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Ray Publish 0.1.0 3aa15b2 6d ago

FDS9933A

onsemi · MOSFETs · SO-8

FDS9933A from onsemi, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of MOSFET 1 (P-channel, VDSS -20 V, continuous drain current -3.8 A).
2 G1 input Gate of MOSFET 1; VGSS rated ±8 V, RDS(on) 0.075 Ω at VGS = -4.5 V and 0.105 Ω at -2.5 V.
3 S2 passive Source of MOSFET 2 (P-channel, VDSS -20 V, continuous drain current -3.8 A).
4 G2 input Gate of MOSFET 2; VGSS rated ±8 V, RDS(on) 0.075 Ω at VGS = -4.5 V and 0.105 Ω at -2.5 V.
5 D2 passive Drain of MOSFET 2, tied to pin 6; the drain pins are the case thermal reference (RθJA 78 °C/W on 0.5 in² copper).
6 D2 passive Drain of MOSFET 2, tied to pin 5; the drain pins are the case thermal reference (RθJA 78 °C/W on 0.5 in² copper).
7 D1 passive Drain of MOSFET 1, tied to pin 8; the drain pins are the case thermal reference (RθJA 78 °C/W on 0.5 in² copper).
8 D1 passive Drain of MOSFET 1, tied to pin 7; the drain pins are the case thermal reference (RθJA 78 °C/W on 0.5 in² copper).

Key specifications

Parameter Value
Manufacturer onsemi
Package SO-8
Category Triode/MOS Tube/Transistor
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDSS -20 V TA=25°C 2
Gate-Source Voltage VGSS -8 8 V TA=25°C 2
Drain Current - Continuous ID -3.8 A Note 1a 2
Drain Current - Pulsed ID -20 A Pulsed 2
Power Dissipation for Dual Operation PD 2 W TA=25°C 2
Power Dissipation for Single Operation PD 1.6 W Note 1a 2
Power Dissipation for Single Operation PD 1 W Note 1b 2
Power Dissipation for Single Operation PD 0.9 W Note 1c 2
Operating and Storage Junction Temperature Range TJ, Tstg -55 150 °C 2
Thermal Resistance, Junction-to-Ambient RθJA 78 °C/W Note 1a 2
Thermal Resistance, Junction-to-Case RθJC 40 °C/W Note 1 2
Drain-Source Breakdown Voltage BVDSS -20 V VGS = 0 V, ID = -250 µA 3
Zero Gate Voltage Drain Current IDSS -1 µA VDS = -16 V, VGS = 0 V 3
Gate-Body Leakage, Forward IGSSF 100 nA VGS = 8 V, VDS = 0 V 3
Gate-Body Leakage, Reverse IGSSR -100 nA VGS = -8 V, VDS = 0 V 3
Gate Threshold Voltage VGS(th) -0.4 -0.8 -1.5 V VDS = VGS, ID = -250 µA 3
Static Drain-Source On-Resistance RDS(on) 0.058 0.075 Ω VGS = -4.5 V, ID = -3.8 A 3
Static Drain-Source On-Resistance RDS(on) 0.086 0.12 Ω VGS = -4.5 V, ID = -3.8 A, TJ = 125°C 3
Static Drain-Source On-Resistance RDS(on) 0.084 0.105 Ω VGS = -2.5 V, ID = -3.3 A 3
On-State Drain Current ID(on) -10 A VGS = -4.5 V, VDS = -5.0 V 3
Turn-On Delay Time td(on) 6 12 ns VDD = -5 V, ID = -0.5 A, VGS = -4.5 V, RGEN = 6.0 Ω 3
Turn-On Rise Time tr 9 18 ns VDD = -5 V, ID = -0.5 A, VGS = -4.5 V, RGEN = 6.0 Ω 3
Turn-Off Delay Time td(off) 31 50 ns VDD = -5 V, ID = -0.5 A, VGS = -4.5 V, RGEN = 6.0 Ω 3
Turn-Off Fall Time tf 28 42 ns VDD = -5 V, ID = -0.5 A, VGS = -4.5 V, RGEN = 6.0 Ω 3
Total Gate Charge Qg 7 10 nC VDS = -10 V, ID = -3.8 A, VGS = -4.5 V 3
Maximum Continuous Drain-Source Diode Forward Current IS -1.3 A 3
Drain-Source Diode Forward Voltage VSD -0.75 -1.2 V VGS = 0 V, IS = -1.3 A (Note 2) 3
Breakdown Voltage Temperature Coefficient ΔBVDSS/ΔTJ -16 mV/°C ID = -250 µA, Referenced to 25°C 3
Gate Threshold Voltage Temperature Coefficient ΔVGS(th)/ΔTJ 2.5 mV/°C ID = -250 µA, Referenced to 25°C 3
Forward Transconductance gFS 10 S VDS = -4.5 V, ID = -3.8 A 3
Input Capacitance Ciss 600 pF VDS = -10 V, VGS = 0 V, f = 1.0 MHz 3
Output Capacitance Coss 175 pF VDS = -10 V, VGS = 0 V, f = 1.0 MHz 3
Reverse Transfer Capacitance Crss 80 pF VDS = -10 V, VGS = 0 V, f = 1.0 MHz 3
Gate-Source Charge Qgs 1.3 nC VDS = -10 V, ID = -3.8 A, VGS = -4.5 V 3
Gate-Drain Charge Qgd 2 nC VDS = -10 V, ID = -3.8 A, VGS = -4.5 V 3

CAD (KiCad official)

  • Symbol: FDS9933A
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: fds9933a-etched.step / fds9933a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fds9933a.step / fds9933a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 7adb08cbb3fca3b6, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF