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HSH3024

HUASHUO · MOSFETs · TO-263

HSH3024 from HUASHUO, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limited to ±20 V, with threshold VGS(th) of 1 V min to 2.5 V max at 250 uA.
2 D passive Drain (middle pin, also the exposed tab); VDS rating 30 V and continuous drain current 230 A at TC=25℃.
3 S passive Source; body-diode continuous current up to 230 A with VSD of 1.2 V max at IS=20A.

Key specifications

Parameter Value
Manufacturer HUASHUO
Package TO-263
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 30 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID@TC=25℃ 230 A VGS @ 10V 1
Continuous Drain Current ID@TC=100℃ 142 A VGS @ 10V 1
Pulsed Drain Current IDM 928 A 1
Single Pulse Avalanche Energy EAS 1156 mJ 1
Maximum Power Dissipation PD@TC=25℃ 144 W 1
Maximum Power Dissipation PD@TC=100℃ 57 W 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Thermal Resistance Junction-Ambient RθJA 62 ℃/W 1
Thermal Resistance Junction-Case RθJC 0.68 ℃/W 1
Drain-Source Breakdown Voltage BVDSS 30 V VGS=0V, ID=250uA 2
Static Drain-Source On-Resistance RDS(ON) 1.3 1.7 mΩ VGS=10V, ID=20A 2
Static Drain-Source On-Resistance RDS(ON) 2.1 2.8 mΩ VGS=4.5V, ID=20A 2
Gate Threshold Voltage VGS(th) 1 1.4 2.5 V VGS=VDS, ID=250uA 2
Drain-Source Leakage Current IDSS 1 uA VDS=30V, VGS=0V, TJ=25℃ 2
Drain-Source Leakage Current IDSS 100 uA VDS=30V, VGS=0V, TJ=125℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Source-Drain Current (Body Diode) ISD 230 A VG=VD=0V, Force Current 2
Diode Forward Voltage VSD 1.2 V VGS=0V, IS=20A, TJ=25℃ 2

CAD (KiCad official)

  • Symbol: HSH3024
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263 (KiCad packages3D, STEP)
  • 3D model files: hsh3024-etched.step / hsh3024-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hsh3024.step / hsh3024.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HUASHUO datasheet (6 pp, sha256 542fd85922787220, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF