component
HESDNC7
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HXY MOSFET ESD And Surge Protection (TVS/ESD), SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 16d ago |
| viewers | 16d ago |
| hesdnc7-etched.glb | 16d ago |
| hesdnc7-etched.step | 16d ago |
| hesdnc7-hero.glb | 16d ago |
| hesdnc7-hero.overlay.json | 16d ago |
| hesdnc7.glb | 16d ago |
| hesdnc7.kicad_mod | 16d ago |
| hesdnc7.kicad_sym | 16d ago |
| hesdnc7.lbr | 16d ago |
| hesdnc7.step | 16d ago |
| package.json | 16d ago |
| page.json | 16d ago |
| README.md | 16d ago |
HESDNC7
HXY MOSFET · ESD And Surge Protection (TVS/ESD) · SOT-23
HESDNC7 from HXY MOSFET, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One terminal of the bidirectional ESD protection diode pair (tied with pin 2 in all electrical characteristics); clamping voltage is max 12 V at IPP = 10 A (8x20 µs) from pin 1/2 to pin 3, and junction capacitance is max 15 pF at 0 V, 1 MHz. |
| 2 | 2 | passive | The second terminal of the bidirectional ESD protection diode pair (tied with pin 1 in all electrical characteristics); clamping voltage is max 12 V at IPP = 10 A (8x20 µs) from pin 1/2 to pin 3, and junction capacitance is max 15 pF at 0 V, 1 MHz. |
| 3 | 3 | passive | Common terminal of the bidirectional protection pair, opposite pins 1 and 2; clamping voltage from pin 3 to pin 1/2 is max 20 V at IPP = 10 A (8x20 µs), and junction capacitance is max 15 pF. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SOT-23 |
| Category | Circuit Protection |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Pulse Power | PPP | 200 | W | tp = 8/20μs | 1 | ||
| Maximum lead temperature for soldering | TL | 260 | °C | during 10s | 1 | ||
| Storage Temperature Range | Tstg | -55 | 150 | °C | 1 | ||
| Operating Temperature Range | Top | -55 | 125 | °C | 1 | ||
| Maximum junction temperature | Tj | 150 | °C | 1 | |||
| IEC61000-4-2 ESD air discharge | -30 | 30 | KV | IEC61000-4-2 (ESD) air discharge | 1 | ||
| IEC61000-4-2 ESD contact discharge | -30 | 30 | KV | IEC61000-4-2 (ESD) contact discharge | 1 | ||
| IEC61000-4-4 EFT | 15 | A | IEC61000-4-4 (EFT) | 1 | |||
| Reverse stand-off voltage (Pin 1、2 to Pin 3) | VRWM | 7 | V | Pin 1、2 to Pin 3 | 2 | ||
| Reverse stand-off voltage (Pin 3 to Pin 1、2) | VRWM | 12 | V | Pin 3 to Pin 1、2 | 2 | ||
| Reverse breakdown voltage (Pin 1、2 to Pin 3) | VBR | 7.5 | V | IT = 1 mA, Pin 1、2 to Pin 3 | 2 | ||
| Reverse breakdown voltage (Pin 3 to Pin 1、2) | VBR | 13.3 | V | IT = 1 mA, Pin 3 to Pin 1、2 | 2 | ||
| Reverse leakage current (Pin 1、2 to Pin 3) | IR | 200 | nA | VR = VRWM, Pin 1、2 to Pin 3 | 2 | ||
| Reverse leakage current (Pin 3 to Pin 1、2) | IR | 100 | nA | VR = VRWM, Pin 3 to Pin 1、2 | 2 | ||
| Clamping voltage (Pin 1、2 to Pin 3) | VC | 12 | V | IPP = 10A (8 x 20µs pulse), Pin 1、2 to Pin 3 | 2 | ||
| Clamping voltage (Pin 3 to Pin 1、2) | VC | 20 | V | IPP = 10A (8 x 20µs pulse), Pin 3 to Pin 1 、2 | 2 | ||
| Junction capacitance (Pin 1、2 to Pin 3) | CJ | 15 | pF | VR = 0V, f = 1MHz, Pin 1、2 to Pin 3 | 2 | ||
| Junction capacitance (Pin 3 to Pin 1、2) | CJ | 15 | pF | VR = 0V, f = 1MHz, Pin 3 to Pin 1、2 | 2 |
CAD (KiCad official)
- Symbol:
HESDNC7 - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
hesdnc7-etched.step/hesdnc7-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hesdnc7.step/hesdnc7.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (5 pp, sha256
2c98ae0743fbf0c1, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).