# HESD9B3.3ST5G

**HXY MOSFET** · ESD And Surge Protection (TVS/ESD) · DFN1006-2L

HESD9B3.3ST5G from HXY MOSFET, in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One terminal of the bidirectional ESD protection diode that protects a single signal line; the datasheet gives no separate function or polarity for this terminal. |
| 2 | 2 | passive | The other terminal of the bidirectional ESD protection diode that protects a single signal line; the datasheet gives no separate function or polarity for this terminal. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | DFN1006-2L |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Pulse Power (tp = 8/20μs) | PPPM |  |  | 84 | W | tp = 8/20μs | 2 |
| Maximum lead temperature for soldering | TL |  |  | 260 | °C | 10s | 2 |
| Storage Temperature Range | Tstg | -55 |  | 150 | °C |  | 2 |
| Operating Temperature Range | TOP | -55 |  | 150 | °C |  | 2 |
| Maximum junction temperature | Tj |  |  | 150 | °C |  | 2 |
| ESD voltage (air discharge) | VESD |  |  | 15 | kV | IEC 61000-4-2 (air discharge) | 2 |
| ESD voltage (contact discharge) | VESD |  |  | 8 | kV | IEC 61000-4-2 (contact discharge) | 2 |
| Reverse Working Voltage | VRWM |  |  | 3.3 | V |  | 2 |
| Leakage Current | IR |  |  | 1 | uA | VRWM=7.0V | 2 |
| Clamping Voltage | VC |  |  | 8 | V | IPP=1A,Tp=8/20μs | 2 |
| Junction Capacitance | CJ |  | 10 | 15 | pF | VR=0V, f=1MHz | 2 |

## CAD (KiCad official)

- Symbol: `HESD9B3.3ST5G`
- Footprint: `Diode_SMD:D_SOD-882`
- 3D model: DFN1006-2L (KiCad packages3D, STEP)
- 3D model files: `hesd9b3-3st5g-etched.step` / `hesd9b3-3st5g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hesd9b3-3st5g.step` / `hesd9b3-3st5g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HXY MOSFET datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8604440458160586752) (5 pp, sha256 `967ee562ef90f40a`, retrieved 2026-10-16, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hesd9b3-3st5g-datasheet.pdf)