# HCB1608KF-102T10

**TAI TECH** · Ferrite Beads · 0603

HCB1608KF-102T10 from TAI TECH, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One termination of the non-polarized chip bead (Ag/Ni/Sn Pb-free electrode), 1000 Ω ±25% at 100 MHz, rated 1000 mA max, DC resistance 0.20 Ω max. |
| 2 | 2 | passive | Other termination of the non-polarized chip bead (Ag/Ni/Sn Pb-free electrode), 1000 Ω ±25% at 100 MHz, rated 1000 mA max, DC resistance 0.20 Ω max. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TAI TECH |
| Package | 0603 |
| Category | Filters |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Impedance tolerance | Z | -25 |  | 25 | % |  | 1 |
| DC resistance |  |  |  | 0.2 | Ω |  | 1 |
| Rated current |  |  |  | 1000 | mA |  | 1 |
| Operating temperature |  | -40 |  | 125 | °C | Including self-temperature rise (bead series) | 2 |
| Storage temperature |  | -40 |  | 125 | °C | Transportation storage | 2 |
| Temperature rise | ΔT |  |  | 40 |  | Rated current 1A, applied allowed DC current | 2 |
| Impedance change after solder heat | Z | -30 |  | 30 | % | Solder heat, solder temperature 260±5, dip time 10±0.5 sec | 2 |
| Remaining terminal electrode after solder heat |  | 75 |  |  | % | Solder heat, solder temperature 260±5, dip time 10±0.5 sec | 2 |
| Solderability terminal electrode coverage |  | 95 |  |  | % | Solder temperature 245±5, dip time 4±1 sec | 2 |
| Impedance change after humidity | Z | -30 |  | 30 | % | Humidity 90~95%RH, temperature 40±2, duration 504±8 hrs | 3 |
| Impedance change after drop | Z | -30 |  | 30 | % | Drop 10 times on concrete floor from 75 cm | 3 |
| Reflow peak temperature | TP |  |  | 260 | °C | Lead-free reflow profile, Fig.1 | 4 |
| Reflow time at peak temperature |  |  |  | 40 | s | At TP, Fig.1 | 4 |
| Total reflow time |  |  |  | 480 | s | Lead-free reflow profile, Fig.1 | 4 |
| Reflow times |  |  |  | 3 | times | Reflow soldering | 4 |
| Impedance | Z |  | 1000 |  | Ω | 60mV/100M | 1 |

## CAD (KiCad official)

- Symbol: `HCB1608KF-102T10`
- Footprint: `Inductor_SMD:L_0603_1608Metric`
- 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files: `hcb1608kf-102t10-etched.step` / `hcb1608kf-102t10-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hcb1608kf-102t10.step` / `hcb1608kf-102t10.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TAI TECH datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588946993691701248) (5 pp, sha256 `b9f1895e104a36aa`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hcb1608kf-102t10-datasheet.pdf)