component
HG810SM3
Public Made by Adomby adom
HGSEMI Monitors & Reset Circuits, SOT-23-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
HG810SM3
HGSEMI · Monitors & Reset Circuits · SOT-23-3
HG810SM3 from HGSEMI, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Chip ground terminal. |
| 2 | RESET | output | Reset output of the chip; rated -0.3 V to VCC+0.3 V, with VOL max 0.3 V at 1.2 mA sink and VOH min 0.8*VCC at 150 uA source. |
| 3 | VCC | power_in | Chip supply input; operating range 1.0 V to 6.0 V, absolute maximum 6.5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOT-23-3 |
| Category | Power Management ICs |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating voltage | VCC | 1 | 6 | V | Ta=25℃ | 3 | |
| Quiescent current | ICC | 2 | 5 | uA | VCC=5.5V, No Load | 3 | |
| Power-on reset time | Trp | 85 | 500 | 900 | ms | HG810 Z/R/S/T, VCC=0 to 3.5V, VRESET = H to L, No Load | 3 |
| Reset output low voltage | VOL | 0.3 | V | VCC = Vthmax, ISINK=1.2mA | 3 | ||
| Reset output high voltage | VOH | 0.8 | V | 1.8V<VCC<Vthmin, ISOURCE=150uA; min is 0.8VCC | 3 | ||
| Reset rising edge time | Trd | 90 | ns | VCC=Vth to (Vth－100mV) | 3 | ||
| Temperature coefficient | ΔVth/(Vth*ΔTa) | 200 | ppm/℃ | -20℃≤Ta≤60℃, printed ±200 | 3 | ||
| Input voltage | VCC | 6.5 | V | 3 | |||
| Reset output voltage | VRESET | -0.3 | V | -0.3 to VCC+0.3 V | 3 | ||
| Power dissipation | PD | 200 | mW | SOT-23 | 3 | ||
| Operating temperature range | Tw | -20 | 60 | ℃ | 3 | ||
| Storage temperature range | Tc | -50 | 125 | ℃ | 3 | ||
| Soldering temperature | Th | 260 | ℃ | 10s | 3 |
CAD (KiCad official)
- Symbol:
HG810SM3 - Footprint:
Package_TO_SOT_SMD:SOT-23-3 - 3D model: SOT-23-3 (KiCad packages3D, STEP)
- 3D model files:
hg810sm3-etched.step/hg810sm3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hg810sm3.step/hg810sm3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (6 pp, sha256
617dd8734b6693f4, retrieved 2026-10-22, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HG810SM3
**HGSEMI** · Monitors & Reset Circuits · SOT-23-3
HG810SM3 from HGSEMI, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Chip ground terminal. |
| 2 | RESET | output | Reset output of the chip; rated -0.3 V to VCC+0.3 V, with VOL max 0.3 V at 1.2 mA sink and VOH min 0.8*VCC at 150 uA source. |
| 3 | VCC | power_in | Chip supply input; operating range 1.0 V to 6.0 V, absolute maximum 6.5 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOT-23-3 |
| Category | Power Management ICs |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating voltage | VCC | 1 | | 6 | V | Ta=25℃ | 3 |
| Quiescent current | ICC | | 2 | 5 | uA | VCC=5.5V, No Load | 3 |
| Power-on reset time | Trp | 85 | 500 | 900 | ms | HG810 Z/R/S/T, VCC=0 to 3.5V, VRESET = H to L, No Load | 3 |
| Reset output low voltage | VOL | | | 0.3 | V | VCC = Vthmax, ISINK=1.2mA | 3 |
| Reset output high voltage | VOH | 0.8 | | | V | 1.8V<VCC<Vthmin, ISOURCE=150uA; min is 0.8VCC | 3 |
| Reset rising edge time | Trd | | 90 | | ns | VCC=Vth to (Vth－100mV) | 3 |
| Temperature coefficient | ΔVth/(Vth*ΔTa) | | 200 | | ppm/℃ | -20℃≤Ta≤60℃, printed ±200 | 3 |
| Input voltage | VCC | | | 6.5 | V | | 3 |
| Reset output voltage | VRESET | -0.3 | | | V | -0.3 to VCC+0.3 V | 3 |
| Power dissipation | PD | | | 200 | mW | SOT-23 | 3 |
| Operating temperature range | Tw | -20 | | 60 | ℃ | | 3 |
| Storage temperature range | Tc | -50 | | 125 | ℃ | | 3 |
| Soldering temperature | Th | | | 260 | ℃ | 10s | 3 |
## CAD (KiCad official)
- Symbol: `HG810SM3`
- Footprint: `Package_TO_SOT_SMD:SOT-23-3`
- 3D model: SOT-23-3 (KiCad packages3D, STEP)
- 3D model files: `hg810sm3-etched.step` / `hg810sm3-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hg810sm3.step` / `hg810sm3.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HGSEMI datasheet](docs/hg810sm3-datasheet.pdf) (6 pp, sha256 `617dd8734b6693f4`, retrieved 2026-10-22, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hg810sm3-datasheet.pdf)