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HCB1608KF-102T10

TAI TECH · Ferrite Beads · 0603

HCB1608KF-102T10 from TAI TECH, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive One termination of the non-polarized chip bead (Ag/Ni/Sn Pb-free electrode), 1000 Ω ±25% at 100 MHz, rated 1000 mA max, DC resistance 0.20 Ω max.
2 2 passive Other termination of the non-polarized chip bead (Ag/Ni/Sn Pb-free electrode), 1000 Ω ±25% at 100 MHz, rated 1000 mA max, DC resistance 0.20 Ω max.

Key specifications

Parameter Value
Manufacturer TAI TECH
Package 0603
Category Filters
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Impedance tolerance Z -25 25 % 1
DC resistance 0.2 Ω 1
Rated current 1000 mA 1
Operating temperature -40 125 °C Including self-temperature rise (bead series) 2
Storage temperature -40 125 °C Transportation storage 2
Temperature rise ΔT 40 Rated current 1A, applied allowed DC current 2
Impedance change after solder heat Z -30 30 % Solder heat, solder temperature 260±5, dip time 10±0.5 sec 2
Remaining terminal electrode after solder heat 75 % Solder heat, solder temperature 260±5, dip time 10±0.5 sec 2
Solderability terminal electrode coverage 95 % Solder temperature 245±5, dip time 4±1 sec 2
Impedance change after humidity Z -30 30 % Humidity 90~95%RH, temperature 40±2, duration 504±8 hrs 3
Impedance change after drop Z -30 30 % Drop 10 times on concrete floor from 75 cm 3
Reflow peak temperature TP 260 °C Lead-free reflow profile, Fig.1 4
Reflow time at peak temperature 40 s At TP, Fig.1 4
Total reflow time 480 s Lead-free reflow profile, Fig.1 4
Reflow times 3 times Reflow soldering 4
Impedance Z 1000 Ω 60mV/100M 1

CAD (KiCad official)

  • Symbol: HCB1608KF-102T10
  • Footprint: Inductor_SMD:L_0603_1608Metric
  • 3D model: 0603 (KiCad packages3D, STEP)
  • 3D model files: hcb1608kf-102t10-etched.step / hcb1608kf-102t10-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hcb1608kf-102t10.step / hcb1608kf-102t10.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TAI TECH datasheet (5 pp, sha256 b9f1895e104a36aa, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF