component

HG1302ZN

Public Made by Adom

by adom

HGSEMI Real Time Clocks, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentclock-timinghg1302znfactory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 4h ago
viewers hg1302zn: viewers · Ray 4h ago
hg1302zn-etched.glb Publish 0.1.0 · Ray 4h ago
hg1302zn-etched.step hg1302zn: factory component page (tier=lcsc) · Ray 4h ago
hg1302zn-hero.glb hg1302zn: hero GLB from the etched model (keeps the MPN mark) · Ray 4h ago
hg1302zn-hero.overlay.json Publish 0.1.0 · Ray 4h ago
hg1302zn.glb Publish 0.1.0 · Ray 4h ago
hg1302zn.kicad_mod Publish 0.1.0 · Ray 4h ago
hg1302zn.kicad_sym Publish 0.1.0 · Ray 4h ago
hg1302zn.lbr Publish 0.1.0 · Ray 4h ago
hg1302zn.step Publish 0.1.0 · Ray 4h ago
package.json Publish 0.1.0 · Ray 4h ago
page.json Set visibility: public · Ray 4h ago
README.md Publish 0.1.0 · Ray 4h ago

HG1302ZN

HGSEMI · Real Time Clocks · DIP-8

HG1302ZN from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC2 power_in Main supply pin, rated 2.0 V to 5.5 V; the device is powered from VCC2 when VCC2 is more than 0.2 V above VCC1.
2 X1 passive Connects directly to one terminal of a 32.768 kHz crystal, and the selected crystal's specified load capacitance should be 6 pF.
3 X2 passive Connects directly to the other terminal of the 32.768 kHz crystal, and the selected crystal's specified load capacitance should be 6 pF.
4 GND power_in Ground reference pin for the device.
5 RST input Driving RST high enables and starts all data transfers, and driving it low aborts them and tri-states I/O; RST must be logic 0 before VCC reaches 2.5 V at power-up, and SCLK must be logic 0 when RST is driven high.
6 I/O bidirectional Serial data input/output: data is latched on SCLK rising edges during writes and driven on SCLK falling edges during reads, and the pin is high impedance when RST is low.
7 SCLK input Serial clock input that synchronizes command and data shifting on I/O; it must be logic 0 when RST is driven to logic 1.
8 VCC1 power_in Backup supply pin, rated 2.0 V to 5.5 V, that powers the device when VCC2 is not higher than VCC1 by more than 0.2 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-8
Category Clock/Timing
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
引脚对地电压 VP -0.5 7 V 3
工作温度 (HG1302Z / ZN package) TA -40 85 ℃ HG1302Z variant 3
贮存温度 TS -55 125 ℃ 3
焊接温度 TH 260 ℃ 10 秒 3
供给电源电压 VCC1, VCC2 2 5.5 V TA=0℃～70℃ 3
逻辑1输入电压 VIH 2 V TA=0℃～70℃ 3
逻辑0输入电压 VIL -0.3 0.3 V VCC=2.0V 3
逻辑0输入电压 VIL -0.3 0.8 V VCC=5V 3
输入电容 CI 10 pF TA=25℃ 3
I/O电容 CI/O 15 pF TA=25℃ 3
晶体振荡器电容 CX 6 pF TA=25℃ 3
输入电流 ILI 500 μA 0℃至70℃；VCC=2.5V至5.5V 3
I/O 漏电流 ILO 500 μA 0℃至70℃；VCC=2.5V至5.5V 3
逻辑1输出电压 VOH 1.6 V VCC=2.5V 3
逻辑1输出电压 VOH 2.4 V VCC=5V 3
逻辑0输出电压 VOL 0.4 V VCC=2.5V 3
供电电流 ICC1A 0.4 mA VCC1=2.5V 3
供电电流 ICC1A 1.2 mA VCC1=5V 3
时间保持电流 ICC1T 0.3 μA VCC1=2.5V 3
时间保持电流 ICC1T 1 μA VCC1=5V 3
静态电流 ICC1S 100 nA VCC1=2.5V 3
供电电流 ICC2A 0.425 mA VCC2=2.5V 4
供电电流 ICC2A 1.28 mA VCC2=5V 4
时间保持电流 ICC2T 25.3 μA VCC2=2.5V 4
时间保持电流 ICC2T 81 μA VCC2=5V 4
静态电流 ICC2S 25 μA VCC2=2.5V 4
静态电流 ICC2S 80 μA VCC2=5V 4
涓流充电二极管压降 VTD 0.7 V 4
CLK到RST保持 tcch 240 ns VCC=2.5V; TA=0℃至70℃ 4
CLK到RST保持 tcch 60 ns VCC=5V; TA=0℃至70℃ 4
RST无效 tcwh 4 ns VCC=2.5V; TA=0℃至70℃ 4
RST无效 tcwh 1 ns VCC=5V; TA=0℃至70℃ 4
RST到I/O高阻 tcdz 280 ns VCC=2.5V; TA=0℃至70℃ 4
RST到I/O高阻 tcdz 70 ns VCC=5V; TA=0℃至70℃ 4
SCLK到I/O高阻 tccz 280 ns VCC=2.5V; TA=0℃至70℃ 4
SCLK到I/O高阻 tccz 70 ns VCC=5V; TA=0℃至70℃ 4
Data到CLK建立 tdc 200 ns VCC=2.5V; TA=0℃至70℃ 4
Data到CLK建立 tdc 50 ns VCC=5V; TA=0℃至70℃ 4
CLK到Data保持 tcdh 280 ns VCC=2.5V; TA=0℃至70℃ 4
CLK到Data保持 tcdh 70 ns VCC=5V; TA=0℃至70℃ 4
CLK到Data延时 tcdd 800 ns VCC=2.5V; TA=0℃至70℃ 4
CLK到Data延时 tcdd 200 ns VCC=5V; TA=0℃至70℃ 4
CLK低 tcl 1000 ns VCC=2.5V; TA=0℃至70℃ 4
CLK低 tcl 250 ns VCC=5V; TA=0℃至70℃ 4
CLK高 tch 1000 ns VCC=2.5V; TA=0℃至70℃ 4
CLK高 tch 250 ns VCC=5V; TA=0℃至70℃ 4
CLK频率 tclk 0.5 MHz VCC=2.5V; TA=0℃至70℃ 4
CLK频率 tclk 2 MHz VCC=5V; TA=0℃至70℃ 4
CLK上升和下降时间 tr, tf 2000 ns VCC=2.5V; TA=0℃至70℃ 4
CLK上升和下降时间 tr, tf 500 ns VCC=5V; TA=0℃至70℃ 4
RST到CLK建立 tCC 4 µs VCC=2.5V; TA=0℃至70℃ 4
RST到CLK建立 tCC 1 µs VCC=5V; TA=0℃至70℃ 4

CAD (KiCad official)

  • Symbol: HG1302ZN
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: hg1302zn-etched.step / hg1302zn-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hg1302zn.step / hg1302zn.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (14 pp, sha256 313dc8a655711ee6, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF