20 | mΩ | VGS=4.5V , ID=4A | 2 |
| Gate Threshold Voltage | VGS(th) | 1.2 | 1.6 | 2.5 | V | VGS=VDS , ID =250uA | 2 |
| Drain-Source Leakage Current | IDSS |  |  | 1 | uA | VDS=48V , VGS=0V , TJ=25℃ | 2 |
| Drain-Source Leakage Current | IDSS |  |  | 5 | uA | VDS=48V , VGS=0V , TJ=55℃ | 2 |
| Gate-Source Leakage Current | IGSS | -100 |  | 100 | nA | VGS=±20V , VDS=0V | 2 |
| Continuous Source Current | IS |  |  | 6.3 | A | VG=VD=0V , Force Current | 2 |
| Pulsed Source Current | ISM |  |  | 32 | A |  | 2 |
| Diode Forward Voltage | VSD |  |  | 1 | V | VGS=0V , IS=A , TJ=25℃ | 2 |
| BVDSS Temperature Coefficient | △BVDSS/△TJ |  | 0.057 |  | V/℃ | Reference to 25℃ , ID=1mA | 2 |
| VGS(th) Temperature Coefficient | △VGS(th) |  | -5.68 |  | mV/℃ |  | 2 |
| Forward Transconductance | gfs |  | 40 |  | S | VDS=5V , ID=6A | 2 |
| Gate Resistance | Rg |  | 1.7 |  | Ω | VDS=0V , VGS=0V , f=1MHz | 2 |
| Total Gate Charge (4.5V) | Qg |  | 18.8 |  | nC | VDS=48V , VGS=4.5V , ID=6A | 2 |
| Gate-Source Charge | Qgs |  | 7.7 |  | nC | VDS=48V , VGS=4.5V , ID=6A | 2 |
| Gate-Drain Charge | Qgd |  | 6.2 |  | nC | VDS=48V , VGS=4.5V , ID=6A | 2 |
| Turn-On Delay Time | Td(on) |  | 7.6 |  | ns | VDD=30V , VGS=10V , RG=3.3, ID=6A | 2 |
| Rise Time | Tr |  | 8.6 |  | ns | VDD=30V , VGS=10V , RG=3.3, ID=6A | 2 |
| Turn-Off Delay Time | Td(off) |  | 47 |  | ns | VDD=30V , VGS=10V , RG=3.3, ID=6A | 2 |
| Fall Time | Tf |  | 4 |  | ns | VDD=30V , VGS=10V , RG=3.3, ID=6A | 2 |
| Input Capacitance | Ciss |  | 2423 |  | pF | VDS=15V , VGS=0V , f=1MHz | 2 |
| Output Capacitance | Coss |  | 145 |  | pF | VDS=15V , VGS=0V , f=1MHz | 2 |
| Reverse Transfer Capacitance | Crss |  | 97 |  | pF | VDS=15V , VGS=0V , f=1MHz | 2 |
| Reverse Recovery Time | trr |  | 15 |  | nS | IF=6A , dI/dt=100A/µs , TJ=25℃ | 2 |
| Reverse Recovery Charge | Qrr |  | 10.4 |  | nC | IF=6A , dI/dt=100A/µs , TJ=25℃ | 2 |

## CAD (KiCad official)

- Symbol: `HSM6006`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `hsm6006-etched.step` / `hsm6006-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hsm6006.step` / `hsm6006.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HUASHUO datasheet](docs/hsm6006-datasheet.pdf) (6 pp, sha256 `89265638027dd15c`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hsm6006-datasheet.pdf)