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HC32F030F8TA-LQ32

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XHSC Microcontrollers (MCU/MPU/SOC), LQFP-32(7x7). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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HC32F030F8TA-LQ32

XHSC · Microcontrollers (MCU/MPU/SOC) · LQFP-32(7x7)

HC32F030F8TA-LQ32 from XHSC, in a LQFP-32(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCAP power_out LDO core-supply output for internal circuits only, requires an external decoupling capacitor of at least 1 µF.
2 XTHI/PD00 bidirectional High-speed crystal oscillator input XTHI (4-32 MHz) shared with GPIO PD00, whose alternate functions are I2C0_SDA and UART1_TXD.
3 XTHO/PD01 bidirectional High-speed crystal oscillator output XTHO (4-32 MHz) shared with GPIO PD01, whose alternate functions are I2C0_SCL, TIM4_CHB and UART1_RXD.
4 RESETB input Active-low reset input, CMOS with a non-disconnectable pull-up (about 80 kΩ), VIL up to 0.3VCC and VIH from 0.7VCC.
5 AVCC power_in Analog supply, 1.8-5.5 V, which must be the same voltage as DVCC (at most 300 mV difference is allowed during power-up and operation).
6 PA00 bidirectional GPIO PA00 that also serves ADC input AIN0, comparator inputs VC0/VC1, and UART1_CTS, TIM0, TIM1 and TIM3 functions.
7 PA01 bidirectional GPIO PA01 that also serves ADC input AIN1, comparator inputs, UART1_RTS, TIM0/TIM1 channels, HCLK_OUT and SPI1_MOSI.
8 PA02 bidirectional GPIO PA02 that also serves ADC input AIN2, comparator inputs, VC1_OUT, UART1_TXD, PCLK_OUT and SPI1_MISO.
9 PA03 bidirectional GPIO PA03 with digital alternate functions UART1_RXD, TIM0_GATE, TIM1_CHB, TIM2_CHB, SPI1_CS, TIM3_CH1A and TIM5_CHA.
10 PA04 bidirectional GPIO PA04 with alternate functions SPI0_CS, UART1_TXD, PCA_CH4, TIM2_ETR, TIM5_CHA, LVD_OUT and TIM3_CH2B.
11 PA05 bidirectional GPIO PA05 with alternate functions SPI0_SCK, TIM0_ETR, PCA_ECI, TIM0_CHA, TIM5_CHB, XTL_OUT and XTH_OUT.
12 PA06 bidirectional GPIO PA06 with alternate functions SPI0_MISO, PCA_CH0, TIM3_BK, TIM1_CHA, VC0_OUT and TIM3_GATE.
13 PA07 bidirectional GPIO PA07 with alternate functions SPI0_MOSI, PCA_CH1, HCLK_OUT, TIM3_CH0B, TIM2_CHA, VC1_OUT and TIM4_CHB.
14 PB00 bidirectional GPIO PB00 with alternate functions PCA_CH2, TIM3_CH1B, TIM5_CHB, RCH_OUT, RCL_OUT and PLL_OUT.
15 PB01 bidirectional GPIO PB01 with alternate functions PCA_CH3, PCLK_OUT, TIM3_CH2B and TIM6_CHB.
16 DVSS power_in Digital ground.
17 DVCC power_in Digital supply, 1.8-5.5 V, with a decoupling capacitor placed as close as possible to the pin.
18 PA08 bidirectional GPIO PA08 with alternate functions UART0_TXD, TIM3_CH0A, TIM1_GATE, TIM4_CHA and TIM3_BK.
19 PA09 bidirectional GPIO PA09 with alternate functions UART0_TXD, TIM3_CH1A, TIM0_BK, I2C0_SCL, HCLK_OUT and TIM5_CHA; the datasheet recommends reserving PA9 and PA10 as the ISP programming interface.
20 PA10 bidirectional GPIO PA10 with alternate functions UART0_RXD, TIM3_CH2A, TIM2_BK, I2C0_SDA, TIM2_GATE, PCLK_OUT and TIM6_CHA; the datasheet recommends reserving it with PA9 as the ISP programming interface.
21 PA11 bidirectional GPIO PA11 with alternate functions UART0_CTS, TIM3_GATE, I2C1_SCL, VC0_OUT, SPI0_MISO and TIM4_CHB.
22 PA12 bidirectional GPIO PA12 with alternate functions UART0_RTS, TIM3_ETR, I2C1_SDA, VC1_OUT and SPI0_MOSI.
23 PA13/SWDIO bidirectional GPIO PA13 that serves as the SWD data pin (SWDIO) for debug and programming, also with IR_OUT, UART0_RXD, LVD_OUT and TIM3_ETR.
24 PA14/SWCLK bidirectional GPIO PA14 that serves as the SWD clock pin (SWCLK), also with UART1_TXD, UART0_TXD, TIM3_CH2A, LVD_OUT, RCH_OUT, RCL_OUT and PLL_OUT.
25 PA15 bidirectional GPIO PA15 with alternate functions SPI0_CS, UART1_RXD, TIM0_ETR, TIM0_CHA and TIM3_CH1A.
26 PB03 bidirectional GPIO PB03 with alternate functions SPI0_SCK, TIM0_CHB, TIM1_GATE, TIM3_CH0A, XTL_OUT and XTH_OUT.
27 PB04 bidirectional GPIO PB04 with alternate functions SPI0_MISO, PCA_CH0, TIM2_BK, UART0_CTS, TIM2_GATE and TIM3_CH0B.
28 PB05 bidirectional GPIO PB05 with alternate functions SPI0_MOSI, TIM1_BK, PCA_CH1 and UART0_RTS.
29 PB06 bidirectional GPIO PB06 with alternate functions I2C0_SCL, UART0_TXD, TIM1_CHB, TIM0_CHA and TIM3_CH0A.
30 PB07 bidirectional GPIO PB07 with alternate functions I2C0_SDA, UART0_RXD, TIM2_CHB and TIM0_CHB; also an LVD monitoring input per the LVD section.
31 BOOT0 input Boot-mode pin sampled at reset: high selects ISP programming mode, low selects user mode executing Flash code with SWD programming available.
32 DVSS power_in Digital ground.

Key specifications

Parameter Value
Manufacturer XHSC
Package LQFP-32(7x7)
Category Embedded Processors & Controllers
Pins 32

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
External main supply voltage (incl. AVCC and DVCC) VCC - VSS -0.3 5.5 V 38
Voltage difference between supply pins /ΔVCCx/ 50 mV 38
Voltage difference between ground pins /VSSx - VSS/ 50 mV 38
Total current through DVCC/AVCC supply lines (supply current) IVCC 300 mA 39
Total current through VSS ground lines (sink current) IVSS 300 mA 39
Output sink current on any I/O and control pin IIO 25 mA 39
Output current on any I/O and control pin (printed as -25 in max column) IIO -25 mA 39
Injection current on RESETB pin IINJ(PIN) -5 5 mA RESETB pin 39
Injection current on XTHI pin (XTH) and XTLI pin (XTL) IINJ(PIN) -5 5 mA XTHI pin of XTH and XTLI pin of XTL 39
Injection current on other pins IINJ(PIN) -5 5 mA 39
Total injection current on all I/O and control pins ∑IINJ(PIN) -25 25 mA all I/O and control pins 39
Storage temperature range TSTG -60 150 ℃ 39
Maximum junction temperature TJ 105 ℃ 39
Internal AHB clock frequency fHCLK 0 48 MHz 39
Internal APB0 clock frequency fPCLK0 0 48 MHz 39
Internal APB1 clock frequency fPCLK1 0 48 MHz 39
Digital supply voltage DVCC 1.8 5.5 V 39
Analog supply voltage AVCC 1.8 5.5 V must be the same as DVCC 39
Power dissipation (LQFP32 package) PD 357 mW TA=85℃, LQFP32 39
Ambient temperature (maximum power consumption) TA -40 85 ℃ maximum power consumption 40
Ambient temperature (low power consumption) TA -40 105 ℃ low power dissipation state 40
Junction temperature range TJ -40 105 ℃ 40
VCC rising rate tVcc 0 μs/V 40
VCC falling rate tVcc 10 μs/V 40
POR release voltage (power-up) / BOR detection voltage (power-down) Vpor 1.45 1.5 1.65 V 40
External input voltage range Vex 0 V 41
LVD detection threshold Vlevel 1.7 1.8 1.9 V LVD_CR.VTDS=0000 41
LVD detection threshold Vlevel 1.8 1.9 2 V LVD_CR.VTDS=0001 41
LVD detection threshold Vlevel 1.9 2 2.1 V LVD_CR.VTDS=0010 41
LVD detection threshold Vlevel 2 2.1 2.2 V LVD_CR.VTDS=0011 41
LVD detection threshold Vlevel 2.1 2.2 2.3 V LVD_CR.VTDS=0100 41
LVD detection threshold Vlevel 2.2 2.3 2.4 V LVD_CR.VTDS=0101 41
LVD detection threshold Vlevel 2.3 2.4 2.5 V LVD_CR.VTDS=0110 41
LVD detection threshold Vlevel 2.4 2.5 2.6 V LVD_CR.VTDS=0111 41
LVD detection threshold Vlevel 2.5 2.6 2.7 V LVD_CR.VTDS=1000 41
LVD detection threshold Vlevel 2.6 2.7 2.8 V LVD_CR.VTDS=1001 41
LVD detection threshold Vlevel 2.7 2.8 2.9 V LVD_CR.VTDS=1010 41
LVD detection threshold Vlevel 2.8 2.9 3 V LVD_CR.VTDS=1011 41
LVD detection threshold Vlevel 2.9 3 3.1 V LVD_CR.VTDS=1100 41
LVD detection threshold Vlevel 3 3.1 3.2 V LVD_CR.VTDS=1101 41
LVD detection threshold Vlevel 3.1 3.2 3.3 V LVD_CR.VTDS=1110 41
LVD detection threshold Vlevel 3.2 3.3 3.4 V LVD_CR.VTDS=1111 41
Internal 2.5V reference voltage VREF25 2.475 2.5 2.525 V 25°C, 3.3V 41
Internal 2.5V reference voltage VREF25 2.463 2.5 2.525 V -4085°C, 2.85.5V 41
Internal 1.5V reference voltage VREF15 1.485 1.5 1.515 V 25°C, 3.3V 41
Internal 1.5V reference voltage VREF15 1.477 1.5 1.519 V -4085°C, 1.85.5V 41

CAD (KiCad official)

  • Symbol: HC32F030F8TA-LQ32
  • Footprint: Package_QFP:LQFP-32_7x7mm_P0.8mm
  • 3D model: LQFP-32(7x7) (KiCad packages3D, STEP)
  • 3D model files: hc32f030f8ta-lq32-etched.step / hc32f030f8ta-lq32-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hc32f030f8ta-lq32.step / hc32f030f8ta-lq32.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XHSC datasheet (80 pp, sha256 c1f5c05168fa2ea7, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF