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FSV9523

Forsinve · RFID ICs · QFN-32(5x5)

FSV9523 from Forsinve, in a QFN-32(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I2C input I2C-bus enable input; a logic 1 on this pin selects the I2C-bus interface during interface detection after reset (Table 5).
2 PVDD power_in Pin power supply, which must always be the same or a lower voltage than DVDD (VDD(PVDD) ≤ VDDD).
3 DVDD power_in Digital power supply, which must always be the same voltage as AVDD and TVDD.
4 DVSS power_in Digital ground; connection of the underside heatsink pad is not necessary, and an optional connection to this pin is possible.
5 PVSS power_in Pin power supply ground.
6 NRSTPD input Reset and power-down input: a positive edge enables reset, and a LOW level enables power-down, which switches off the internal current sinks, inhibits the oscillator and disconnects the input pins from the outside world.
7 MFIN input MIFARE signal input, powered from the SVDD supply (pin 9).
8 MFOUT output MIFARE signal output, powered from the SVDD supply (pin 9).
9 SVDD power_in MFIN and MFOUT pin power supply.
10 TVSS power_in Transmitter output stage 1 ground.
11 TX1 output Transmitter 1 modulated 13.56 MHz energy carrier output, whose output stage is supplied from TVDD.
12 TVDD power_in Transmitter power supply for the output stages of transmitters 1 and 2, which must always be the same voltage as DVDD and AVDD.
13 TX2 output Transmitter 2 modulated 13.56 MHz energy carrier output, whose output stage is supplied from TVDD.
14 TVSS power_in Transmitter output stage 2 ground.
15 AVDD power_in Analog power supply, which must always be the same voltage as DVDD and TVDD (VDDA = 3 V in the quick reference conditions).
16 VMID power_in Internal reference voltage pin (type P as printed in the datasheet).
17 RX input RF signal input for the receiver.
18 AVSS power_in Analog ground.
19 AUX1 output Auxiliary output for test purposes.
20 AUX2 output Auxiliary output for test purposes.
21 OSCIN input Crystal oscillator inverting amplifier input, which is also the input for an externally generated clock of fclk = 27.12 MHz.
22 OSCOUT output Crystal oscillator inverting amplifier output.
23 IRQ output Interrupt request output that indicates an interrupt event.
24 SDA/NSS/RX bidirectional I2C-bus serial data line input/output, which alternatively serves as SPI slave select input NSS or UART address input RX depending on the detected host interface (Table 5).
25 D1/ADR_5 bidirectional Test port I/O pin D1, which alternatively serves as I2C-bus address 5 input ADR_5; when SPI is used only D1 to D4 can be used as test pins.
26 D2/ADR_4 bidirectional Test port I/O pin D2, which alternatively serves as I2C-bus address 4 input ADR_4.
27 D3/ADR_3 bidirectional Test port I/O pin D3, which alternatively serves as I2C-bus address 3 input ADR_3.
28 D4/ADR_2 bidirectional Test port I/O pin D4, which alternatively serves as I2C-bus address 2 input ADR_2.
29 D5/ADR_1/SCK/DTRQ bidirectional Test port I/O pin D5, which alternatively serves as I2C-bus address 1 input ADR_1, SPI serial clock input SCK, or UART request-to-send output DTRQ.
30 D6/ADR_0/MOSI/MX bidirectional Test port I/O pin D6, which alternatively serves as I2C-bus address 0 input ADR_0, SPI master out slave in MOSI, or UART output MX.
31 D7/SCL/MISO/TX bidirectional Test port I/O pin D7, which alternatively serves as I2C-bus clock input/output SCL, SPI master in slave out MISO, or UART data output TX.
32 EA input External address input used to code the I2C-bus address.
33 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Forsinve
Package QFN-32(5x5)
Category RF And Wireless
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
analog supply voltage VDDA -0.5 4 V 73
digital supply voltage VDDD -0.5 4 V 73
PVDD supply voltage VDD(PVDD) -0.5 4 V 73
TVDD supply voltage VDD(TVDD) -0.5 4 V 73
SVDD supply voltage VDD(SVDD) -0.5 4 V 73
input voltage, all input pins except MFIN and RX VI -0.5 V all input pins except MFIN and RX 73
input voltage, pin MFIN VI -0.5 V pin MFIN 73
total power dissipation per package Ptot 200 mW per package; VDDD in shortcut mode 73
junction temperature Tj 100 °C 73
electrostatic discharge voltage, HBM VESD 2000 V HBM; 1500 Ω, 100 pF; JESD22-A114-B 73
electrostatic discharge voltage, MM VESD 200 V MM; 0.75 µH, 200 pF; JESD22-A114-A 73
electrostatic discharge voltage, charged device model, on all pins VESD 200 V Charged device model; JESD22-C101-A; on all pins 73
analog supply voltage VDDA 2.5 3.3 3.6 V VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V 74
digital supply voltage VDDD 2.5 3.3 3.6 V VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V 74
TVDD supply voltage VDD(TVDD) 2.5 3.3 3.6 V VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V 74
PVDD supply voltage VDD(PVDD) 1.6 1.8 3.6 V VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V; must be same or lower than VDDD 74
SVDD supply voltage VDD(SVDD) 1.6 3.6 V VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V 74
ambient temperature Tamb -25 85 °C HVQFN32 74
thermal resistance from junction to ambient Rth(j-a) 40 K/W in still air with exposed pin soldered on a 4 layer JEDEC PCB; HVQFN32 74
input leakage current, pins EA, I2C and NRSTPD ILI -1 1 µA 74
input leakage current, pin MFIN ILI -1 1 µA 74
input leakage current, pin SDA ILI -1 1 µA 75
input leakage current, pin OSCIN ILI -1 1 µA 75
input voltage, pin RX Vi 1 V 75
input leakage current, pins D1 to D7 ILI -1 1 µA 75
IOH HIGH-level output current, pins D1 to D7 IOH 4 mA VDD(PVDD) = 3 V 76
IOL LOW-level output current, pins D1 to D7 IOL 4 mA VDD(PVDD) = 3 V 76
IOL LOW-level output current, pin MFOUT IOL 4 mA VDD(SVDD) = 3 V 76
IOH HIGH-level output current, pin MFOUT IOH 4 mA VDD(SVDD) = 3 V 76
IOL LOW-level output current, pin IRQ IOL 4 mA VDD(PVDD) = 3 V 76
IOH HIGH-level output current, pin IRQ IOH 4 mA VDD(PVDD) = 3 V 76
IOL LOW-level output current, pins AUX1 and AUX2 IOL 4 mA VDDD = 3 V 76
IOH HIGH-level output current, pins AUX1 and AUX2 IOH 4 mA VDDD = 3 V 76
LOW-level output voltage, pins TX1 and TX2 VOL 0.15 V VDD(TVDD) = 3 V; IDD(TVDD) = 32 mA; CWGsP[5:0] = 0Fh 77
LOW-level output voltage, pins TX1 and TX2 VOL 0.4 V VDD(TVDD) = 3 V; IDD(TVDD) = 80 mA; CWGsP[5:0] = 0Fh 77
LOW-level output voltage, pins TX1 and TX2 VOL 0.24 V VDD(TVDD) = 2.5 V; IDD(TVDD) = 32 mA; CWGsP[5:0] = 0Fh 77
LOW-level output voltage, pins TX1 and TX2 VOL 0.64 V VDD(TVDD) = 2.5 V; IDD(TVDD) = 80 mA; CWGsP[5:0] = 0Fh 77
power-down current, hard power-down Ipd 5 µA VDDA = VDDD = VDD(TVDD) = VDD(PVDD) = 3 V; hard power-down; pin NRSTPD set LOW 77
power-down current, soft power-down Ipd 10 µA VDDA = VDDD = VDD(TVDD) = VDD(PVDD) = 3 V; soft power-down; RF level detector on 77
digital supply current IDDD 6.5 9 mA pin DVDD; VDDD = 3 V 77
analog supply current IDDA 7 10 mA pin AVDD; VDDA = 3 V; CommandReg register's bit RcvOff = 0 77
analog supply current, receiver switched off IDDA 3 5 mA pin AVDD; VDDA = 3 V; CommandReg register's bit RcvOff = 1 77
PVDD supply current IDD(PVDD) 40 mA pin PVDD 77
TVDD supply current, continuous wave IDD(TVDD) 60 100 mA pin TVDD; continuous wave 77
SVDD supply current IDD(SVDD) 4 mA pin SVDD 77
clock duty cycle clk 40 50 60 % 77
jitter time RMS tjit 10 ps 77
equivalent series resistance ESR 100 Ω 78
crystal power dissipation Pxtal 50 100 µW 78
pulse width LOW line SCK tWL 50 ns 78
pulse width HIGH line SCK tWH 50 ns 78
SCK HIGH to data input hold time th(SCKH-D) 25 ns SCK to changing MOSI 78
data input to SCK HIGH set-up time tsu(D-SCKH) 25 ns changing MOSI to SCK 78
SCK LOW to data output hold time th(SCKL-Q) 25 ns SCK to changing MISO 79
SCK LOW to NSS HIGH time t(SCKL-NSSH) 0 ns 79
NSS HIGH time before communication tNSSH 50 ns 79
SCL clock frequency fSCL 0 400 kHz Fast mode 79
SCL clock frequency fSCL 0 3400 kHz High-speed mode 79

CAD (KiCad official)

  • Symbol: FSV9523
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: QFN-32(5x5) (KiCad packages3D, STEP)
  • 3D model files: fsv9523-etched.step / fsv9523-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fsv9523.step / fsv9523.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Forsinve datasheet (88 pp, sha256 6463f993b9537679, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF