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HG24LC256M

Public Made by Adom

by adom

HGSEMI EEPROM, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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HG24LC256M

HGSEMI · EEPROM · SOP-8

HG24LC256M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Device address input, hardwired to select the device or left unconnected; if left floating it is internally pulled down to GND when coupling to the VCC plane is below 3 pF, and the datasheet recommends connecting it to GND when coupling exceeds 3 pF.
2 A1 input Device address input, hardwired to select the device or left unconnected; if left floating it is internally pulled down to GND when coupling to the VCC plane is below 3 pF, and the datasheet recommends connecting it to GND when coupling exceeds 3 pF.
3 NC unconnected No connect pin.
4 GND power_in Ground reference for the device.
5 SDA bidirectional Bidirectional serial data pin for the two-wire interface, open-drain driven and may be wire-ORed with other open-drain or open-collector devices; it is normally pulled high by an external resistor and data may change only while SCL is low.
6 SCL input Serial clock input: data is clocked into the EEPROM on the positive edge and clocked out on the negative edge of SCL.
7 WP input Write protect input: connecting WP to GND allows normal write operations, while connecting WP to VCC inhibits all write operations to the memory; if left floating it is internally pulled down to GND when coupling is below 3 pF, and the datasheet recommends connecting it to GND when coupling exceeds 3 pF.
8 VCC power_in Power supply, specified from 1.8 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (absolute maximum) VCC 6.5 V 8
Operating Ambient Temperature (absolute maximum table) Tamb -40 85 °C 8
Storage Temperature Tstg -55 125 °C 8
Supply Voltage VCC1 1.8 5.5 V TA = -40°C to +85°C 9
Supply Voltage VCC2 2.5 5.5 V TA = -40°C to +85°C 9
Supply Voltage VCC3 2.7 5.5 V TA = -40°C to +85°C 9
Supply Voltage VCC4 4.5 5.5 V TA = -40°C to +85°C 9
Supply Current READ ICC1 0.4 1 mA VCC=5.0V, READ at 400 kHz 9
Supply Current WRITE ICC2 2 3 mA VCC=5.0V, WRITE at 400 kHz 9
Standby Supply Current ISB1 -0.6 1 mA VCC=1.8V, VIN=VCC or VSS 9
Standby Supply Current ISB2 -1 2 mA VCC=2.5V, VIN=VCC or VSS 9
Standby Supply Current ISB4 -1 3 mA VCC=5.0V, VIN=VCC or VSS 9
Input Leakage Current ILI 0.1 3 µA VIN=VCC or VSS 9
Output Leakage Current ILO 0.05 3 µA VIN=VCC or VSS 9
Input Low Level VIL -0.6 V 9
Output Low Level VOL3 0.4 V VCC=5.0V 9
Output Low Level VOL1 0.2 V VCC=1.8V 9
Input/Output Capacitance (SDA) CI/O 8 pF VI/O=0V 9
Input Capacitance (A0,A1,A2,SCL) CIN 8 pF VIN=0V 9
Clock Frequency, SCL fSCL 400 kHz CL=1TTL Gate and 100pF; 1.8, 2.7, 5.0-volt 9
Clock Pulse Width Low tLOW 1.2 µs CL=1TTL Gate and 100pF; 1.8, 2.7, 5.0-volt 9
Clock Pulse Width High tHIGH 0.6 µs CL=1TTL Gate and 100pF; 1.8, 2.7, 5.0-volt 9
Noise Suppression Time tI 50 ns CL=1TTL Gate and 100pF; 1.8, 2.7, 5.0-volt 9
Clock Low to Data Out Valid tAA 0.1 0.9 µs CL=1TTL Gate and 100pF; 1.8, 2.7, 5.0-volt 9
Time the bus must be free before a new transmission can start tBUF 1.2 µs 10
Start Hold Time tHD.STA 0.6 µs 10
Start Setup Time tSU.STA 0.6 µs 10
Data In Hold Time tHD.DAT 0 µs 10
Data In Setup Time tSU.DAT 100 ns 10
Inputs Rise Time tR 0.3 µs 10
Inputs Fall Time tF 300 ns 10
Stop Setup Time tSU.STO 0.6 µs 10
Data Out Hold Time tDH 50 ns 10
Write Cycle Time tWR 5 ms 10

CAD (KiCad official)

  • Symbol: HG24LC256M
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hg24lc256m-etched.step / hg24lc256m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg24lc256m.step / hg24lc256m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (13 pp, sha256 c98d13c89d66e78f, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF