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H8116A33NR

Shanghai Siproin Microelectronics · DC-DC Converters · SOT-23

H8116A33NR from Shanghai Siproin Microelectronics, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT power_out Output voltage pin; absolute maximum voltage is VSS-0.3 V to VSS+8 V.
2 Vss power_in GND pin.
3 LX output External inductor connection pin; absolute maximum voltage is VSS-0.3 V to VSS+8 V and absolute maximum LX pin current is 1000 mA.

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package SOT-23
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage VIN 7.5 V 3
Operation Start Voltage VST1 0.9 V IOUT=1mA VOUT=2.2V~4.2V 3
Input Current At No Load ISS 25 uA VIN=1.8V, VOUT=3.0V 3
Input Current At No Load ISS 35 uA VIN=0.9V, VOUT=3.0V 3
Current Consumption 2 ISS2 6 10 uA VOUT=VOUT+0.5V 3
Current Consumption During Shutdown ISSS 1 uA VEN=0V 3
Maximum Oscillation Frequency fosc 300 KHz VOUT=0.95xVOUT, measure Waveform at LX pin 3
Duty Ratio1 Duty1 70 78 85 % VOUT=0.95xVOUT 3
Efficiency EFF1 90 % 3
Shutdown Pin Input Voltage VSH 0.75 V 3
Shutdown Pin Input Voltage (oscillation stop judgement) VSL1 0.3 V 3
Shutdown Pin Input Current ISH -0.1 0.1 uA VEN=6V 3
LX Pin Current ILX 1000 mA 2
Power Dissipation (SOT23) PD 250 mW 2
Operating Temperature TOPR -40 85 ℃ 2
Storage Temperature TSTG -40 125 ℃ 2
Soldering Temperature & Time TSOLDER 260 ℃ 10s 2

CAD (KiCad official)

  • Symbol: H8116A33NR
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: h8116a33nr-etched.step / h8116a33nr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); h8116a33nr.step / h8116a33nr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (7 pp, sha256 5d3d0e99e22fc46c, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF