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Contents

README

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H2SC3357-RE

HXY MOSFET · Bipolar (BJT) · SOT-89

H2SC3357-RE from HXY MOSFET, in a SOT-89. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BASE input Base terminal of the NPN transistor; the datasheet rates emitter-base voltage VEBO at 3 V maximum and gives VBE(sat) of 1.2 V at IC=50 mA, IB=5 mA.
2 COLLECTOR passive Collector terminal; the datasheet rates VCBO at 20 V, VCEO at 12 V, continuous collector current at 100 mA, and total power dissipation PC at 1.2 W.
3 EMITTER passive Emitter terminal; the datasheet rates the junction and storage temperature range at -55 to +150 ℃ and gives the emitter-base breakdown voltage V(BR)EBO as 5 V minimum.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOT-89
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector-Emitter Voltage VCEO 12 V Ta=25 (maximum ratings header) 1
Collector-Base Voltage VCBO 20 V Ta=25 (maximum ratings header) 1
Emitter-Base Voltage VEBO 3 V Ta=25 (maximum ratings header) 1
Collector Current -Continuous IC 100 mA Ta=25 (maximum ratings header) 1
Collector Power Dissipation PC 1.2 W Ta=25 (maximum ratings header) 1
Operation Junction and Storage Temperature Range TJ,Tstg -55 150 ℃ Ta=25 (maximum ratings header) 1
Collector-base breakdown voltage V(BR)CBO 20 V IC=100μA, IE=0 1
Collector-emitter breakdown voltage V(BR)CEO 12 V IC=1mA, IB=0 (pulse test) 1
Emitter-base breakdown voltage V(BR)EBO 5 V IE=100μA, IC=0 1
Collector cut-off current ICBO 1 μA VCB=20V, IE=0 1
Emitter cut-off current IEBO 1 μA VEB=1V, IC=0 1
DC current gain hFE 50 VCE=10V, IC=20mA 1
Base-emitter saturation voltage VBE(sat) 1.2 V IC=50mA, IB=5mA 1
Collector-emitter saturation voltage VCE(sat) 0.4 V IC=50mA, IB=5mA 1
Transition frequency fT 6.5 GHz VCE=10V, IC=20mA 1
Thermal resistance, junction to ambient Rth(j-a) 312.5 ˚C/W Ceramic substrate 16 cm2 × 0.7 mm (t), free air 2

CAD (KiCad official)

  • Symbol: H2SC3357-RE
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89 (KiCad packages3D, STEP)
  • 3D model files: h2sc3357-re-etched.step / h2sc3357-re-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); h2sc3357-re.step / h2sc3357-re.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (4 pp, sha256 f567729f4ceb3375, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF