component
FDS4559
Public Made by Adomby adom
onsemi MOSFETs, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 17d ago |
| viewers | 17d ago |
| fds4559-etched.glb | 17d ago |
| fds4559-etched.step | 17d ago |
| fds4559-hero.glb | 17d ago |
| fds4559-hero.overlay.json | 17d ago |
| fds4559.glb | 17d ago |
| fds4559.kicad_mod | 17d ago |
| fds4559.kicad_sym | 17d ago |
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| package.json | 17d ago |
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| README.md | 17d ago |
FDS4559
onsemi · MOSFETs · SO-8
FDS4559 from onsemi, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Q1 (N-channel) source terminal; Q1 is rated 60 V VDSS and 4.5 A continuous drain current. |
| 2 | G1 | input | Q1 (N-channel) gate terminal; gate-source voltage is rated to ±20 V (VGSS). |
| 3 | S2 | passive | Q2 (P-channel) source terminal; Q2 is rated -60 V VDSS and -3.5 A continuous drain current. |
| 4 | G2 | input | Q2 (P-channel) gate terminal; gate-source voltage is rated to ±20 V (VGSS). |
| 5 | D2 | passive | Q2 (P-channel) drain terminal; operating and storage junction temperature range is -55 to +175 °C. |
| 6 | D2 | passive | Q2 (P-channel) drain terminal, internally common with pin 5; pulsed drain current is rated -20 A. |
| 7 | D1 | passive | Q1 (N-channel) drain terminal, internally common with pin 8; pulsed drain current is rated 20 A. |
| 8 | D1 | passive | Q1 (N-channel) drain terminal; continuous drain current is rated 4.5 A (Note 1a). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SO-8 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage (Q1, N-channel) | VDSS | 60 | V | 2 | |||
| Drain-Source Voltage (Q2, P-channel) | VDSS | -60 | V | 2 | |||
| Gate-Source Voltage (Q1) | VGSS | -20 | 20 | V | 2 | ||
| Gate-Source Voltage (Q2) | VGSS | -20 | 20 | V | 2 | ||
| Drain Current - Continuous (Q1) | ID | 4.5 | A | Note 1a | 2 | ||
| Drain Current - Continuous (Q2) | ID | -3.5 | A | Note 1a | 2 | ||
| Drain Current - Pulsed (Q1) | ID | 20 | A | Pulsed | 2 | ||
| Drain Current - Pulsed (Q2) | ID | -20 | A | Pulsed | 2 | ||
| Power Dissipation for Dual Operation | PD | 2 | W | Dual operation | 2 | ||
| Power Dissipation for Single Operation | PD | 1.6 | W | Single operation (Note 1a) | 2 | ||
| Power Dissipation for Single Operation | PD | 1.2 | W | Single operation (Note 1b) | 2 | ||
| Power Dissipation for Single Operation | PD | 1 | W | Single operation (Note 1c) | 2 | ||
| Operating and Storage Junction Temperature Range | TJ, TSTG | -55 | 175 | °C | 2 | ||
| Drain-Source Breakdown Voltage (Q1) | BVDSS | 60 | V | VGS = 0 V, ID = 250 µA | 3 | ||
