# H8116A33NR

**Shanghai Siproin Microelectronics** · DC-DC Converters · SOT-23

H8116A33NR from Shanghai Siproin Microelectronics, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUT | power_out | Output voltage pin; absolute maximum voltage is VSS-0.3 V to VSS+8 V. |
| 2 | Vss | power_in | GND pin. |
| 3 | LX | output | External inductor connection pin; absolute maximum voltage is VSS-0.3 V to VSS+8 V and absolute maximum LX pin current is 1000 mA. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shanghai Siproin Microelectronics |
| Package | SOT-23 |
| Category | Power Management (PMIC) |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage | VIN |  |  | 7.5 | V |  | 3 |
| Operation Start Voltage | VST1 |  |  | 0.9 | V | IOUT=1mA VOUT=2.2V~4.2V | 3 |
| Input Current At No Load | ISS |  |  | 25 | uA | VIN=1.8V, VOUT=3.0V | 3 |
| Input Current At No Load | ISS |  |  | 35 | uA | VIN=0.9V, VOUT=3.0V | 3 |
| Current Consumption 2 | ISS2 |  | 6 | 10 | uA | VOUT=VOUT+0.5V | 3 |
| Current Consumption During Shutdown | ISSS |  |  | 1 | uA | VEN=0V | 3 |
| Maximum Oscillation Frequency | fosc |  |  | 300 | KHz | VOUT=0.95xVOUT, measure Waveform at LX pin | 3 |
| Duty Ratio1 | Duty1 | 70 | 78 | 85 | % | VOUT=0.95xVOUT | 3 |
| Efficiency | EFF1 | 90 |  |  | % |  | 3 |
| Shutdown Pin Input Voltage | VSH | 0.75 |  |  | V |  | 3 |
| Shutdown Pin Input Voltage (oscillation stop judgement) | VSL1 |  |  | 0.3 | V |  | 3 |
| Shutdown Pin Input Current | ISH | -0.1 |  | 0.1 | uA | VEN=6V | 3 |
| LX Pin Current | ILX |  |  | 1000 | mA |  | 2 |
| Power Dissipation (SOT23) | PD |  |  | 250 | mW |  | 2 |
| Operating Temperature | TOPR | -40 |  | 85 | ℃ |  | 2 |
| Storage Temperature | TSTG | -40 |  | 125 | ℃ |  | 2 |
| Soldering Temperature & Time | TSOLDER |  |  | 260 | ℃ | 10s | 2 |

## CAD (KiCad official)

- Symbol: `H8116A33NR`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `h8116a33nr-etched.step` / `h8116a33nr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `h8116a33nr.step` / `h8116a33nr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shanghai Siproin Microelectronics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588911810997063680) (7 pp, sha256 `5d3d0e99e22fc46c`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/h8116a33nr-datasheet.pdf)