# FDV302P

**MSKSEMI** · MOSFETs · SOT-23

FDV302P from MSKSEMI, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±20 V, with a threshold of -1.0 V min to -2.5 V max at ID=-250 µA. |
| 2 | S | passive | Source of the P-channel MOSFET; continuous source current is -0.2 A max. |
| 3 | D | passive | Drain; drain-source voltage is -30 V max and continuous drain current is -0.2 A at TA=25℃ (pulsed -0.8 A). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS |  |  | -30 | V |  | 2 |
| Gate-Source Voltage | VGS | -20 |  | 20 | V |  | 2 |
| Drain Current – Continuous | ID |  |  | -0.2 | A | TA=25℃ | 2 |
| Drain Current – Continuous | ID |  |  | -0.1 | A | TA=70℃ | 2 |
| Drain Current – Pulsed | IDM |  |  | -0.8 | A |  | 2 |
| Power Dissipation | PD |  |  | 1 | W | TA=25℃ | 2 |
| Storage Temperature Range | TSTG | -55 |  | 150 | ℃ |  | 2 |
| Operating Junction Temperature Range | TJ | -55 |  | 150 | ℃ |  | 2 |
| Thermal Resistance Junction to ambient | RθJA |  |  | 80 | ℃/W |  | 2 |
| Drain-Source Breakdown Voltage | BVDSS | -30 |  |  | V | VGS=0V, ID=-250uA | 3 |
| Drain-Source Leakage Current | IDSS |  |  | -1 | uA | VDS=-30V, VGS=0V, TJ=25℃ | 3 |
| Drain-Source Leakage Current | IDSS |  |  | -10 | uA | VDS=-25V, VGS=0V, TJ=125℃ | 3 |
| Gate-Source Leakage Current | IGSS | -20 |  | 20 | uA | VGS=±20V, VDS=0V | 3 |
| Static Drain-Source On-Resistance | RDS(ON) |  | 4 | 8 | Ω | VGS=-10V, ID=-0.2A | 3 |
| Static Drain-Source On-Resistance | RDS(ON) |  | 8 | 10 | Ω | VGS=-4.5V, ID=-0.1A | 3 |
| Gate Threshold Voltage | VGS(th) | -1 | -1.6 | -2.5 | V | VGS=VDS, ID=-250uA | 3 |
| Continuous Source Current | IS |  |  | -0.2 | A | VG=VD=0V, Force Current | 3 |
| Pulsed Source Current | ISM |  |  | -0.4 | A |  | 3 |
| Diode Forward Voltage | VSD |  |  | -1.3 | V | VGS=0V, IS=-0.2A, TJ=25℃ | 3 |

## CAD (KiCad official)

- Symbol: `FDV302P`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `fdv302p-etched.step` / `fdv302p-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `fdv302p.step` / `fdv302p.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MSKSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8555435128142606336) (7 pp, sha256 `e487c0e138830a55`, retrieved 2026-10-12, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/fdv302p-datasheet.pdf)