# HG24LC256M

**HGSEMI** · EEPROM · SOP-8

HG24LC256M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A0 | input | Device address input, hardwired to select the device or left unconnected; if left floating it is internally pulled down to GND when coupling to the VCC plane is below 3 pF, and the datasheet recommends connecting it to GND when coupling exceeds 3 pF. |
| 2 | A1 | input | Device address input, hardwired to select the device or left unconnected; if left floating it is internally pulled down to GND when coupling to the VCC plane is below 3 pF, and the datasheet recommends connecting it to GND when coupling exceeds 3 pF. |
| 3 | NC | unconnected | No connect pin. |
| 4 | GND | power_in | Ground reference for the device. |
| 5 | SDA | bidirectional | Bidirectional serial data pin for the two-wire interface, open-drain driven and may be wire-ORed with other open-drain or open-collector devices; it is normally pulled high by an external resistor and data may change only while SCL is low. |
| 6 | SCL | input | Serial clock input: data is clocked into the EEPROM on the positive edge and clocked out on the negative edge of SCL. |
| 7 | WP | input | Write protect input: connecting WP to GND allows normal write operations, while connecting WP to VCC inhibits all write operations to the memory; if left floating it is internally pulled down to GND when coupling is below 3 pF, and the datasheet recommends connecting it to GND when coupling exceeds 3 pF. |
| 8 | VCC | power_in | Power supply, specified from 1.8 V to 5.5 V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-8 |
| Category | Memory |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage (absolute maximum) | VCC |  |  | 6.5 | V |  | 8 |
| Operating Ambient Temperature (absolute maximum table) | Tamb | -40 |  | 85 | °C |  | 8 |
| Storage Temperature | Tstg | -55 |  | 125 | °C |  | 8 |
| Supply Voltage | VCC1 | 1.8 |  | 5.5 | V | TA = -40°C to +85°C | 9 |
| Supply Voltage | VCC2 | 2.5 |  | 5.5 | V | TA = -40°C to +85°C | 9 |
| Supply Voltage | VCC3 | 2.7 |  | 5.5 | V | TA = -40°C to +85°C | 9 |
| Supply Voltage | VCC4 | 4.5 |  | 5.5 | V | TA = -40°C to +85°C | 9 |
| Supply Current READ | ICC1 |  | 0.4 | 1 | mA | VCC=5.0V, READ at 400 kHz | 9 |
| Supply Current WRITE | ICC2 |  | 2 | 3 | mA | VCC=5.0V, WRITE at 400 kHz | 9 |
| Standby Supply Current | ISB1 | -0.6 |  | 1 | mA | VCC=1.8V, VIN=VCC or VSS | 9 |
| Standby Supply Current | ISB2 | -1 |  | 2 | mA | VCC=2.5V, VIN=VCC or VSS | 9 |
| Standby Supply Current | ISB4 | -1 |  | 3 | mA | VCC=5.0V, VIN=VCC or VSS | 9 |
| Input Leakage Current | ILI |  | 0.1 | 3 | µA | VIN=VCC or VSS | 9 |
| Output Leakage Current | ILO |  | 0.05 | 3 | µA | VIN=VCC or VSS | 9 |
| Input Low Level | VIL | -0.6 |  |  | V |  | 9 |
| Output Low Level | VOL3 |  |  | 0.4 | V | VCC=5.0V | 9 |
| Output Low Level | VOL1 |  |  | 0.2 | V | VCC=1.8V | 9 |
| Input/Output Capacitance (SDA) | CI/O |  |  | 8 | pF | VI/O=0V | 9 |
| Input Capacitance (A0,A1,A2,SCL) | CIN |  |  | 8 | pF | VIN=0V | 9 |
| Clock Frequency, SCL | fSCL |  |  | 400 | kHz | CL=1TTL Gate and 100pF; 1.8, 2.7, 5.0-volt | 9 |
| Clock Pulse Width Low | tLOW | 1.2 |  |  | µs | CL=1TTL Gate and 100pF; 1.8, 2.7, 5.0-volt | 9 |
| Clock Pulse Width High | tHIGH | 0.6 |  |  | µs | CL=1TTL Gate and 100pF; 1.8, 2.7, 5.0-volt | 9 |
| Noise Suppression Time | tI |  |  | 50 | ns | CL=1TTL Gate and 100pF; 1.8, 2.7, 5.0-volt | 9 |
| Clock Low to Data Out Valid | tAA | 0.1 |  | 0.9 | µs | CL=1TTL Gate and 100pF; 1.8, 2.7, 5.0-volt | 9 |
| Time the bus must be free before a new transmission can start | tBUF | 1.2 |  |  | µs |  | 10 |
| Start Hold Time | tHD.STA | 0.6 |  |  | µs |  | 10 |
| Start Setup Time | tSU.STA | 0.6 |  |  | µs |  | 10 |
| Data In Hold Time | tHD.DAT | 0 |  |  | µs |  | 10 |
| Data In Setup Time | tSU.DAT | 100 |  |  | ns |  | 10 |
| Inputs Rise Time | tR |  |  | 0.3 | µs |  | 10 |
| Inputs Fall Time | tF |  |  | 300 | ns |  | 10 |
| Stop Setup Time | tSU.STO | 0.6 |  |  | µs |  | 10 |
| Data Out Hold Time | tDH | 50 |  |  | ns |  | 10 |
| Write Cycle Time | tWR |  |  | 5 | ms |  | 10 |

## CAD (KiCad official)

- Symbol: `HG24LC256M`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `hg24lc256m-etched.step` / `hg24lc256m-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hg24lc256m.step` / `hg24lc256m.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HGSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590284147886354432) (13 pp, sha256 `c98d13c89d66e78f`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hg24lc256m-datasheet.pdf)