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GD32F105RBT6
Public Made by Adomby adom
GigaDevice Semicon Beijing Microcontrollers (MCU/MPU/SOC), LQFP-64(10x10). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownGD32F105RBT6
GigaDevice Semicon Beijing · Microcontrollers (MCU/MPU/SOC) · LQFP-64(10x10)
GD32F105RBT6 from GigaDevice Semicon Beijing, in a LQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VBAT | power_in | Default function VBAT, listed as a power pin in the pin definition table. |
| 2 | PC13-TAMPER-RTC | bidirectional | Default function PC13; alternate function TAMPER-RTC. |
| 3 | PC14-OSC32_IN | bidirectional | Default function PC14; alternate function OSC32_IN (low-speed external oscillator input). |
| 4 | PC15-OSC32_OUT | bidirectional | Default function PC15; alternate function OSC32_OUT (low-speed external oscillator output). |
| 5 | OSC_IN | input | Default function OSC_IN (high-speed external oscillator input); can be remapped to PD0 on this package. |
| 6 | OSC_OUT | output | Default function OSC_OUT (high-speed external oscillator output); can be remapped to PD1 on this package. |
| 7 | NRST | bidirectional | Default function NRST; the pin definition table lists its type as I/O. |
| 8 | PC0 | bidirectional | Default function PC0; alternate function ADC_IN10. |
| 9 | PC1 | bidirectional | Default function PC1; alternate function ADC_IN11. |
| 10 | PC2 | bidirectional | Default function PC2; alternate function ADC_IN12. |
| 11 | PC3 | bidirectional | Default function PC3; alternate function ADC_IN13. |
| 12 | VSSA | power_in | Analog ground pin for the analog domain (default function VSSA). |
| 13 | VDDA | power_in | Analog supply pin; the block diagram shows the ADC and DAC powered by VDDA. |
| 14 | PA0-WKUP | bidirectional | Default function PA0; alternate functions WKUP, USART2_CTS, ADC_IN0, TM2_CH1_ETR, TM5_CH1 and TM8_ETR. |
| 15 | PA1 | bidirectional | Default function PA1; alternate functions USART2_RTS, ADC_IN1, TM2_CH2 and TM5_CH2. |
| 16 | PA2 | bidirectional | Default function PA2; alternate functions USART2_TX, ADC_IN2, TM2_CH3, TM5_CH3 and TM9_CH1 (remap). |
| 17 | PA3 | bidirectional | Default function PA3; alternate functions USART2_RX, ADC_IN3, TM2_CH4, TM5_CH4 and TM9_CH2 (remap). |
| 18 | VSS_4 | power_in | Ground pin VSS_4 for the digital domain. |
| 19 | VDD_4 | power_in | Digital supply pin VDD_4; the device operates from a 2.6 to 3.6 V supply per the general description. |
| 20 | PA4 | bidirectional | Default function PA4; alternate functions SPI1_NSS, USART2_CK, ADC12_IN4 and DAC_OUT1; remap SPI3_NSS and I2S3_WS. |
| 21 | PA5 | bidirectional | Default function PA5; alternate functions SPI1_SCK, ADC12_IN5 and DAC_OUT2. |
| 22 | PA6 | bidirectional | Default function PA6; alternate functions SPI1_MISO, ADC12_IN6, TM3_CH1, TM8_BKIN and TM13_CH1; remap TM1_BKIN. |
| 23 | PA7 | bidirectional | Default function PA7; alternate functions SPI1_MOSI, ADC12_IN7, TM3_CH2, TM8_CH1N and TM14_CH1; remap TM1_CH1N. |
| 24 | PC4 | bidirectional | Default function PC4; alternate function ADC12_IN14. |
| 25 | PC5 | bidirectional | Default function PC5; alternate function ADC12_IN15. |
| 26 | PB0 | bidirectional | Default function PB0; alternate functions ADC12_IN8, TM3_CH3 and TM8_CH2N; remap TM1_CH2N. |
| 27 | PB1 | bidirectional | Default function PB1; alternate functions ADC12_IN9, TM3_CH4 and TM8_CH3N; remap TM1_CH3N. |
| 28 | PB2 | bidirectional | Default function PB2/BOOT1; 5 V tolerant I/O per the pin definition table. |
| 29 | PB10 | bidirectional | Default function PB10 (5 V tolerant); alternate functions I2C2_SCL and USART3_TX; remap TM2_CH3. |
| 30 | PB11 | bidirectional | Default function PB11 (5 V tolerant); alternate functions I2C2_SDA and USART3_RX; remap TM2_CH4. |
| 31 | VSS_1 | power_in | Ground pin VSS_1 for the digital domain. |
| 32 | VDD_1 | power_in | Digital supply pin VDD_1; the device operates from a 2.6 to 3.6 V supply per the general description. |
| 33 | PB12 | bidirectional | Default function PB12 (5 V tolerant); alternate functions SPI2_NSS, I2C2_SMBAI, USART3_CK, TM1_BKIN, I2S2_WS and CAN2_RX. |
| 34 | PB13 | bidirectional | Default function PB13 (5 V tolerant); alternate functions SPI2_SCK, USART3_CTS, TM1_CH1N, I2S2_CK and CAN2_TX. |
| 35 | PB14 | bidirectional | Default function PB14 (5 V tolerant); alternate functions SPI2_MISO, USART3_RTS, TM1_CH2N and TM12_CH1. |
| 36 | PB15 | bidirectional | Default function PB15 (5 V tolerant); alternate functions SPI2_MOSI, TM1_CH3N, I2S2_SD and TM12_CH2. |
| 37 | PC6 | bidirectional | Default function PC6 (5 V tolerant); alternate functions I2S2_MCK and TM8_CH1; remap TM3_CH1. |
| 38 | PC7 | bidirectional | Default function PC7 (5 V tolerant); alternate functions I2S3_MCK and TM8_CH2; remap TM3_CH2. |
| 39 | PC8 | bidirectional | Default function PC8 (5 V tolerant); alternate function TM8_CH3; remap TM3_CH3. |
| 40 | PC9 | bidirectional | Default function PC9 (5 V tolerant); alternate function TM8_CH4; remap TM3_CH4. |
| 41 | PA8 | bidirectional | Default function PA8 (5 V tolerant); alternate functions USART1_CK, TM1_CH1 and MCO. |
| 42 | PA9 | bidirectional | Default function PA9 (5 V tolerant); alternate functions USART1_TX, TM1_CH2 and OTG_FS_VBUS. |
| 43 | PA10 | bidirectional | Default function PA10 (5 V tolerant); alternate functions USART1_RX, TM1_CH3 and OTG_FS_ID. |
| 44 | PA11 | bidirectional | Default function PA11 (5 V tolerant); alternate functions USART1_CTS, CANRX, OTG_FS_DM and TM1_CH4. |
| 45 | PA12 | bidirectional | Default function PA12 (5 V tolerant); alternate functions USART1_RTS, OTG_FS_DP, CAN1_TX and TM1_ETR. |
| 46 | PA13 | bidirectional | Default function JTMS/SWDIO (5 V tolerant); remap PA13. |
| 47 | VSS_2 | power_in | Ground pin VSS_2 for the digital domain. |
| 48 | VDD_2 | power_in | Digital supply pin VDD_2; the device operates from a 2.6 to 3.6 V supply per the general description. |
| 49 | PA14 | bidirectional | Default function JTCK/SWCLK (5 V tolerant); remap PA14. |
| 50 | PA15 | bidirectional | Default function JTDI (5 V tolerant); alternate functions SPI3_NSS and I2S3_WS; remap TM2_CH1_ETR, PA15 and SPI1_NSS. |
| 51 | PC10 | bidirectional | Default function PC10 (5 V tolerant); alternate function UART4_TX; remap USART3_TX, SPI3_SCK and I2S3_CK. |
| 52 | PC11 | bidirectional | Default function PC11 (5 V tolerant); alternate function UART4_RX; remap USART3_RX and SPI3_MISO. |
| 53 | PC12 | bidirectional | Default function PC12 (5 V tolerant); alternate function UART5_TX; remap USART3_CK, SPI3_MOSI and I2S3_SD. |
| 54 | PD2 | bidirectional | Default function PD2 (5 V tolerant); alternate functions TM3_ETR and UART5_RX. |
| 55 | PB3 | bidirectional | Default function JTDO (5 V tolerant); alternate functions SPI3_SCK and I2S3_CK; remap PB3, TRACESWO, TM2_CH2 and SPI1_SCK. |
| 56 | PB4 | bidirectional | Default function NJTRST (5 V tolerant); alternate function SPI3_MISO; remap TM3_CH1, PB4 and SPI1_MISO. |
| 57 | PB5 | bidirectional | Default function PB5; alternate functions I2C1_SMBAI, SPI3_MOSI and I2S3_SD; remap TM3_CH2, SPI1_MOSI and CAN2_RX. |
| 58 | PB6 | bidirectional | Default function PB6 (5 V tolerant); alternate functions I2C1_SCL and TM4_CH1; remap USART1_TX and CAN2_TX. |
| 59 | PB7 | bidirectional | Default function PB7 (5 V tolerant); alternate functions I2C1_SDA, TM4_CH2 and EXMC_NADV; remap USART1_RX. |
| 60 | BOOT0 | input | Boot pin BOOT0 (default function), which selects the boot mode together with the BOOT1 option. |
| 61 | PB8 | bidirectional | Default function PB8 (5 V tolerant); alternate functions TM4_CH3 and TM10_CH1; remap I2C1_SCL and CAN1_RX. |
| 62 | PB9 | bidirectional | Default function PB9 (5 V tolerant); alternate functions TM4_CH4 and TM11_CH1; remap I2C1_SDA and CAN1_TX. |
| 63 | VSS_3 | power_in | Ground pin VSS_3 for the digital domain. |
| 64 | VDD_3 | power_in | Digital supply pin VDD_3; the device operates from a 2.6 to 3.6 V supply per the general description. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | GigaDevice Semicon Beijing |
| Package | LQFP-64(10x10) |
| Category | Embedded Processors & Controllers |
| Pins | 64 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage on other I/O | VIN | 4 | V | 32 | |||
| Maximum current for GPIO pins | IIO | 25 | mA | 32 | |||
| Operating temperature range | TA | -40 | 85 | °C | 32 | ||
| Storage temperature range | TSTG | -55 | 150 | °C | 32 | ||
| Maximum junction temperature | TJ | 125 | °C | 32 | |||
| Supply voltage | VDD | 2.6 | 3.3 | 3.6 | V | 32 | |
| Analog supply voltage | VDDA | 2.6 | 3.3 | 3.6 | V | Same as VDD | 32 |
| Battery supply voltage | VBAT | 1.8 | 3.6 | V | 32 | ||
| Supply current (Deep-Sleep mode) | IDD | 0.65 | 1.4 | mA | VDD=VBAT=3.3V, All clock off, LSI on, RTC on, All GPIOs analog mode | 33 | |
| Power on reset threshold | VPOR | 2.32 | 2.4 | 2.48 | V | 34 | |
| Power down reset threshold | VPDR | 2.27 | 2.35 | 2.43 | V | 34 | |
| High Speed External oscillator (HSE) frequency | fHSE | 3 | 8 | 32 | MHz | VDD=3.3V | 35 |
| Recommended load capacitance on OSC_IN and OSC_OUT | CHSE | 20 | 30 | pF | 35 | ||
| HSE oscillator duty cycle | DHSE | 48 | 50 | 52 | % | 35 | |
| Low Speed External oscillator (LSE) frequency | fLSE | 32.768 | 1000 | KHz | VDD=VBAT=3.3V | 36 | |
| Recommended load capacitance on OSC32_IN and OSC32_OUT | CLSE | 15 | pF | 36 | |||
| LSE oscillator duty cycle | DLSE | 48 | 50 | 52 | % | 36 | |
| HSI oscillator Frequency accuracy, Factory-trimmed | ACCHSI | -2.5 | 1.5 | % | VDD=3.3V, TA=-40°C ~+105°C | 36 | |
| HSI oscillator Frequency accuracy, Factory-trimmed | ACCHSI | -1.2 | 1.2 | % | VDD=3.3V, TA=0°C ~ +85°C | 36 | |
| HSI oscillator Frequency accuracy, Factory-trimmed | ACCHSI | -1 | 1 | % | VDD=3.3V, TA=25°C | 36 | |
| HSI oscillator duty cycle | DHSI | 48 | 50 | 52 | % | VDD=3.3V, fHSI=8MHz | 36 |
| HSI oscillator operating current | IDDHSI | 80 | 100 | μA | VDD=3.3V, fHSI=8MHz | 36 | |
| HSI oscillator startup time | tSUHSI | 1 | 2 | us | VDD=3.3V, fHSI=8MHz | 36 | |
| Low Speed Internal oscillator (LSI) frequency | fLSI | 30 | 40 | 60 | KHz | VDD=VBAT=3.3V, TA=-40°C ~ +85°C | 36 |
| LSI oscillator operating current | IDDLSI | 1 | 2 | μA | VDD=VBAT=3.3V, TA=25°C | 36 | |
| LSI oscillator startup time | tSULSI | 80 | μs | VDD=VBAT=3.3V, TA=25°C | 36 | ||
| PLL input clock frequency | fPLLIN | 1 | 8 | 25 | MHz | 37 | |
| PLL output clock frequency | fPLL | 16 | 108 | MHz | 37 | ||
| Number of guaranteed program/erase cycles before failure (Endurance) | PECYC | 100 | kcycles | TA=-40°C ~ +85°C | 37 | ||
| Data retention time | tRET | 20 | years | TA=125°C | 37 | ||
| Word programming time | tPROG | 200 | 400 | us | TA=-40°C ~ +85°C | 37 | |
| Page erase time | tERASE | 60 | 100 | 450 | ms | TA=-40°C ~ +85°C | 37 |
| Mass erase time | tMERASE | 3.2 | 9.6 | s | TA=-40°C ~ +85°C | 37 | |
| Standard IO Low level input voltage | VIL | -0.3 | 0.95 | V | VDD=2.6V | 37 | |
| 5V-tolerant IO Low level input voltage | VIL | -0.3 | 0.9 | V | VDD=2.6V | 37 | |
| Standard IO High level input voltage | VIH | 1.2 | 4 | V | VDD=2.6V | 37 | |
| 5V-tolerant IO High level input voltage | VIH | 1.5 | 5.5 | V | VDD=2.6V | 37 | |
| Low level output voltage | VOL | 0.2 | V | VDD=2.6V | 37 | ||
| High level output voltage | VOH | 2.3 | V | VDD=2.6V | 37 | ||
| Internal pull-up resistor | RPU | 30 | 40 | 50 | kΩ | VIN=VSS | 37 |
| Internal pull-down resistor | RPD | 30 | 40 | 50 | kΩ | VIN=VDD | 37 |
| ADC clock | fADC | 0.6 | 14 | MHz | 38 | ||
| ADC conversion time | fADCCONV | 1 | 18 | μs | fADC=14MHz | 38 | |
| Input sampling switch resistance | RADC | 0.5 | kΩ | 38 | |||
| Startup time | tSU | 1 | μs | 38 | |||
| Load resistance | RLOAD | 5 | kΩ | Resistive load vs. VSSA with buffer ON | 38 | ||
| Load capacitance | CLOAD | 50 | pF | No pin/pad capacitance included | 38 | ||
| Differential non-linearity error | DNE | -3 | 3 | LSB | DAC in 12-bit | 38 | |
| Integral non-linearity | INL | -4 | 4 | LSB | DAC in 12-bit | 38 | |
| Offset error | Offset | -12 | 12 | LSB | DAC in 12-bit, VREF+ = 3.6 V | 38 | |
| Gain error | GE | -0.5 | 0.5 | % | DAC in 12-bit | 38 | |
| SCL clock frequency | fSCL | 0 | 100 | KHz | Standard mode | 38 | |
| SCL clock frequency | fSCL | 0 | 400 | KHz | Fast mode | 38 | |
| SCL clock high time | tSCL(H) | 4 | ns | Standard mode | 38 | ||
| SCL clock high time | tSCL(H) | 0.6 | ns | Fast mode | 38 | ||
| SCL clock low time | tSCL(L) | 4.7 | ns | Standard mode | 38 | ||
| SCL clock low time | tSCL(L) | 1.3 | ns | Fast mode | 38 | ||
| SCK clock frequency | fSCK | 18 | MHz | 39 | |||
| SCK clock high time | tSCK(H) | 19 | ns | 39 | |||
| SCK clock low time | tSCK(L) | 19 | ns | 39 |
CAD (KiCad official)
- Symbol:
GD32F105RBT6 - Footprint:
Package_QFP:LQFP-64_10x10mm_P0.5mm - 3D model: LQFP-64(10x10) (KiCad packages3D, STEP)
- 3D model files:
gd32f105rbt6-etched.step/gd32f105rbt6-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);gd32f105rbt6.step/gd32f105rbt6.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: GigaDevice Semicon Beijing datasheet (43 pp, sha256
8c1cff9a4e1adebc, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).