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Contents

README

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GM1203BACPZ-3-R7

GONGMOSEMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · QFN-20(3.5x3.5)

GM1203BACPZ-3-R7 from GONGMOSEMI, in a QFN-20(3.5x3.5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Regulated output; a ceramic capacitor of at least 47 µF is required from this pin to GND, placed as close to the pin as possible.
2 SNS input Output sense pin, connected internally to the output through an R0 resistor; connect it to the load side of the output only when the VOUT programming pins are used, otherwise leave it floating.
3 FB input Feedback pin to the error amplifier; a 10 nF feed-forward capacitor from FB to OUT, placed close to the device, is recommended, and FB to GND is rated −0.3 V to +3.6 V.
4 PG output Open-drain power-good output (active high) that indicates when the output reaches the PG rising threshold; use an external pull-up of 10 kΩ to 100 kΩ, and PG to GND is rated −0.3 V to +7 V with a PG current limit of −5 mA.
5 50mV input Output-voltage programming pin for the 50 mV step; connect to GND or SNS or leave floating, where grounding it adds 50 mV to the output voltage, and it is rated −0.3 V to VOUT+0.3 V.
6 100mV input Output-voltage programming pin for the 100 mV step; connect to GND or SNS or leave floating, where grounding it adds 100 mV to the output voltage, and it is rated −0.3 V to VOUT+0.3 V.
7 200mV input Output-voltage programming pin for the 200 mV step; connect to GND or SNS or leave floating, where grounding it adds 200 mV to the output voltage, and it is rated −0.3 V to VOUT+0.3 V.
8 GND power_in Ground pin that must be connected to the other GND pins and the exposed pad through a low-impedance path.
9 400mV input Output-voltage programming pin for the 400 mV step; connect to GND or SNS or leave floating, where grounding it adds 400 mV to the output voltage, and it is rated −0.3 V to VOUT+0.3 V.
10 800mV input Output-voltage programming pin for the 800 mV step; connect to GND or SNS or leave floating, where grounding it adds 800 mV to the output voltage, and it is rated −0.3 V to VOUT+0.3 V.
11 1.6V input Output-voltage programming pin for the 1.6 V step; connect to GND or SNS or leave floating, where grounding it adds 1.6 V to the output voltage, and it is rated −0.3 V to VOUT+0.3 V.
12 BIAS power_in Bias supply pin that improves DC and AC performance and reduces power dissipation at VIN ≤ 2.2 V; it requires a 10 µF or larger capacitor to GND, and it must be left floating or grounded if unused.
13 NR/SS passive Noise-reduction and soft-start pin with an external capacitor to GND; a 10 nF or larger capacitor is recommended, and the pin is rated −0.3 V to +3.6 V.
14 EN input Enable pin: drive above 1.1 V to enable the device and below 0.4 V to disable it, and connect it to IN or BIAS if enable control is not used.
15 IN power_in Input pin that requires a ceramic capacitor of 10 µF or larger to GND placed close to the input, with an input voltage range of 1.1 V to 6.5 V.
16 IN power_in Input pin that requires a ceramic capacitor of 10 µF or larger to GND placed close to the input, with an input voltage range of 1.1 V to 6.5 V.
17 IN power_in Input pin that requires a ceramic capacitor of 10 µF or larger to GND placed close to the input, with an input voltage range of 1.1 V to 6.5 V.
18 GND power_in Ground pin that must be connected to the other GND pins and the exposed pad through a low-impedance path.
19 OUT power_out Regulated output; a ceramic capacitor of at least 47 µF is required from OUT to GND, placed as close to the pin as possible.
20 OUT power_out Regulated output; a ceramic capacitor of at least 47 µF is required from OUT to GND, placed as close to the pin as possible.
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer GONGMOSEMI
Package QFN-20(3.5x3.5)
Category Power Management (PMIC)
Pins 21

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
IN, BIAS, PG, EN 至 GND 电压 -0.3 7 V 8
NR/SS, FB 至 GND 电压 -0.3 3.6 V 8
SNS, OUT 至 GND 电压 -0.3 V 8
50mV, 100mV, 200mV, 400mV, 800mV 至 GND 电压 -0.3 V 8
PG 电流 -5 mA 8
存储温度范围 -65 150 °C 8
工作温度范围 (-40°C 级,适用于本型号) -40 125 °C 8
输入电压范围 (设计工作范围) VIN 1.1 6.5 V 18
BIAS 偏置电压 (输入低于 1.5 V 时) VBIAS 3 V VIN < 1.5 V 18
输入电容 (IN 到 GND) CIN 10 µF 6
BIAS 到 GND 电容 10 µF 6
输出电容 (OUT 到 GND, 陶瓷) COUT 47 µF 6
结到环境热阻 θJA (20 引脚 3.5 mm × 3.5 mm QFN) θJA 43.4 °C/W JEDEC 51-7 高有效导热四层测试板, 最坏情况 8
VUVLO 带 BIAS 的最小 IN 电压 VUVLO 0.98 1.085 V VBIAS = 3.0 V 时,TJ = −40°C to +125°C 9
VUVLO1 不带 BIAS 的最小 IN 电压 VUVLO1 1.32 1.49 V TJ = −40°C to +125°C,VIN 逐渐上升 9
最小 BIAS 输入电压 VBIAS_UVLO 2.2 2.9 V VIN = 1.1 V 时 VBIAS逐渐上升 9
VFB 输出电压 GM1203B 范围 (使用引脚编程) VFB 0.8 3.95 V 使用引脚编程 9
VFB 输出电压 GM1203B 范围 (使用外部电阻) VFB 0.8 5.5 V 使用外部电阻 9
精度 -1 1 % 0.5 V ≤ VOUT ≤ 3.65 V, 5 mA ≤ IOUT ≤ 3 A, over VIN 9
带 BIAS 的精度 -1 1.3 % VIN = 1.1 V, VOUT = 0.5V, 5 mA ≤ IOUT ≤ 3 A, 3.0 V ≤ VBIAS ≤ 6.5 V 9
ILIM 输出电流限制 ILIM 4.6 5.2 7.6 A VOUT 外加 0.9 × VOUT(nom), VIN = VOUT(nom) + 0.4 V 9
EN 引脚低电平输入电压 VEN_IL 0 0.4 V 9
EN 引脚高电平输入电压 VEN_IH 1.1 6.5 V 9
EN 引脚电流 IEN -0.1 0.1 µA VIN = 6.5 V, VEN = 0 V and 6.5 V 9
PG 引脚阈值 下降 VPG_FALLING 82 91 93 % × VOUT 下降 9
NR/SS 引脚充电电流 INR/SS 4 9 11.5 µA VNR/SS = GND, VIN = 6.5 V 10
FB 引脚漏电流 IFB -100 100 nA VIN = 6.5 V 10

CAD (KiCad official)

  • Symbol: GM1203BACPZ-3-R7
  • Footprint: Package_DFN_QFN:QFN-20-1EP_3.5x3.5mm_P0.5mm_EP2x2mm
  • 3D model: QFN-20(3.5x3.5), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal QFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: gm1203bacpz-3-r7-etched.step / gm1203bacpz-3-r7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gm1203bacpz-3-r7.step / gm1203bacpz-3-r7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GONGMOSEMI datasheet (25 pp, sha256 f744d3090b584d94, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF