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GD32F130K6T6

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GigaDevice Semicon Beijing Microcontroller Units (MCUs/MPUs/SOCs), LQFP-32(7x7). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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GD32F130K6T6

GigaDevice Semicon Beijing · Microcontroller Units (MCUs/MPUs/SOCs) · LQFP-32(7x7)

GD32F130K6T6 from GigaDevice Semicon Beijing, in a LQFP-32(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Digital power supply pin.
2 PF0-OSCIN bidirectional 5 V tolerant I/O, default PF0, additional function OSCIN (HXTAL oscillator input).
3 PF1-OSCOUT bidirectional 5 V tolerant I/O, default PF1, additional function OSCOUT (HXTAL oscillator output).
4 NRST bidirectional External reset pin, default function NRST.
5 VDDA power_in Analog power supply pin.
6 PA0-WKUP bidirectional I/O, default PA0; alternate USART1_CTS, TIMER1_CH0, TIMER1_ETI; additional ADC_IN0, RTC_TAMP1, WKUP0.
7 PA1 bidirectional I/O, default PA1; alternate USART1_RTS/USART1_DE, TIMER1_CH1, EVENTOUT; additional ADC_IN1.
8 PA2 bidirectional I/O, default PA2; alternate USART1_TX, TIMER1_CH2, TIMER14_CH0; additional ADC_IN2.
9 PA3 bidirectional I/O, default PA3; alternate USART1_RX, TIMER1_CH3, TIMER14_CH1; additional ADC_IN3.
10 PA4 bidirectional I/O, default PA4; alternate SPI0_NSS, USART1_CK, TIMER13_CH0; additional ADC_IN4.
11 PA5 bidirectional I/O, default PA5; alternate SPI0_SCK, TIMER1_CH0, TIMER1_ETI; additional ADC_IN5.
12 PA6 bidirectional I/O, default PA6; alternate SPI0_MISO, TIMER2_CH0, TIMER0_BRKIN, TIMER15_CH0, EVENTOUT; additional ADC_IN6.
13 PA7 bidirectional I/O, default PA7; alternate SPI0_MOSI, TIMER2_CH1, TIMER13_CH0, TIMER0_CH0_ON, TIMER16_CH0, EVENTOUT; additional ADC_IN7.
14 PB0 bidirectional I/O, default PB0; alternate TIMER2_CH2, TIMER0_CH1_ON, USART1_RX, EVENTOUT; additional ADC_IN8.
15 PB1 bidirectional I/O, default PB1; alternate TIMER2_CH3, TIMER13_CH0, TIMER0_CH2_ON; additional ADC_IN9.
16 VSS power_in Digital ground pin.
17 VDD power_in Digital power supply pin.
18 PA8 bidirectional 5 V tolerant I/O, default PA8; alternate USART0_CK, TIMER0_CH0, CK_OUT, USART1_TX, EVENTOUT.
19 PA9 bidirectional 5 V tolerant I/O, default PA9; alternate USART0_TX, TIMER0_CH1, TIMER14_BRKIN, I2C0_SCL.
20 PA10 bidirectional 5 V tolerant I/O, default PA10; alternate USART0_RX, TIMER0_CH2, TIMER16_BRKIN, I2C0_SDA.
21 PA11 bidirectional 5 V tolerant I/O, default PA11; alternate USART0_CTS, TIMER0_CH3, EVENTOUT.
22 PA12 bidirectional 5 V tolerant I/O, default PA12; alternate USART0_RTS/USART0_DE, TIMER0_ETI, EVENTOUT.
23 PA13 bidirectional 5 V tolerant I/O, default PA13; alternate IFRP_OUT, SWDIO.
24 PA14 bidirectional 5 V tolerant I/O, default PA14; alternate USART1_TX, SWCLK.
25 PA15 bidirectional 5 V tolerant I/O, default PA15; alternate SPI0_NSS, USART1_RX, TIMER1_CH0, TIMER1_ETI, EVENTOUT.
26 PB3 bidirectional 5 V tolerant I/O, default PB3; alternate SPI0_SCK, TIMER1_CH1, EVENTOUT.
27 PB4 bidirectional 5 V tolerant I/O, default PB4; alternate SPI0_MISO, TIMER2_CH0, EVENTOUT.
28 PB5 bidirectional 5 V tolerant I/O, default PB5; alternate SPI0_MOSI, I2C0_SMBA, TIMER15_BRKIN, TIMER2_CH1.
29 PB6 bidirectional 5 V tolerant I/O, default PB6; alternate I2C0_SCL, USART0_TX, TIMER15_CH0_ON.
30 PB7 bidirectional 5 V tolerant I/O, default PB7; alternate I2C0_SDA, USART0_RX, TIMER16_CH0_ON.
31 BOOT0 input Boot mode selection input, default function BOOT0.
32 VSS power_in Digital ground pin.

Key specifications

Parameter Value
Manufacturer GigaDevice Semicon Beijing
Package LQFP-32(7x7)
Category Single Chip Microcomputer/Microcontroller
Pins 32

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD 2.6 3.3 3.6 V 45
Analog supply voltage VDDA 2.6 3.3 3.6 V Same as VDD 45
Battery supply voltage VBAT 1.8 3.6 V 45
External voltage range VDD -0.3 3.6 V VSS - 0.3 to VSS + 3.6 44
External analog supply voltage VDDA -0.3 3.6 V VSSA - 0.3 to VSSA + 3.6 44
External battery supply voltage VBAT -0.3 3.6 V VSS - 0.3 to VSS + 3.6 44
Input voltage on 5V tolerant pin VIN -0.3 4 V VSS - 0.3 to VDD + 4.0; cannot exceed 5.5 V 44
Input voltage on other I/O VIN -0.3 4 V VSS - 0.3 to 4.0 44
Variations between different VDD power pins /ΔVDDX/ 50 mV 44
Variations between different ground pins /VSSX −VSS/ 50 mV 44
Maximum current for GPIO pins IIO -25 25 mA 44
Operating temperature range TA -40 85 °C 44
Power dissipation of LQFP32 PD 605 mW TA = 85°C 44
Storage temperature range TSTG -55 150 °C 44
Maximum junction temperature TJ 125 °C 44
AHB1 clock frequency fHCLK1 48 MHz 45
AHB2 clock frequency fHCLK2 48 MHz 45
APB1 clock frequency fAPB1 48 MHz 45
APB2 clock frequency fAPB2 48 MHz 45
VDD fall time rate tVDD 20 μs/v VDD fall time rate 45
Supply current (Deep-sleep mode) IDD + IDDA 263 1100 μA VDD= VDDA =3.3V, Regulator in run mode, IRC40K off, RTC off 47
Supply current (Standby mode) IDD + IDDA 5.5 27.5 μA VDD= VDDA =3.3V, LXTAL off, IRC40K off, RTC off 47
Supply current (Run mode) IDD + IDDA 18.5 mA VDD=VDDA=3.3V, HXTAL=8MHz, System clock=48 MHz, All peripherals enabled 46
HBM ESD voltage VESD(HBM) 5000 V TA=25 °C; JS-001-2014 52
CDM ESD voltage VESD(CDM) 500 V TA=25 °C; JS-002-2014 52
Latch-up I-test LU -100 100 mA TA=25 °C; JESD78 52
Latch-up Vsupply over voltage Vsupply 5.4 V TA=25 °C; JESD78 52
Crystal or ceramic frequency fHXTAL 4 8 32 MHz VDD=3.3V 52
HXTAL matching capacitance CHXTAL 20 30 pF 52
HXTAL duty cycle Ducy(HXTAL) 30 50 70 % 52
External clock frequency (HXTAL bypass) fHXTAL_ext 1 50 MHz VDD = 3.3 V 53
IRC8M accuracy, factory-trimmed ACCIRC8M -1 1 % VDD=VVDDA =3.3V, TA=25°C 54
IRC8M operating current IDDIRC8M+IDDAIRC8M 39 100 μA VDD=VVDDA =3.3V, fIRC8M=8MHz 54
IRC14M accuracy, factory-trimmed ACCIRC14M -1 1 % VDD=VCDDA =3.3V, TA=25°C 55
PLL input clock frequency fPLLIN 1 25 MHz 55
PLL output clock frequency fPLLOUT 16 72 MHz 55
PLL lock time tLOCK 300 μs 55
Flash endurance PECYC 100 kcycles TA = -40 °C ~ +85 °C 56
Word programming time tPROG 37.5 105 μs TA = -40°C ~ +85 °C 56
Page erase time tERASE 50 400 ms TA = -40°C ~ +85 °C 56
Mass erase time (32K) tMERASE(32K) 0.6 6 s TA = -40°C ~ +85 °C 56
NRST input low level voltage VIL(NRST) -0.3 0.3 V VDD = VDDA = 3.3 V; max printed as 0.3 VDD 56
NRST input high level voltage VIH(NRST) 0.7 V VDD = VDDA = 3.3 V; min printed 0.7 VDD, max VDD + 0.3 56
Standard IO low level input voltage VIL 0.3 V 2.6 V ≤ VDD = VDDA ≤ 3.3 V; printed 0.3 VDD 57
Standard IO high level input voltage VIH 0.7 V 2.6 V ≤ VDD = VDDA ≤ 3.3 V; printed 0.7 VDD 57
ADC operating voltage VDDA 2.6 3.3 3.6 V 59
ADC clock fADC 0.6 14 MHz 59
ADC sampling rate fS 0.04 1 MSPS 12-bit 59
ADC external input impedance RAIN 54.8 kΩ See Equation 1 59
ADC sampling time ts 0.11 17.11 μs fADC = 14 MHz 59
Thermal resistance junction-to-ambient LQFP32 θJA 66.11 °C/W Natural convection, 2S2P PCB 75
Thermal resistance junction-to-case LQFP32 θJC 30.06 °C/W Cold plate, 2S2P PCB 76

CAD (KiCad official)

  • Symbol: GD32F130K6T6
  • Footprint: Package_QFP:LQFP-32_7x7mm_P0.8mm
  • 3D model: LQFP-32(7x7) (KiCad packages3D, STEP)
  • 3D model files: gd32f130k6t6-etched.step / gd32f130k6t6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gd32f130k6t6.step / gd32f130k6t6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GigaDevice Semicon Beijing datasheet (81 pp, sha256 9e5f1a95f4b104c0, retrieved 2026-10-24, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF