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HG810SM3

Public Made by Adom

by adom

HGSEMI Monitors & Reset Circuits, SOT-23-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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HG810SM3

HGSEMI · Monitors & Reset Circuits · SOT-23-3

HG810SM3 from HGSEMI, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Chip ground terminal.
2 RESET output Reset output of the chip; rated -0.3 V to VCC+0.3 V, with VOL max 0.3 V at 1.2 mA sink and VOH min 0.8*VCC at 150 uA source.
3 VCC power_in Chip supply input; operating range 1.0 V to 6.0 V, absolute maximum 6.5 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOT-23-3
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating voltage VCC 1 6 V Ta=25℃ 3
Quiescent current ICC 2 5 uA VCC=5.5V, No Load 3
Power-on reset time Trp 85 500 900 ms HG810 Z/R/S/T, VCC=0 to 3.5V, VRESET = H to L, No Load 3
Reset output low voltage VOL 0.3 V VCC = Vthmax, ISINK=1.2mA 3
Reset output high voltage VOH 0.8 V 1.8V<VCC<Vthmin, ISOURCE=150uA; min is 0.8VCC 3
Reset rising edge time Trd 90 ns VCC=Vth to (Vth－100mV) 3
Temperature coefficient ΔVth/(Vth*ΔTa) 200 ppm/℃ -20℃≤Ta≤60℃, printed ±200 3
Input voltage VCC 6.5 V 3
Reset output voltage VRESET -0.3 V -0.3 to VCC+0.3 V 3
Power dissipation PD 200 mW SOT-23 3
Operating temperature range Tw -20 60 ℃ 3
Storage temperature range Tc -50 125 ℃ 3
Soldering temperature Th 260 ℃ 10s 3

CAD (KiCad official)

  • Symbol: HG810SM3
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: hg810sm3-etched.step / hg810sm3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg810sm3.step / hg810sm3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (6 pp, sha256 617dd8734b6693f4, retrieved 2026-10-22, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF