component

FTP09N20C

Public Made by Adom

by adom

CRMICRO MOSFETs, TO-220. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ftp09n20c-etched.step ftp09n20c: factory component page (tier=lcsc) · Ray 3h ago
ftp09n20c-hero.glb ftp09n20c: hero GLB from the etched model (keeps the MPN mark) · Ray 3h ago
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FTP09N20C

CRMICRO · MOSFETs · TO-220

FTP09N20C from CRMICRO, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-to-source voltage is rated ±30 V max, with a threshold of 2.0 to 4.0 V at ID=250µA.
2 D passive Drain; drain-to-source voltage is rated 200 V max, with continuous drain current of 9.0 A (the tab is also drain per the package drawing).
3 S passive Source; body diode continuous source current is 9.0 A max.

Key specifications

Parameter Value
Manufacturer CRMICRO
Package TO-220
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Static Drain-to-Source On-Resistance RDS(ON) 0.23 0.28 Ω VGS=10V, ID=5.4A 2
Gate Threshold Voltage VGS(TH) 2 4 V VDS=VGS, ID=250μA 2
Drain-to-Source Breakdown Voltage BVDSS 200 V VGS=0V, ID=250μA 2
Drain-to-Source Leakage Current IDSS 1 μA VDS=200V, VGS=0V 2
Drain-to-Source Leakage Current IDSS 100 μA VDS=160V, VGS=0V, TJ=125°C 2
Gate-to-Source Forward Leakage IGSS 100 nA VGS=+30V 2
Gate-to-Source Reverse Leakage IGSS -100 nA VGS=-30V 2
Continuous Source Current (Body Diode) IS 9 A Integral pn-diode in MOSFET 3
Maximum Pulsed Current (Body Diode) ISM 36 A in MOSFET 3
Diode Forward Voltage VSD 1.5 V IS=9.0A, VGS=0V 3
Drain-to-Source Voltage VDSS 200 V 1
Continuous Drain Current ID 9 A TC=25°C 1
Power Dissipation PD 83 W TC=25°C 1
Derating Factor above 25°C 0.67 W/°C above 25°C 1
Gate-to-Source Voltage VGS -30 30 V 1
Single Pulse Avalanche Energy EAS 460 mJ L=10mH 1
Peak Diode Recovery dv/dt dv/dt 5 V/ns 1
Maximum Temperature for Soldering Leads TL 300 °C Leads at 0.063in (1.6mm) from case for 10 seconds 1
Maximum Temperature for Soldering Package Body TPKG 260 °C Package body for 10 seconds 1
Operating Junction and Storage Temperature Range TJ and TSTG -55 150 °C 1
Junction-to-Case Thermal Resistance RTJC 1.5 °C/W Water cooled heatsink, PD adjusted for a peak junction temperature of +150°C. 1
Junction-to-Ambient Thermal Resistance RTJA 62 °C/W 1 cubic foot chamber, free air. 1

CAD (KiCad official)

  • Symbol: FTP09N20C
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220 (KiCad packages3D, STEP)
  • 3D model files: ftp09n20c-etched.step / ftp09n20c-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ftp09n20c.step / ftp09n20c.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: CRMICRO datasheet (9 pp, sha256 8caad2d5b27d6ef8, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF