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GS1J-LTP

MCC(Micro Commercial Components) · Diodes - General Purpose · SMA(DO-214AC)

GS1J-LTP from MCC(Micro Commercial Components), in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode terminal, the end identified by the cathode mark on the SMA (DO-214AC) body; GS1J blocks 600V DC (600V recurrent peak, 420V RMS) and conducts 1.0A average with VF of 1.0V max at 1.0A.
2 A passive Anode terminal, the end opposite the cathode mark on the SMA (DO-214AC) body; forward current is rated 1.0A average at TL=110°C with 30A peak surge (8.3ms half sine).

Key specifications

Parameter Value
Manufacturer MCC(Micro Commercial Components)
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Recurrent Peak Reverse Voltage VRRM 600 V 1
Maximum RMS Voltage VRMS 420 V 1
Maximum DC Blocking Voltage VDC 600 V 1
Average Forward Current IF(AV) 1 A TL = 110°C 1
Peak Forward Surge Current IFSM 30 A 8.3ms, Half Sine 1
Maximum Instantaneous Forward Voltage VF 1 V IFM = 1.0A; TJ = 25°C * 1
Maximum DC Reverse Current at Rated DC Blocking Voltage IR 5 μA TJ = 25°C 1
Maximum DC Reverse Current at Rated DC Blocking Voltage IR 50 μA TJ = 125°C 1
Avalanche Energy EAS 20 mJ LH:40mH 1
Rating For Fusing I2t 3.735 A2s 1
Operating Junction Temperature Range TJ -55 150 °C 1
Storage Temperature Range TSTG -55 150 °C 1
Maximum Thermal Resistance Junction to Lead RθJL 15 °C/W Junction to Lead 1
Maximum Thermal Resistance Junction to Ambient RθJA 85 °C/W Junction to Ambient 1
Typical Junction Capacitance CJ 15 pF Measured at 1.0MHz, VR=4.0V 1
Typical Reverse Recovery Time trr 2 µs IF=0.5A, IR=1.0A, Irr=0.25A 1

CAD (KiCad official)

  • Symbol: GS1J-LTP
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: gs1j-ltp-etched.step / gs1j-ltp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gs1j-ltp.step / gs1j-ltp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MCC(Micro Commercial Components) datasheet (3 pp, sha256 fd1d02e7f6c913f4, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF