component
FSV9523
Public Made by Adomby adom
Forsinve RFID ICs, QFN-32(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownFSV9523
Forsinve · RFID ICs · QFN-32(5x5)
FSV9523 from Forsinve, in a QFN-32(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I2C | input | I2C-bus enable input; a logic 1 on this pin selects the I2C-bus interface during interface detection after reset (Table 5). |
| 2 | PVDD | power_in | Pin power supply, which must always be the same or a lower voltage than DVDD (VDD(PVDD) ≤ VDDD). |
| 3 | DVDD | power_in | Digital power supply, which must always be the same voltage as AVDD and TVDD. |
| 4 | DVSS | power_in | Digital ground; connection of the underside heatsink pad is not necessary, and an optional connection to this pin is possible. |
| 5 | PVSS | power_in | Pin power supply ground. |
| 6 | NRSTPD | input | Reset and power-down input: a positive edge enables reset, and a LOW level enables power-down, which switches off the internal current sinks, inhibits the oscillator and disconnects the input pins from the outside world. |
| 7 | MFIN | input | MIFARE signal input, powered from the SVDD supply (pin 9). |
| 8 | MFOUT | output | MIFARE signal output, powered from the SVDD supply (pin 9). |
| 9 | SVDD | power_in | MFIN and MFOUT pin power supply. |
| 10 | TVSS | power_in | Transmitter output stage 1 ground. |
| 11 | TX1 | output | Transmitter 1 modulated 13.56 MHz energy carrier output, whose output stage is supplied from TVDD. |
| 12 | TVDD | power_in | Transmitter power supply for the output stages of transmitters 1 and 2, which must always be the same voltage as DVDD and AVDD. |
| 13 | TX2 | output | Transmitter 2 modulated 13.56 MHz energy carrier output, whose output stage is supplied from TVDD. |
| 14 | TVSS | power_in | Transmitter output stage 2 ground. |
| 15 | AVDD | power_in | Analog power supply, which must always be the same voltage as DVDD and TVDD (VDDA = 3 V in the quick reference conditions). |
| 16 | VMID | power_in | Internal reference voltage pin (type P as printed in the datasheet). |
| 17 | RX | input | RF signal input for the receiver. |
| 18 | AVSS | power_in | Analog ground. |
| 19 | AUX1 | output | Auxiliary output for test purposes. |
| 20 | AUX2 | output | Auxiliary output for test purposes. |
| 21 | OSCIN | input | Crystal oscillator inverting amplifier input, which is also the input for an externally generated clock of fclk = 27.12 MHz. |
| 22 | OSCOUT | output | Crystal oscillator inverting amplifier output. |
| 23 | IRQ | output | Interrupt request output that indicates an interrupt event. |
| 24 | SDA/NSS/RX | bidirectional | I2C-bus serial data line input/output, which alternatively serves as SPI slave select input NSS or UART address input RX depending on the detected host interface (Table 5). |
| 25 | D1/ADR_5 | bidirectional | Test port I/O pin D1, which alternatively serves as I2C-bus address 5 input ADR_5; when SPI is used only D1 to D4 can be used as test pins. |
| 26 | D2/ADR_4 | bidirectional | Test port I/O pin D2, which alternatively serves as I2C-bus address 4 input ADR_4. |
| 27 | D3/ADR_3 | bidirectional | Test port I/O pin D3, which alternatively serves as I2C-bus address 3 input ADR_3. |
| 28 | D4/ADR_2 | bidirectional | Test port I/O pin D4, which alternatively serves as I2C-bus address 2 input ADR_2. |
| 29 | D5/ADR_1/SCK/DTRQ | bidirectional | Test port I/O pin D5, which alternatively serves as I2C-bus address 1 input ADR_1, SPI serial clock input SCK, or UART request-to-send output DTRQ. |
| 30 | D6/ADR_0/MOSI/MX | bidirectional | Test port I/O pin D6, which alternatively serves as I2C-bus address 0 input ADR_0, SPI master out slave in MOSI, or UART output MX. |
| 31 | D7/SCL/MISO/TX | bidirectional | Test port I/O pin D7, which alternatively serves as I2C-bus clock input/output SCL, SPI master in slave out MISO, or UART data output TX. |
| 32 | EA | input | External address input used to code the I2C-bus address. |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Forsinve |
| Package | QFN-32(5x5) |
| Category | RF And Wireless |
| Pins | 33 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| analog supply voltage | VDDA | -0.5 | 4 | V | 73 | ||
| digital supply voltage | VDDD | -0.5 | 4 | V | 73 | ||
| PVDD supply voltage | VDD(PVDD) | -0.5 | 4 | V | 73 | ||
| TVDD supply voltage | VDD(TVDD) | -0.5 | 4 | V | 73 | ||
| SVDD supply voltage | VDD(SVDD) | -0.5 | 4 | V | 73 | ||
| input voltage, all input pins except MFIN and RX | VI | -0.5 | V | all input pins except MFIN and RX | 73 | ||
| input voltage, pin MFIN | VI | -0.5 | V | pin MFIN | 73 | ||
| total power dissipation per package | Ptot | 200 | mW | per package; VDDD in shortcut mode | 73 | ||
| junction temperature | Tj | 100 | °C | 73 | |||
| electrostatic discharge voltage, HBM | VESD | 2000 | V | HBM; 1500 Ω, 100 pF; JESD22-A114-B | 73 | ||
| electrostatic discharge voltage, MM | VESD | 200 | V | MM; 0.75 µH, 200 pF; JESD22-A114-A | 73 | ||
| electrostatic discharge voltage, charged device model, on all pins | VESD | 200 | V | Charged device model; JESD22-C101-A; on all pins | 73 | ||
| analog supply voltage | VDDA | 2.5 | 3.3 | 3.6 | V | VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V | 74 |
| digital supply voltage | VDDD | 2.5 | 3.3 | 3.6 | V | VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V | 74 |
| TVDD supply voltage | VDD(TVDD) | 2.5 | 3.3 | 3.6 | V | VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V | 74 |
| PVDD supply voltage | VDD(PVDD) | 1.6 | 1.8 | 3.6 | V | VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V; must be same or lower than VDDD | 74 |
| SVDD supply voltage | VDD(SVDD) | 1.6 | 3.6 | V | VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V | 74 | |
| ambient temperature | Tamb | -25 | 85 | °C | HVQFN32 | 74 | |
| thermal resistance from junction to ambient | Rth(j-a) | 40 | K/W | in still air with exposed pin soldered on a 4 layer JEDEC PCB; HVQFN32 | 74 | ||
| input leakage current, pins EA, I2C and NRSTPD | ILI | -1 | 1 | µA | 74 | ||
| input leakage current, pin MFIN | ILI | -1 | 1 | µA | 74 | ||
| input leakage current, pin SDA | ILI | -1 | 1 | µA | 75 | ||
| input leakage current, pin OSCIN | ILI | -1 | 1 | µA | 75 | ||
| input voltage, pin RX | Vi | 1 | V | 75 | |||
| input leakage current, pins D1 to D7 | ILI | -1 | 1 | µA | 75 | ||
| IOH HIGH-level output current, pins D1 to D7 | IOH | 4 | mA | VDD(PVDD) = 3 V | 76 | ||
| IOL LOW-level output current, pins D1 to D7 | IOL | 4 | mA | VDD(PVDD) = 3 V | 76 | ||
| IOL LOW-level output current, pin MFOUT | IOL | 4 | mA | VDD(SVDD) = 3 V | 76 | ||
| IOH HIGH-level output current, pin MFOUT | IOH | 4 | mA | VDD(SVDD) = 3 V | 76 | ||
| IOL LOW-level output current, pin IRQ | IOL | 4 | mA | VDD(PVDD) = 3 V | 76 | ||
| IOH HIGH-level output current, pin IRQ | IOH | 4 | mA | VDD(PVDD) = 3 V | 76 | ||
| IOL LOW-level output current, pins AUX1 and AUX2 | IOL | 4 | mA | VDDD = 3 V | 76 | ||
| IOH HIGH-level output current, pins AUX1 and AUX2 | IOH | 4 | mA | VDDD = 3 V | 76 | ||
| LOW-level output voltage, pins TX1 and TX2 | VOL | 0.15 | V | VDD(TVDD) = 3 V; IDD(TVDD) = 32 mA; CWGsP[5:0] = 0Fh | 77 | ||
| LOW-level output voltage, pins TX1 and TX2 | VOL | 0.4 | V | VDD(TVDD) = 3 V; IDD(TVDD) = 80 mA; CWGsP[5:0] = 0Fh | 77 | ||
| LOW-level output voltage, pins TX1 and TX2 | VOL | 0.24 | V | VDD(TVDD) = 2.5 V; IDD(TVDD) = 32 mA; CWGsP[5:0] = 0Fh | 77 | ||
| LOW-level output voltage, pins TX1 and TX2 | VOL | 0.64 | V | VDD(TVDD) = 2.5 V; IDD(TVDD) = 80 mA; CWGsP[5:0] = 0Fh | 77 | ||
| power-down current, hard power-down | Ipd | 5 | µA | VDDA = VDDD = VDD(TVDD) = VDD(PVDD) = 3 V; hard power-down; pin NRSTPD set LOW | 77 | ||
| power-down current, soft power-down | Ipd | 10 | µA | VDDA = VDDD = VDD(TVDD) = VDD(PVDD) = 3 V; soft power-down; RF level detector on | 77 | ||
| digital supply current | IDDD | 6.5 | 9 | mA | pin DVDD; VDDD = 3 V | 77 | |
| analog supply current | IDDA | 7 | 10 | mA | pin AVDD; VDDA = 3 V; CommandReg register's bit RcvOff = 0 | 77 | |
| analog supply current, receiver switched off | IDDA | 3 | 5 | mA | pin AVDD; VDDA = 3 V; CommandReg register's bit RcvOff = 1 | 77 | |
| PVDD supply current | IDD(PVDD) | 40 | mA | pin PVDD | 77 | ||
| TVDD supply current, continuous wave | IDD(TVDD) | 60 | 100 | mA | pin TVDD; continuous wave | 77 | |
| SVDD supply current | IDD(SVDD) | 4 | mA | pin SVDD | 77 | ||
| clock duty cycle | clk | 40 | 50 | 60 | % | 77 | |
| jitter time RMS | tjit | 10 | ps | 77 | |||
| equivalent series resistance | ESR | 100 | Ω | 78 | |||
| crystal power dissipation | Pxtal | 50 | 100 | µW | 78 | ||
| pulse width LOW line SCK | tWL | 50 | ns | 78 | |||
| pulse width HIGH line SCK | tWH | 50 | ns | 78 | |||
| SCK HIGH to data input hold time | th(SCKH-D) | 25 | ns | SCK to changing MOSI | 78 | ||
| data input to SCK HIGH set-up time | tsu(D-SCKH) | 25 | ns | changing MOSI to SCK | 78 | ||
| SCK LOW to data output hold time | th(SCKL-Q) | 25 | ns | SCK to changing MISO | 79 | ||
| SCK LOW to NSS HIGH time | t(SCKL-NSSH) | 0 | ns | 79 | |||
| NSS HIGH time before communication | tNSSH | 50 | ns | 79 | |||
| SCL clock frequency | fSCL | 0 | 400 | kHz | Fast mode | 79 | |
| SCL clock frequency | fSCL | 0 | 3400 | kHz | High-speed mode | 79 |
CAD (KiCad official)
- Symbol:
FSV9523 - Footprint:
Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm - 3D model: QFN-32(5x5) (KiCad packages3D, STEP)
- 3D model files:
fsv9523-etched.step/fsv9523-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fsv9523.step/fsv9523.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Forsinve datasheet (88 pp, sha256
6463f993b9537679, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).