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HG25Q32BM

Public Made by Adom

by adom

HGSEMI NOR FLASH, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Generated by kicad-footprint-generator · KiCad file format 20260206
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HG25Q32BM

HGSEMI · NOR FLASH · SOP-8

HG25Q32BM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS# input Chip Enable: high deselects the device and puts the outputs in high impedance with standby power, low selects it; must transition high to low after power-up before a new instruction is accepted.
2 DO(IO1) bidirectional Serial Data Output in standard SPI, shifted out on the falling edge of CLK, and becomes IO1 (input/output) during Dual and Quad commands.
3 WP#(IO2) bidirectional Write Protect input that prevents the Status Register from being written in standard/dual SPI, and becomes IO2 when Quad mode is enabled (QE=1).
4 GND power_in Ground.
5 DI(IO0) bidirectional Serial Data Input that receives instructions, addresses and data latched on the rising edge of CLK, and becomes IO0 (input/output) during Dual and Quad commands.
6 CLK input Serial Clock Input that provides the timing for serial input and output operations.
7 HOLD#/RESET#(IO3) bidirectional HOLD# pauses the device while selected (HRSW=0) or RESET# resets it when held low for about 1us minimum (HRSW=1), and becomes IO3 when Quad mode is enabled (QE=1).
8 VCC power_in Power supply, 2.3-3.6V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Memory
Pins 8

CAD (KiCad official)

  • Symbol: HG25Q32BM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hg25q32bm-etched.step / hg25q32bm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg25q32bm.step / hg25q32bm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (75 pp, sha256 3ce45d646e4b7e90, retrieved 2026-10-09, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF