# FTP09N20C

**CRMICRO** · MOSFETs · TO-220

FTP09N20C from CRMICRO, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-to-source voltage is rated ±30 V max, with a threshold of 2.0 to 4.0 V at ID=250µA. |
| 2 | D | passive | Drain; drain-to-source voltage is rated 200 V max, with continuous drain current of 9.0 A (the tab is also drain per the package drawing). |
| 3 | S | passive | Source; body diode continuous source current is 9.0 A max. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | CRMICRO |
| Package | TO-220 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Static Drain-to-Source On-Resistance | RDS(ON) |  | 0.23 | 0.28 | Ω | VGS=10V, ID=5.4A | 2 |
| Gate Threshold Voltage | VGS(TH) | 2 |  | 4 | V | VDS=VGS, ID=250μA | 2 |
| Drain-to-Source Breakdown Voltage | BVDSS | 200 |  |  | V | VGS=0V, ID=250μA | 2 |
| Drain-to-Source Leakage Current | IDSS |  |  | 1 | μA | VDS=200V, VGS=0V | 2 |
| Drain-to-Source Leakage Current | IDSS |  |  | 100 | μA | VDS=160V, VGS=0V, TJ=125°C | 2 |
| Gate-to-Source Forward Leakage | IGSS |  |  | 100 | nA | VGS=+30V | 2 |
| Gate-to-Source Reverse Leakage | IGSS |  |  | -100 | nA | VGS=-30V | 2 |
| Continuous Source Current (Body Diode) | IS |  |  | 9 | A | Integral pn-diode in MOSFET | 3 |
| Maximum Pulsed Current (Body Diode) | ISM |  |  | 36 | A | in MOSFET | 3 |
| Diode Forward Voltage | VSD |  |  | 1.5 | V | IS=9.0A, VGS=0V | 3 |
| Drain-to-Source Voltage | VDSS |  |  | 200 | V |  | 1 |
| Continuous Drain Current | ID |  |  | 9 | A | TC=25°C | 1 |
| Power Dissipation | PD |  |  | 83 | W | TC=25°C | 1 |
| Derating Factor above 25°C |  |  |  | 0.67 | W/°C | above 25°C | 1 |
| Gate-to-Source Voltage | VGS | -30 |  | 30 | V |  | 1 |
| Single Pulse Avalanche Energy | EAS |  |  | 460 | mJ | L=10mH | 1 |
| Peak Diode Recovery dv/dt | dv/dt |  |  | 5 | V/ns |  | 1 |
| Maximum Temperature for Soldering Leads | TL |  |  | 300 | °C | Leads at 0.063in (1.6mm) from case for 10 seconds | 1 |
| Maximum Temperature for Soldering Package Body | TPKG |  |  | 260 | °C | Package body for 10 seconds | 1 |
| Operating Junction and Storage Temperature Range | TJ and TSTG | -55 |  | 150 | °C |  | 1 |
| Junction-to-Case Thermal Resistance | RTJC |  |  | 1.5 | °C/W | Water cooled heatsink, PD adjusted for a peak junction temperature of +150°C. | 1 |
| Junction-to-Ambient Thermal Resistance | RTJA |  |  | 62 | °C/W | 1 cubic foot chamber, free air. | 1 |

## CAD (KiCad official)

- Symbol: `FTP09N20C`
- Footprint: `Package_TO_SOT_THT:TO-220-3_Vertical`
- 3D model: TO-220 (KiCad packages3D, STEP)
- 3D model files: `ftp09n20c-etched.step` / `ftp09n20c-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ftp09n20c.step` / `ftp09n20c.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [CRMICRO datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603109928013869056) (9 pp, sha256 `8caad2d5b27d6ef8`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ftp09n20c-datasheet.pdf)