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Contents

README

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GD32E103CBT6

GigaDevice Semicon Beijing · Microcontrollers (MCU/MPU/SOC) · LQFP-48(7x7)

GD32E103CBT6 from GigaDevice Semicon Beijing, in a LQFP-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBAT power_in Backup power supply pin (default function VBAT); the pin-definition table gives no voltage limits for it.
2 PC13-TAMPER-RTC bidirectional General-purpose I/O PC13 with alternate function RTC_TAMPER; the I/O level is not marked 5VT in the table.
3 PC14-OSC32IN bidirectional General-purpose I/O PC14 with alternate function OSC32IN for the 32.768 kHz low-speed crystal (LXTAL); the I/O level is not marked 5VT.
4 PC15-OSC32OUT bidirectional General-purpose I/O PC15 with alternate function OSC32OUT for the 32.768 kHz low-speed crystal (LXTAL); the I/O level is not marked 5VT.
5 PD0-OSCIN input Default function OSCIN (high-speed crystal input, 4-32 MHz HXTAL); remappable to PD0, and PD0 cannot be used for EXTI in this package.
6 PD1-OSCOUT output Default function OSCOUT (high-speed crystal output); remappable to PD1, and PD1 cannot be used for EXTI in this package.
7 NRST bidirectional Reset pin (default function NRST).
8 VSSA power_in Analog ground pin for the ADC/DAC and analog circuitry (default function VSSA); VREF- is internally connected to VSSA in this package.
9 VDDA power_in Analog supply pin (default function VDDA); VREF+ is internally connected to VDDA in this package.
10 PA0-WKUP bidirectional General-purpose I/O PA0 with alternate functions WKUP, USART1_CTS, ADC01_IN0, TIMER1_CH0_ETI and TIMER4_CH0; the I/O level is not marked 5VT.
11 PA1 bidirectional General-purpose I/O PA1 with alternate functions USART1_RTS, ADC01_IN1, TIMER4_CH1 and TIMER1_CH1; the I/O level is not marked 5VT.
12 PA2 bidirectional General-purpose I/O PA2 with alternate functions USART1_TX, TIMER4_CH2, ADC01_IN2, TIMER8_CH0, TIMER1_CH2 and SPI0_IO2; the I/O level is not marked 5VT.
13 PA3 bidirectional General-purpose I/O PA3 with alternate functions USART1_RX, TIMER4_CH3, ADC01_IN3, TIMER1_CH3, TIMER8_CH1 and SPI0_IO3; the I/O level is not marked 5VT.
14 PA4 bidirectional General-purpose I/O PA4 with alternate functions SPI0_NSS, USART1_CK, DAC_OUT0 and ADC01_IN4, remappable to SPI2_NSS and I2S2_WS; the I/O level is not marked 5VT.
15 PA5 bidirectional General-purpose I/O PA5 with alternate functions SPI0_SCK, ADC01_IN5 and DAC_OUT1; the I/O level is not marked 5VT.
16 PA6 bidirectional General-purpose I/O PA6 with alternate functions SPI0_MISO, ADC01_IN6 and TIMER2_CH0, TIMER12_CH0 (TIMER12_CH0 as printed), remappable to TIMER0_BKIN; the I/O level is not marked 5VT.
17 PA7 bidirectional General-purpose I/O PA7 with alternate functions SPI0_MOSI, ADC01_IN7, TIMER2_CH1 and TIMER13_CH0, remappable to TIMER0_CH0_ON; the I/O level is not marked 5VT.
18 PB0 bidirectional General-purpose I/O PB0 with alternate functions ADC01_IN8 and TIMER2_CH2, remappable to TIMER0_CH1_ON; the I/O level is not marked 5VT.
19 PB1 bidirectional General-purpose I/O PB1 with alternate functions ADC01_IN9 and TIMER2_CH3, remappable to TIMER0_CH2_ON; the I/O level is not marked 5VT.
20 PB2 bidirectional General-purpose 5V-tolerant I/O PB2 that also serves as BOOT1 (default function PB2, BOOT1).
21 PB10 bidirectional 5V-tolerant I/O PB10 with alternate functions I2C1_SCL and USART2_TX, remappable to TIMER1_CH2.
22 PB11 bidirectional 5V-tolerant I/O PB11 with alternate functions I2C1_SDA and USART2_RX, remappable to TIMER1_CH3.
23 VSS_1 power_in Digital ground pin (default function VSS_1).
24 VDD_1 power_in Digital supply pin (default function VDD_1).
25 PB12 bidirectional 5V-tolerant I/O PB12 with alternate functions SPI1_NSS, I2S1_WS, I2C1_SMBA, USART2_CK, TIMER0_BKIN and CAN1_RX.
26 PB13 bidirectional 5V-tolerant I/O PB13 with alternate functions SPI1_SCK, I2S1_CK, USART2_CTS, TIMER0_CH0_ON, CAN1_TX and I2C1_TXFRAME.
27 PB14 bidirectional 5V-tolerant I/O PB14 with alternate functions SPI1_MISO, USART2_RTS, TIMER0_CH1_ON and TIMER11_CH0.
28 PB15 bidirectional 5V-tolerant I/O PB15 with alternate functions SPI1_MOSI, I2S1_SD, TIMER0_CH2_ON and TIMER11_CH11 (as printed).
29 PA8 bidirectional 5V-tolerant I/O PA8 with alternate functions USART0_CK, TIMER0_CH0, CK_OUT0, VCORE, USBFS_SOF and CTC_SYNC.
30 PA9 bidirectional 5V-tolerant I/O PA9 with alternate functions USART0_TX, TIMER0_CH1 and USBFS_VBUS.
31 PA10 bidirectional 5V-tolerant I/O PA10 with alternate functions USART0_RX, TIMER0_CH2, USBFS_ID and V1REF.
32 PA11 bidirectional 5V-tolerant I/O PA11 with alternate functions USART0_CTS, CAN0_RX, USBFS_DM and TIMER0_CH3.
33 PA12 bidirectional 5V-tolerant I/O PA12 with alternate functions USART0_RTS, CAN0_TX, USBFS_DP and TIMER0_ETI.
34 PA13 bidirectional 5V-tolerant I/O PA13, default function JTMS/SWDIO, remappable to PA13.
35 VSS_2 power_in Digital ground pin (default function VSS_2).
36 VDD_2 power_in Digital supply pin (default function VDD_2).
37 PA14 bidirectional 5V-tolerant I/O PA14, default function JTCK/SWCLK, remappable to PA14.
38 PA15 bidirectional 5V-tolerant I/O PA15, default function JTDI, alternate SPI2_NSS and I2S2_WS, remappable to TIMER1_CH0_ETI, TIMER1_ETI, PA15 and SPI0_NSS.
39 PB3 bidirectional 5V-tolerant I/O PB3, default function JTDO, alternate SPI2_SCK and I2S2_CK, remappable to TIMER1_CH1, PB3, TRACESWO and SPI0_SCK.
40 PB4 bidirectional 5V-tolerant I/O PB4, default function NJTRST, alternate SPI2_MISO and I2C0_TXFRAME, remappable to TIMER2_CH0, PB4 and SPI0_MISO.
41 PB5 bidirectional I/O PB5 with alternate functions I2C0_SMBA, SPI2_MOSI and I2S2_SD, remappable to TIMER2_CH1, SPI0_MOSI and CAN1_RX; the I/O level is not marked 5VT.
42 PB6 bidirectional 5V-tolerant I/O PB6 with alternate functions I2C0_SCL and TIMER3_CH0, remappable to USART0_TX, CAN1_TX and SPI0_IO2.
43 PB7 bidirectional 5V-tolerant I/O PB7 with alternate functions I2C0_SDA and TIMER3_CH1, remappable to USART0_RX and SPI0_IO3.
44 BOOT0 input Boot mode selection input (default function BOOT0).
45 PB8 bidirectional 5V-tolerant I/O PB8 with alternate functions TIMER3_CH2 and TIMER9_CH0, remappable to I2C0_SCL and CAN0_RX.
46 PB9 bidirectional 5V-tolerant I/O PB9 with alternate functions TIMER3_CH3 and TIMER10_CH0, remappable to I2C0_SDA and CAN0_TX.
47 VSS_3 power_in Digital ground pin (default function VSS_3).
48 VDD_3 power_in Digital supply pin (default function VDD_3).

Key specifications

Parameter Value
Manufacturer GigaDevice Semicon Beijing
Package LQFP-48(7x7)
Category Embedded Processors & Controllers
Pins 48

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage on 5V tolerant pin (maximum) VIN 6.5 V 5V tolerant pin; note (3): VIN maximum value cannot exceed 6.5 V 43
Input voltage on other I/O (maximum) VIN 3.6 V Input voltage on other I/O 43
Variation between different VDD power pins /ΔVDDX/ 50 mV Variations between different VDD power pins 43
Variation between different ground pins /VSSX −VSS/ 50 mV Variations between different ground pins 43
Maximum current for GPIO pins IIO -25 25 mA Maximum current for GPIO pins 43
Operating temperature range TA -40 85 °C Operating temperature range 43
Power dissipation of LQFP48 PD 574 mW Power dissipation at TA = 85°C of LQFP48 43
Storage temperature range TSTG -55 150 °C Storage temperature range 43
Maximum junction temperature TJ 125 °C Maximum junction temperature 43
Supply voltage VDD 1.71 3.3 3.6 V 43
Analog supply voltage (ADC not used) VDDA 1.71 3.3 3.6 V ADC not used 43
Analog supply voltage (ADC used) VDDA 2.4 3.3 3.6 V ADC used 43
Battery supply voltage VBAT 1.71 3.6 V 43
AHB clock frequency fHCLK 120 MHz 44
APB1 clock frequency fAPB1 60 MHz 44
APB2 clock frequency fAPB2 120 MHz 44
VDD rise time rate tVDD 0 μs/V Power up; printed maximum is ∞ (not numeric) 44
VDD fall time rate tVDD 20 μs/V Power down; printed maximum is ∞ (not numeric) 44
ESD HBM voltage VESD(HBM) 5000 V TA = 25 °C; JESD22-A114 53
ESD CDM voltage VESD(CDM) 800 V TA = 25 °C; JESD22-C101 53
Static latch-up I-test LU -200 200 mA TA = 25 °C; JESD78 54
Latch-up supply overvoltage Vsupply 5.4 V Vsupply over voltage 54
Crystal or ceramic frequency (HXTAL) fHXTAL 4 8 32 MHz 1.71 ≤ VDD ≤ 3.6 V 54
Crystal or ceramic duty cycle (HXTAL) Ducy(HXTAL) 30 50 70 % 54
External clock frequency (HXTAL bypass) fHXTAL_ext 1 50 MHz VDD = 3.3 V 54
OSCIN high or low time (HXTAL bypass) tH/L(HXTAL) 5 ns 54
OSCIN rise or fall time (HXTAL bypass) tR/F(HXTAL) 10 ns 54
External user clock frequency (LXTAL bypass) fLXTAL_ext 32.768 1000 kHz VDD = 3.3 V 55
OSC32IN rise or fall time (LXTAL bypass) tR/F(LXTAL) 50 ns 55
IRC8M frequency accuracy, factory-trimmed ACCIRC8M -2.5 2.5 % VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C 56
IRC8M frequency accuracy, factory-trimmed ACCIRC8M -1.8 1.8 % VDD = VDDA = 3.3 V, TA = 0 °C ~ +85 °C 56
IRC8M frequency accuracy, factory-trimmed ACCIRC8M -1 1 % VDD = VDDA = 3.3 V, TA = 25 °C 56
Low speed internal oscillator (IRC40K) frequency fIRC40K 28 40 60 kHz VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C 56
IRC48M frequency accuracy, factory-trimmed ACCIRC48M -4 5 % VDD = VDDA = 3.3 V, TA = -40 °C ~ +85 °C 57
IRC48M frequency accuracy, factory-trimmed ACCIRC48M -3 3 % VDD = VDDA = 3.3 V, TA = 0 °C ~ +85 °C 57
IRC48M frequency accuracy, factory-trimmed ACCIRC48M -2 2 % VDD = VDDA = 3.3 V, TA = 25 °C 57
PLL input clock frequency fPLLIN 1 8 25 MHz 57
PLL output clock frequency fPLLOUT 16 120 MHz 57
VCO output frequency fVCO 32 240 MHz 57
PLL lock time tLOCK 300 μs 57
Number of guaranteed program/erase cycles (endurance) PECYC 100 kcycles TA = -40 °C ~ +85 °C 58
Data retention time tRET 10 years 10k cycles at TA = 85 °C 58
Word programming time tPROG 37 44 μs TA = -40 °C ~ +85 °C 58
Page erase time tERASE 3.2 4 ms TA = -40 °C ~ +85 °C 58
Mass erase time tMERASE 8 10 ms TA = -40 °C ~ +85 °C 58
NRST input low level voltage VIL(NRST) -0.5 V 1.8 V ≤ VDD = VDDA ≤ 3.6 V; printed maximum is 0.3 VDD (not numeric) 58
Low level output voltage (5V/standard I/O) VOL 0.11 V IIO = +8 mA, VDD = 3.3 V 59
Low level output voltage (5V/standard I/O) VOL 0.28 V IIO = +20 mA, VDD = 3.3 V 59
High level output voltage (5V/standard I/O) VOH 3.14 V IIO = +8 mA, VDD = 3.3 V 59
High level output voltage (5V/standard I/O) VOH 2.91 V IIO = +20 mA, VDD = 3.3 V 59
ADC clock frequency fADC 0.1 42 MHz 61
Sampling time ts 0.036 5.7 μs fADC = 42 MHz 61
ADC startup time tSU 1 μs 61
DAC resistive load with buffer ON RLOAD 5 kΩ Resistive load with buffer ON 63
DAC load capacitance CLOAD 50 pF No pin/pad capacitance included 63
USBFS static output level high VOH 2.8 3.3 3.6 V RL of 15 kΩ to VSS 66
USBFS static output level low VOL 0.064 0.3 V RL of 1.0 kΩ to 3.6 V 66
Junction-to-ambient thermal resistance (LQFP48) ΘJA 69.64 °C/W TA = 85°C, Natural convection, 2S2P PCB 77
Junction-to-board thermal resistance (LQFP48) ΘJB 43.16 °C/W TA = 25°C, Cold plate, 2S2P PCB 77
Junction-to-case thermal resistance (LQFP48) ΘJC 25.36 °C/W TA = 25°C, Cold plate, 2S2P PCB 77

CAD (KiCad official)

  • Symbol: GD32E103CBT6
  • Footprint: Package_QFP:LQFP-48_7x7mm_P0.5mm
  • 3D model: LQFP-48(7x7) (KiCad packages3D, STEP)
  • 3D model files: gd32e103cbt6-etched.step / gd32e103cbt6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); gd32e103cbt6.step / gd32e103cbt6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: GigaDevice Semicon Beijing datasheet (80 pp, sha256 b9866c3233b5ee3b, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF