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Ray Publish 0.1.0 928fee0 16d ago

HD568N

Broadic · RS-485 / RS-422 ICs · SOP-8

HD568N from Broadic, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output, valid when RE is low: after polarity detection, RO goes high when V(A)-V(B) > 100 mV and low when V(A)-V(B) < -100 mV.
2 RE input Receiver output enable, active low: RE low enables RO, RE high disables the receiver, and RE high with DE low puts the whole chip into shutdown.
3 DE input Driver output enable: DE high enables the driver, while DE low disables it and puts its outputs in high-impedance; DE low with RE high puts the chip in shutdown.
4 DI input Driver input: DI low forces the non-inverting output low and the inverting output high, and DI high forces the non-inverting output high and the inverting output low.
5 GND power_in Ground reference for all voltages on the device.
6 X1 bidirectional Bus interface pin that is assigned as the A or B port by the polarity detection (X1 and X2 are one A and one B); it powers up defaulting to the A port, with absolute maximum -8 V to +13 V and common-mode range -7 V to +12 V at VCC = 5 V.
7 X2 bidirectional Bus interface pin that is assigned as the B or A port by the polarity detection (opposite of X1); it powers up defaulting to the B port, with absolute maximum -8 V to +13 V and common-mode range -7 V to +12 V at VCC = 5 V.
8 VCC power_in Positive supply, 3.3 V to 5 V (absolute maximum +6 V), to be bypassed to GND with a 0.1 µF capacitor.

Key specifications

Parameter Value
Manufacturer Broadic
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage 6 V All voltages referenced to GND 2
Input voltage DE, RE, DI -0.3 6 V All voltages referenced to GND 2
Bus voltage X1, X2 -8 13 V All voltages referenced to GND 2
Power dissipation, 8-pin SO 471 mW 8-pin SO; derate -5.9 mW/°C above +70°C 2
Junction temperature 150 °C 2
Storage temperature range -65 150 °C 2
Soldering temperature 300 C 10 s 2
Operating temperature range -40 125 °C 2
Supply voltage (3.3 to 5 V operation) 3.3 5 V Product features: 3.3-5V supply voltage 2
Common-mode voltage X1, X2 -7 12 V VCC=5V 2
Common-mode voltage X1, X2 -7 9 V VCC=3.3V 2
Receiver differential input threshold voltage VTH -100 100 mV -7V≤VCM≤+12V 3
Output leakage current, receiver high-impedance IOZR -1 1 µA 0.4V≤VO≤2.4V 4
Input current (X1 and X2) shutdown/power-down ISHDN 1.8 10 µA DE GND RE Vcc 4
Driver output short-circuit current IOD1 -25 25 mA 0V≤VOUT≤VCC 3
Receiver output short-circuit current IOSR -95 95 mA 0V≤VRO≤VCC 4
Static supply current ICC 480 600 µA No load, RE DI GND or Vcc, DE=VCC 4
Static supply current ICC 420 600 µA No load, RE DI GND or Vcc, DE=GND 4
Electrostatic protection X1, X2 pins, contact discharge -12 12 kV IEC 61000-4-2 4
Electrostatic protection X1, X2 pins, human body model -16 16 kV IEC 60749-26 4
Electrostatic protection X1, X2 pins, fast transient burst -4 4 kV IEC61000-4-4 4
Electrostatic protection other pins, human body model -4 4 kV HBM JEDEC JS-001 4
Electrostatic protection other pins, charged device model -1.5 1.5 kV CDM JESD22-C101 4
Electrostatic protection other pins, machine model -0.4 0.4 kV MM JESD22-A115 4
Driver input to output delay (low to high) tDPLH 250 720 1000 ns Fig 3 and 5, RDIFF=54Ω, CL=54pF 5
Driver input to output delay (high to low) tDPHL 250 720 1000 ns Fig 3 and 5, RDIFF=54Ω, CL=54pF 5
Driver output skew tDSKEW -100 -3 100 ns Fig 3 and 5, RDIFF=54Ω, CL1=CL2=100pF 5
Driver rise and fall time tDR, tDF 400 700 1200 ns Fig 3 and 5, RDIFF=54Ω, CL1=CL2=100pF 5
Maximum data rate fMAX 500 kbps 5
Receiver input to output skew tRSKD -50 10 50 ns Fig 7 and 9; /VID/≥2.0V; VID rise/fall time <15 ns 5
Chip shutdown time tSHDN 50 200 600 ns Note 4 5
Driver power dissipation derating -5.9 mW/°C 8-pin SO; above +70°C 2

CAD (KiCad official)

  • Symbol: HD568N
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hd568n-etched.step / hd568n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hd568n.step / hd568n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Broadic datasheet (12 pp, sha256 767e135ee1f4ee16, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF