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GCM1555C1H201FA16D

MURATA ELECTRONICS · Global Sourcing Parts · 0402

GCM1555C1H201FA16D from MURATA ELECTRONICS, in a 0402. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised capacitor; either orientation.
2 2 passive Terminal 2 of an unpolarised capacitor; either orientation.

Key specifications

Parameter Value
Manufacturer MURATA ELECTRONICS
Package 0402
Category Global Sourcing Parts
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Capacitance tolerance C -1 1 % Printed +/-1% (tolerance code F), 200pF 1
Temperature coefficient (TCR) -30 30 ppm/℃ Temp. range 25 to 125℃, reference temp 25℃ (0 +/-30 ppm/℃) 1
Capacitance drift (temperature step) -0.2 0.2 % Within +/-0.2% or +/-0.05pF, whichever is larger; measured steps 1,3,5 over step 3 5
Capacitance drift (temperature step) -0.05 0.05 pF Within +/-0.2% or +/-0.05pF, whichever is larger 5
Rated voltage (DC) 50 V DC rated voltage; applied voltage must not exceed rated voltage 1
Operating temperature range -55 125 ℃ Operating temp. range, including self-heating 1
Storage temperature (standard condition) 5 40 ℃ Standard storage condition; recommendation less than 30℃ 10
Storage relative humidity (standard condition) 20 70 % Standard storage condition 10
Capacitance change - moisture resistance -3 3 % Moisture resistance, +25 to +65℃, 80 to 98%RH 2
Q - moisture resistance Q 350 - Moisture resistance test, +25 to +65℃, 80 to 98%RH 2
Insulation resistance - moisture resistance IR 10000 MΩ Room temp., after moisture resistance test 2
Capacitance change - temperature cycling -2.5 2.5 % 1000 cycles temperature cycling 2
Q - temperature cycling Q 1000 - 1000 cycles temperature cycling 2
Insulation resistance - temperature cycling IR 10000 MΩ Room temp., after 1000 cycles 2
Capacitance change - high temperature exposure -2.5 2.5 % Test temp 150+/-3℃, 1000+/-12h 2
Q - high temperature exposure Q 1000 - Test temp 150+/-3℃, 1000+/-12h 2
Insulation resistance - high temperature exposure IR 10000 MΩ Room temp., after 150+/-3℃, 1000+/-12h 2
Insulation resistance - ESD IR 10000 MΩ Per AEC-Q200-002, total of 36 times; room temp. 3
Insulation resistance - resistance to soldering heat IR 10000 MΩ Solder bath 260+/-5℃, 10+/-1s, Sn-3.0Ag-0.5Cu 3
Insulation resistance - vibration IR 10000 MΩ 10 to 2000 to 10Hz, 20 min, total amplitude 1.5mm, 3 directions 3
Insulation resistance - mechanical shock IR 10000 MΩ Half-sine, peak 1500g, holding 0.5ms, 18 shocks 3
Insulation resistance - resistance to solvents IR 10000 MΩ Per MIL-STD-202 Method 215 3
Capacitance change - operational life -3 3 % Max operating temp +/-3℃, 1000+/-12h, rated voltage and 1.3 Vdc 3
Q - operational life Q 350 - Max operating temp, 1000+/-12h 3
Insulation resistance - operational life IR 1000 MΩ Room temp., after max operating temp, 1000+/-12h 3
Capacitance change - biased humidity -3 3 % 85+/-3℃, 80 to 85%RH 3
Q - biased humidity Q 200 - 85+/-3℃, 80 to 85%RH 3
Insulation resistance - biased humidity IR 1000 MΩ Room temp., after 85+/-3℃, 80 to 85%RH 3
Beam load destruction strength 8 N Destruction value; stress load speed 0.5mm/s 4
Capacitance change - board flex -5 5 % Flexure 3mm, holding 60s, reflow mounted 4
Insulation resistance (high temperature) IR 10000 MΩ Measurement temp 125℃, rated voltage, charging 2min 4
Insulation resistance (room temperature) IR 100000 MΩ Measurement temp 25℃, rated voltage, charging 2min 4
Q / dissipation factor Q 1000 - Measurement temp 25℃, 1.0+/-0.1MHz, 0.5 to 5.0Vrms 4
Solderability (terminations soldered) 95 % Sn-3.0Ag-0.5Cu at 245+/-5℃, 5+0/-0.5s; after 155℃ 4h pre-treatment 4
Reflow peak temperature (lead-free) 240 260 ℃ Lead-free solder Sn-3.0Ag-0.5Cu reflow, air or N2 16
Reflow temperature differential (GC□15 series) ΔT 190 ℃ Standard reflow conditions, GC□ 03/15/18/21/31 series 16
Chip length L L -0.05 1 0.05 mm Dimension 1.0+/-0.05 mm (1005M / 0402 chip) 1
Chip width W W -0.05 0.5 0.05 mm Dimension 0.5+/-0.05 mm 1
Chip thickness T T -0.05 0.5 0.05 mm Dimension 0.5+/-0.05 mm 1
Terminal width e e 0.15 0.35 mm Dimension e, 0.15 to 0.35 mm 1
Terminal dimension g g 0.3 mm Dimension g, 0.3 mm min. 1
Rated capacitance C 200 pF 25℃, 1.0+/-0.1MHz, 0.5 to 5.0Vrms 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Capacitance or Capacitance Change Capacitance:Within the specified initial value. Kind of Solder Sn-3.0Ag-0.5Cu(Lead Free Solder) Q or D.F. Within the specified initial value. Test Temperature 260+/-5 3

CAD (KiCad official)

  • Symbol: GCM1555C1H201FA16D
  • Footprint: Capacitor_SMD:C_0402_1005Metric
  • 3D model: 0402 (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MURATA ELECTRONICS datasheet (31 pp, sha256 9b8b196217996694, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF