component

FOD073LR2

Public Made by Adom

by adom

onsemi Logic Output Optoisolators, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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FOD073LR2

onsemi · Logic Output Optoisolators · SOIC-8

FOD073LR2 from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VF1+ passive Anode of channel 1 input LED; forward voltage 1.35 V typ at IF = 1.6 mA, absolute max DC forward current 20 mA.
2 VF1- passive Cathode of channel 1 input LED; reverse input voltage limited to 5 V.
3 VF2- passive Cathode of channel 2 input LED; reverse input voltage limited to 5 V.
4 VF2+ passive Anode of channel 2 input LED; forward voltage 1.35 V typ at IF = 1.6 mA, absolute max DC forward current 20 mA.
5 GND power_in Ground for the detector side of both channels.
6 VO2 output Channel 2 open-collector darlington output, goes low when LED is on, with absolute max output voltage -0.5 to 7 V and average output current 60 mA.
7 VO1 output Channel 1 open-collector darlington output, goes low when LED is on, with absolute max output voltage -0.5 to 7 V and average output current 60 mA.
8 VCC power_in Detector supply for both channels, specified at 3.3 V with absolute max -0.5 to 7 V.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-8
Category Optoisolators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Storage Temperature TSTG -40 125 °C 3
Operating Temperature TOPR -40 85 °C 3
Lead Solder Temperature TSOL 260 °C for 10 sec; wave solder only, see reflow profile for surface mount devices 3
DC/Average Forward Input Current IF (avg) 20 mA Each Channel 3
Peak Forward Input Current IF (pk) 40 mA 50% duty cycle, 1ms P.W.; Each Channel 3
Peak Transient Input Current IF (trans) 1 A ≤1µs P.W., 300 pps; Each Channel 3
Reverse Input Voltage VR 5 V Each Channel 3
Input Power Dissipation PD 35 mW Each Channel 3
Average Output Current IO (avg) 60 mA Each Channel 3
Supply Voltage, Output Voltage VCC, VO -0.5 7 V Each Channel 3
Output power dissipation PD 100 mW Each Channel 3
Input Forward Voltage VF 1.35 1.7 V TA = 25°C 4
Input Forward Voltage VF 1.75 V IF = 1.6mA (Each Channel) 4
Input Reverse Breakdown Voltage BVR 5 V TA = 25°C, IR = 10µA (Each Channel) 4
Logic High Output Current IOH 0.05 25 µA IF = 0 mA, VO = VCC = 3.3V (Each Channel) 4
Logic Low Supply Current ICCL 0.8 3 mA IF1 = IF2 = 1.6mA, VO1 = VO2 = Open, VCC = 3.3V 4
Logic High Supply Current ICCH 0.01 2 µA IF1 = IF2 = 0mA, VO1 = VO2 = Open, VCC = 3.3V 4
Current Transfer Ratio CTR 400 7000 % IF = 0.5mA, VO = 0.4V, VCC = 3.3V 4
Logic Low Output Voltage VOL 0.07 0.3 V IF = 1.6mA, IO = 8mA, VCC = 3.3V 4
Logic Low Output Voltage VOL 0.07 0.4 V IF = 5mA, IO = 15mA, VCC = 3.3V 4
Propagation Delay Time to Logic LOW TPHL 5 30 µs RL = 4.7kΩ, IF = 0.5mA (Fig. 9) 4
Propagation Delay Time to Logic HIGH TPLH 25 90 µs RL = 4.7kΩ, IF = 0.5mA (Fig. 9) 4
Common Mode Transient Immunity at Logic HIGH /CMH/ 1000 10000 V/µs IF = 0 mA, /VCM/ = 10 VP-P, TA = 25°C, RL = 2.2kΩ (Fig. 10) 4
Common Mode Transient Immunity at Logic LOW /CML/ 1000 10000 V/µs IF = 1.6mA, /VCM/ = 10 VP-P, RL = 2.2kΩ, TA = 25°C (Fig. 10) 4
Input-Output Insulation Leakage Current II-O 1 µA Relative humidity = 45%, TA = 25°C, t = 5 s, VI-O = 3000 VDC 5
Withstand Insulation Test Voltage VISO 2500 VRMS RH ≤ 50%, TA = 25°C, II-O ≤ 2µA, t = 1 min. 5
Resistance (Input to Output) RI-O 1012 Ω VI-O = 500 VDC 5
Capacitance (Input to Output) CI-O 0.7 pF f = 1 MHz (Notes 3, 4) 5
Input-Input Insulation Leakage Current II-I 0.005 µA RH ≤ 45%, VI-I = 500 VDC (Note 5) 5
Input-Input Resistance RI-I 1011 Ω VI-I = 500 VDC (Note 5) 5
Input-Input Capacitance CI-I 0.03 pF f = 1 MHz (Note 5) 5

CAD (KiCad official)

  • Symbol: FOD073LR2
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: fod073lr2-etched.step / fod073lr2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fod073lr2.step / fod073lr2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (13 pp, sha256 499d97308aba207c, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF