component

HG8551CM

Public Made by Adom

by adom

HGSEMI Pre-ordered Chips, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentinterface icshg8551cmfactory-2.0.0extractor-text

Verified HG8551CM

by Ray · last 4 Nov 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

4 Nov 2026RayPublished by the parts factory: tier lcsc, 8 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: HG8551CM · SOP-8 · 8 pins
  • ✓copper: 8 copper pads, none touching another net
  • •datasheet (warn): 1/8 pin names appear NOWHERE in the datasheet text: ['3:INA+@p1']
  • •distributor (warn): no ['digikey', 'mouser'] number
  • ✓family: SOIC-8_3.9x4.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-oyfj5al3/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 8 pins = 8 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 8 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ hg8551cm.kicad_sym✓ hg8551cm.kicad_mod✓ hg8551cm.step
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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 5d ago
viewers hg8551cm: viewers · Ray 5d ago
hg8551cm-etched.glb Publish 0.1.0 · Ray 5d ago
hg8551cm-etched.step hg8551cm: factory component page (tier=lcsc) · Ray 5d ago
hg8551cm-hero.glb hg8551cm: hero GLB from the etched model (keeps the MPN mark) · Ray 5d ago
hg8551cm-hero.overlay.json Publish 0.1.0 · Ray 5d ago
hg8551cm.glb Publish 0.1.0 · Ray 5d ago
hg8551cm.kicad_mod Publish 0.1.0 · Ray 5d ago
hg8551cm.kicad_sym Publish 0.1.0 · Ray 5d ago
hg8551cm.lbr Publish 0.1.0 · Ray 5d ago
hg8551cm.step Publish 0.1.0 · Ray 5d ago
package.json Publish 0.1.0 · Ray 5d ago
page.json Set visibility: public · Ray 5d ago
README.md Publish 0.1.0 · Ray 5d ago
verification.json Verified: Published by the parts factory: tier lcsc, 8 pins · Ray 5d ago

HG8551CM

HGSEMI · Pre-ordered Chips · SOP-8

HG8551CM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No internal connection on the SOP-8 HG8551 package.
2 INA- input Inverting input of the amplifier, with an input voltage range of VSS-0.5V to VDD+0.5V absolute maximum and a normal common-mode range of VSS-0.1V to VDD+0.1V.
3 INA+ input Non-inverting input of the amplifier, with an input voltage range of VSS-0.5V to VDD+0.5V absolute maximum and a normal common-mode range of VSS-0.1V to VDD+0.1V.
4 VSS power_in Negative supply (ground in single-supply operation), where VDD to VSS is rated -0.5V to 7.5V absolute maximum and dual supplies of ±1.05V to ±2.75V are supported.
5 NC unconnected No internal connection on the SOP-8 HG8551 package.
6 OUT output Rail-to-rail amplifier output with 30mA typical output current and 43mA short-circuit limit.
7 VDD power_in Positive supply for single-supply operation from 2.1V to 5.5V (7.5V absolute maximum), to be bypassed with a 0.1µF ceramic capacitor placed close to the pin.
8 NC unconnected No internal connection on the SOP-8 HG8551 package.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power Supply Voltage (VDD to Vss) -0.5 7.5 V VDD to Vss 3
PDB Input Voltage PDB 7 V Printed min is Vss-0.5V (not numeric) 3
Operating Temperature Range (HG855xC) 0 70 °C HG855xC grade, applies to HG8551CM 3
Junction Temperature 160 °C 3
Storage Temperature Range -55 150 °C 3
Lead Temperature 260 °C soldering, 10 sec 3
ESD Susceptibility HBM 6 KV HBM 3
ESD Susceptibility MM 400 V MM 3
Supply Voltage (single supply) 2.1 5.5 V Single-supply operation 1
Package Thermal Resistance SOP-8 (junction to ambient) θJA 125 °C/W TA=+25℃ 3
Input Offset Voltage VOS 1 30 µV VS = +5V, VCM = +2.5V, VO = +2.5V, TA = +25℃ 3
Input Bias Current IB 20 pA 3
Input Offset Current IOS 10 pA 3
Common-Mode Rejection Ratio CMRR 110 dB VCM = 0V to 5V 3
Large Signal Voltage Gain AVO 145 dB RL = 10kΩ, VO = 0.3V to 4.7V 3
Input Offset Voltage Drift ΔVOS/ΔT 50 nV/℃ 3
Output Voltage High VOH 4.998 V RL = 100kΩ to - VS 3
Output Voltage High VOH 4.994 V RL = 10kΩ to - VS 3
Output Voltage Low VOL 2 mV RL = 100kΩ to + VS 3
Output Voltage Low VOL 5 mV RL = 10kΩ to + VS 3
Short Circuit Limit ISC 43 mA RL =10Ω to - VS 3
Output Current IO 30 mA 3
Power Supply Rejection Ratio PSRR 115 dB VS = 2.5V to 5.5V 3
Quiescent Current IQ 320 µA VO = 0V, RL = 0Ω (per amplifier) 3
Gain-Bandwidth Product GBP 1.5 MHz G = +100 3
Slew Rate SR 0.84 V/µs RL = 10kΩ 3
Overload Recovery Time 0.1 ms 3
Voltage Noise (en p-p) en p-p 0.81 µVP-P 0Hz to 10Hz 3
Voltage Noise Density en 49 nV/√Hz f = 1kHz 3

CAD (KiCad official)

  • Symbol: HG8551CM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hg8551cm-etched.step / hg8551cm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg8551cm.step / hg8551cm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (13 pp, sha256 b9f0386d7c47e332, retrieved 2026-11-04, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF