component
FQD5P20TM
Public Made by Adomby adom
onsemi MOSFETs, DPAK. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 4h ago |
| viewers | 4h ago |
| fqd5p20tm-etched.glb | 4h ago |
| fqd5p20tm-etched.step | 4h ago |
| fqd5p20tm-hero.glb | 4h ago |
| fqd5p20tm-hero.overlay.json | 4h ago |
| fqd5p20tm.glb | 4h ago |
| fqd5p20tm.kicad_mod | 4h ago |
| fqd5p20tm.kicad_sym | 4h ago |
| fqd5p20tm.lbr | 4h ago |
| fqd5p20tm.step | 4h ago |
| package.json | 4h ago |
| page.json | 4h ago |
| README.md | 4h ago |
FQD5P20TM
onsemi · MOSFETs · DPAK
FQD5P20TM from onsemi, in a DPAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the P-channel MOSFET; gate-source voltage is rated ±30 V and threshold is -3.0 to -5.0 V. |
| 2 | D | passive | Drain terminal (also connected to the tab); drain-source voltage rated -200 V with continuous drain current -3.7 A at TC = 25°C. |
| 3 | S | passive | Source terminal of the P-channel MOSFET; maximum continuous drain-source diode forward current is -3.7 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | DPAK |
| Category | Transistors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | -200 | V | VGS = 0 V, ID = -250 µA | 3 | ||
| Zero Gate Voltage Drain Current | IDSS | -1 | µA | VDS = -200 V, VGS = 0 V | 3 | ||
| Zero Gate Voltage Drain Current | IDSS | -10 | µA | VDS = -160 V, TC = 125°C | 3 | ||
| Gate-Body Leakage Current, Forward | IGSSF | -100 | nA | VGS = -30 V, VDS = 0 V | 3 | ||
| Gate-Body Leakage Current, Reverse | IGSSR | 100 | nA | VGS = 30 V, VDS = 0 V | 3 | ||
| Gate Threshold Voltage | VGS(th) | -3 | -5 | V | VDS = VGS, ID = -250 µA | 3 | |
| Static Drain-Source On-Resistance | RDS(on) | 1.1 | 1.4 | Ω | VGS = -10 V, ID = -1.85 A | 3 | |
| Input Capacitance | Ciss | 330 | 430 | pF | VDS = -25 V, VGS = 0 V, f = 1.0 MHz | 3 | |
| Output Capacitance | Coss | 75 | 98 | pF | VDS = -25 V, VGS = 0 V, f = 1.0 MHz | 3 | |
| Reverse Transfer Capacitance | Crss | 12 | 15 | pF | VDS = -25 V, VGS = 0 V, f = 1.0 MHz | 3 | |
| Turn-On Delay Time | td(on) | 9 | 28 | ns | VDD = -100 V, ID = -4.8 A, RG = 25 Ω | 3 | |
| Turn-On Rise Time | tr | 70 | 150 | ns | VDD = -100 V, ID = -4.8 A, RG = 25 Ω | 3 | |
| Turn-Off Delay Time | td(off) | 12 | 35 | ns | VDD = -100 V, ID = -4.8 A, RG = 25 Ω | 3 | |
| Turn-Off Fall Time | tf | 25 | 60 | ns | VDD = -100 V, ID = -4.8 A, RG = 25 Ω | 3 | |
| Total Gate Charge | Qg | 10 | 13 | nC | VDS = -160 V, ID = -4.8 A, VGS = -10 V | 3 | |
| Maximum Continuous Drain-Source Diode Forward Current | IS | -3.7 | A | 3 | |||
| Maximum Pulsed Drain-Source Diode Forward Current | ISM | -14.8 | A | 3 | |||
| Drain-Source Diode Forward Voltage | VSD | -5 | V | VGS = 0 V, IS = -3.7 A | 3 | ||
| Drain-Source Voltage | VDSS | -200 | V | TC = 25°C | 2 | ||
| Drain Current - Continuous | ID | -3.7 | A | TC = 25°C | 2 | ||
| Drain Current - Continuous | ID | -2.34 | A | TC = 100°C | 2 | ||
| Drain Current - Pulsed | IDM | -14.8 | A | Note 1 | 2 | ||
| Gate-Source Voltage | VGSS | -30 | 30 | V | 2 | ||
| Single Pulsed Avalanche Energy | EAS | 330 | mJ | Note 2 | 2 | ||
| Avalanche Current | IAR | -3.7 | A | Note 1 | 2 | ||
| Repetitive Avalanche Energy | EAR | 4.5 | mJ | Note 1 | 2 | ||
| Peak Diode Recovery dv/dt | dv/dt | -5.5 | V/ns | Note 3 | 2 | ||
| Power Dissipation | PD | 2.5 | W | TA = 25°C | 2 | ||
| Power Dissipation | PD | 45 | W | TC = 25°C | 2 | ||
| Power Dissipation Derating | PD | 0.36 | W/°C | Derate above 25°C | 2 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 150 | °C | 2 | ||
| Maximum lead temperature for soldering | TL | 300 | °C | 1/8" from case for 5 seconds | 2 | ||
| Thermal Resistance, Junction to Case | RJC | 2.78 | oC/W | 2 | |||
| Thermal Resistance, Junction to Ambient | RJA | 110 | oC/W | minimum pad of 2 oz copper | 2 | ||
| Thermal Resistance, Junction to Ambient | RJA | 50 | oC/W | * 1 in2 pad of 2 oz copper | 2 | ||
| Breakdown Voltage Temperature Coefficient | ∆BVDSS/∆TJ | -0.17 | V/°C | ID = -250 µA, Referenced to 25°C | 3 | ||
| Forward Transconductance | gFS | 2.2 | S | VDS = -40 V, ID = -1.85 A | 3 | ||
| Gate-Source Charge | Qgs | 2.8 | nC | VDS = -160 V, ID = -4.8 A, VGS = -10 V | 3 | ||
| Gate-Drain Charge | Qgd | 5.2 | nC | VDS = -160 V, ID = -4.8 A, VGS = -10 V | 3 | ||
| Reverse Recovery Time | trr | 175 | ns | VGS = 0 V, IS = -4.8 A, dIF / dt = 100 A/µs | 3 | ||
| Reverse Recovery Charge | Qrr | 1.07 | µC | VGS = 0 V, IS = -4.8 A, dIF / dt = 100 A/µs | 3 |
CAD (KiCad official)
- Symbol:
FQD5P20TM - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: DPAK (KiCad packages3D, STEP)
- 3D model files:
fqd5p20tm-etched.step/fqd5p20tm-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fqd5p20tm.step/fqd5p20tm.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (11 pp, sha256
93cd7b5dd2ae640d, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).