# GS1J-LTP

**MCC(Micro Commercial Components)** · Diodes - General Purpose · SMA(DO-214AC)

GS1J-LTP from MCC(Micro Commercial Components), in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode terminal, the end identified by the cathode mark on the SMA (DO-214AC) body; GS1J blocks 600V DC (600V recurrent peak, 420V RMS) and conducts 1.0A average with VF of 1.0V max at 1.0A. |
| 2 | A | passive | Anode terminal, the end opposite the cathode mark on the SMA (DO-214AC) body; forward current is rated 1.0A average at TL=110°C with 30A peak surge (8.3ms half sine). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SMA(DO-214AC) |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | VRRM |  |  | 600 | V |  | 1 |
| Maximum RMS Voltage | VRMS |  |  | 420 | V |  | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 600 | V |  | 1 |
| Average Forward Current | IF(AV) |  |  | 1 | A | TL = 110°C | 1 |
| Peak Forward Surge Current | IFSM |  |  | 30 | A | 8.3ms, Half Sine | 1 |
| Maximum Instantaneous Forward Voltage | VF |  |  | 1 | V | IFM = 1.0A; TJ = 25°C * | 1 |
| Maximum DC Reverse Current at Rated DC Blocking Voltage | IR |  |  | 5 | μA | TJ = 25°C | 1 |
| Maximum DC Reverse Current at Rated DC Blocking Voltage | IR |  |  | 50 | μA | TJ = 125°C | 1 |
| Avalanche Energy | EAS |  |  | 20 | mJ | LH:40mH | 1 |
| Rating For Fusing | I2t |  |  | 3.735 | A2s |  | 1 |
| Operating Junction Temperature Range | TJ | -55 |  | 150 | °C |  | 1 |
| Storage Temperature Range | TSTG | -55 |  | 150 | °C |  | 1 |
| Maximum Thermal Resistance Junction to Lead | RθJL |  |  | 15 | °C/W | Junction to Lead | 1 |
| Maximum Thermal Resistance Junction to Ambient | RθJA |  |  | 85 | °C/W | Junction to Ambient | 1 |
| Typical Junction Capacitance | CJ |  | 15 |  | pF | Measured at 1.0MHz, VR=4.0V | 1 |
| Typical Reverse Recovery Time | trr |  | 2 |  | µs | IF=0.5A, IR=1.0A, Irr=0.25A | 1 |

## CAD (KiCad official)

- Symbol: `GS1J-LTP`
- Footprint: `Diode_SMD:D_SMA`
- 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
- 3D model files: `gs1j-ltp-etched.step` / `gs1j-ltp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `gs1j-ltp.step` / `gs1j-ltp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC(Micro Commercial Components) datasheet](docs/gs1j-ltp-datasheet.pdf) (3 pp, sha256 `fd1d02e7f6c913f4`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/gs1j-ltp-datasheet.pdf)