# HG8551CM

**HGSEMI** · Pre-ordered Chips · SOP-8

HG8551CM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection on the SOP-8 HG8551 package. |
| 2 | INA- | input | Inverting input of the amplifier, with an input voltage range of VSS-0.5V to VDD+0.5V absolute maximum and a normal common-mode range of VSS-0.1V to VDD+0.1V. |
| 3 | INA+ | input | Non-inverting input of the amplifier, with an input voltage range of VSS-0.5V to VDD+0.5V absolute maximum and a normal common-mode range of VSS-0.1V to VDD+0.1V. |
| 4 | VSS | power_in | Negative supply (ground in single-supply operation), where VDD to VSS is rated -0.5V to 7.5V absolute maximum and dual supplies of ±1.05V to ±2.75V are supported. |
| 5 | NC | unconnected | No internal connection on the SOP-8 HG8551 package. |
| 6 | OUT | output | Rail-to-rail amplifier output with 30mA typical output current and 43mA short-circuit limit. |
| 7 | VDD | power_in | Positive supply for single-supply operation from 2.1V to 5.5V (7.5V absolute maximum), to be bypassed with a 0.1µF ceramic capacitor placed close to the pin. |
| 8 | NC | unconnected | No internal connection on the SOP-8 HG8551 package. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-8 |
| Category | Interface ICs |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power Supply Voltage (VDD to Vss) |  | -0.5 |  | 7.5 | V | VDD to Vss | 3 |
| PDB Input Voltage | PDB |  |  | 7 | V | Printed min is Vss-0.5V (not numeric) | 3 |
| Operating Temperature Range (HG855xC) |  | 0 |  | 70 | °C | HG855xC grade, applies to HG8551CM | 3 |
| Junction Temperature |  |  |  | 160 | °C |  | 3 |
| Storage Temperature Range |  | -55 |  | 150 | °C |  | 3 |
| Lead Temperature |  |  |  | 260 | °C | soldering, 10 sec | 3 |
| ESD Susceptibility HBM |  | 6 |  |  | KV | HBM | 3 |
| ESD Susceptibility MM |  | 400 |  |  | V | MM | 3 |
| Supply Voltage (single supply) |  | 2.1 |  | 5.5 | V | Single-supply operation | 1 |
| Package Thermal Resistance SOP-8 (junction to ambient) | θJA |  | 125 |  | °C/W | TA=+25℃ | 3 |
| Input Offset Voltage | VOS |  | 1 | 30 | µV | VS = +5V, VCM = +2.5V, VO = +2.5V, TA = +25℃ | 3 |
| Input Bias Current | IB |  | 20 |  | pA |  | 3 |
| Input Offset Current | IOS |  | 10 |  | pA |  | 3 |
| Common-Mode Rejection Ratio | CMRR |  | 110 |  | dB | VCM = 0V to 5V | 3 |
| Large Signal Voltage Gain | AVO |  | 145 |  | dB | RL = 10kΩ, VO = 0.3V to 4.7V | 3 |
| Input Offset Voltage Drift | ΔVOS/ΔT |  | 50 |  | nV/℃ |  | 3 |
| Output Voltage High | VOH |  | 4.998 |  | V | RL = 100kΩ to - VS | 3 |
| Output Voltage High | VOH |  | 4.994 |  | V | RL = 10kΩ to - VS | 3 |
| Output Voltage Low | VOL |  | 2 |  | mV | RL = 100kΩ to + VS | 3 |
| Output Voltage Low | VOL |  | 5 |  | mV | RL = 10kΩ to + VS | 3 |
| Short Circuit Limit | ISC |  | 43 |  | mA | RL =10Ω to - VS | 3 |
| Output Current | IO |  | 30 |  | mA |  | 3 |
| Power Supply Rejection Ratio | PSRR |  | 115 |  | dB | VS = 2.5V to 5.5V | 3 |
| Quiescent Current | IQ |  | 320 |  | µA | VO = 0V, RL = 0Ω (per amplifier) | 3 |
| Gain-Bandwidth Product | GBP |  | 1.5 |  | MHz | G = +100 | 3 |
| Slew Rate | SR |  | 0.84 |  | V/µs | RL = 10kΩ | 3 |
| Overload Recovery Time |  |  | 0.1 |  | ms |  | 3 |
| Voltage Noise (en p-p) | en p-p |  | 0.81 |  | µVP-P | 0Hz to 10Hz | 3 |
| Voltage Noise Density | en |  | 49 |  | nV/√Hz | f = 1kHz | 3 |

## CAD (KiCad official)

- Symbol: `HG8551CM`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `hg8551cm-etched.step` / `hg8551cm-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hg8551cm.step` / `hg8551cm.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HGSEMI datasheet](docs/hg8551cm-datasheet.pdf) (13 pp, sha256 `b9f0386d7c47e332`, retrieved 2026-11-04, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hg8551cm-datasheet.pdf)