| Drain-Source Breakdown Voltage (Q2) | BVDSS | -60 | V | VGS = 0 V, ID = -250 µA | 3 | ||
| Zero Gate Voltage Drain Current (Q1) | IDSS | 1 | µA | VDS = 48 V, VGS = 0 V | 3 | ||
| Zero Gate Voltage Drain Current (Q2) | IDSS | -1 | µA | VDS = -48 V, VGS = 0 V | 3 | ||
| Gate-Body Leakage (Q1) | IGSS | 100 | nA | VGS = +20 V, VDS = 0 V | 3 | ||
| Gate-Body Leakage (Q2) | IGSS | 100 | nA | VGS = +20 V, VDS = 0 V | 3 | ||
| Gate Threshold Voltage (Q1) | VGS(th) | 1 | 2.2 | 3 | V | VDS = VGS, ID = 250 µA | 3 |
| Gate Threshold Voltage (Q2) | VGS(th) | -1 | -1.6 | -3 | V | VDS = VGS, ID = -250 µA | 3 |
| Static Drain-Source On-Resistance (Q1) | RDS(on) | 42 | 55 | mΩ | VGS = 10 V, ID = 4.5 A | 3 | |
| Static Drain-Source On-Resistance (Q1) | RDS(on) | 72 | 94 | mΩ | VGS = 10 V, ID = 4.5 A, TJ = 125°C | 3 | |
| Static Drain-Source On-Resistance (Q1) | RDS(on) | 55 | 75 | mΩ | VGS = 4.5 V, ID = 4 A | 3 | |
| Static Drain-Source On-Resistance (Q2) | RDS(on) | 82 | 105 | mΩ | VGS = -10 V, ID = -3.5 A | 3 | |
| Static Drain-Source On-Resistance (Q2) | RDS(on) | 130 | 190 | mΩ | VGS = -10 V, ID = -3.5 A, TJ = 125°C | 3 | |
| Static Drain-Source On-Resistance (Q2) | RDS(on) | 105 | 135 | mΩ | VGS = -4.5 V, ID = -3.1 A | 3 | |
| On-State Drain Current (Q1) | ID(on) | 20 | A | VGS = 10 V, VDS = 5 V | 3 | ||
| On-State Drain Current (Q2) | ID(on) | -20 | A | VGS = -10 V, VDS = -5 V | 3 | ||
| Turn-On Delay Time (Q1) | td(on) | 11 | 20 | ns | VDD = 30 V, ID = 1 A, VGS = 10 V, RGEN = 6 Ω | 3 | |
| Turn-On Delay Time (Q2) | td(on) | 7 | 14 | ns | VDD = -30 V, ID = -1 A, VGS = -10 V, RGEN = 6 Ω | 3 | |
| Turn-On Rise Time (Q1) | tr | 8 | 18 | ns | VDD = 30 V, ID = 1 A, VGS = 10 V, RGEN = 6 Ω | 3 | |
| Turn-On Rise Time (Q2) | tr | 10 | 20 | ns | VDD = -30 V, ID = -1 A, VGS = -10 V, RGEN = 6 Ω | 3 | |
| Turn-Off Delay Time (Q1) | td(off) | 19 | 35 | ns | VDD = 30 V, ID = 1 A, VGS = 10 V, RGEN = 6 Ω | 3 | |
| Turn-Off Delay Time (Q2) | td(off) | 19 | 34 | ns | VDD = -30 V, ID = -1 A, VGS = -10 V, RGEN = 6 Ω | 3 | |
| Turn-Off Fall Time (Q1) | tf | 6 | 15 | ns | VDD = 30 V, ID = 1 A, VGS = 10 V, RGEN = 6 Ω | 3 | |
| Turn-Off Fall Time (Q2) | tf | 12 | 22 | ns | VDD = -30 V, ID = -1 A, VGS = -10 V, RGEN = 6 Ω | 3 | |
| Total Gate Charge (Q1) | Qg | 12.5 | 18 | nC | VDS = 30 V, ID = 4.5 A, VGS = 10 V | 3 | |
| Total Gate Charge (Q2) | Qg | 15 | 21 | nC | VDS = -30 V, ID = -3.5 A, VGS = -10V | 3 | |
| Maximum Continuous Drain-Source Diode Forward Current (Q1) | IS | 1.3 | A | 4 | |||
| Maximum Continuous Drain-Source Diode Forward Current (Q2) | IS | -1.3 | A | 4 | |||
| Drain-Source Diode Forward Voltage (Q1) | VSD | 0.8 | 1.2 | V | VGS = 0 V, IS = 1.3 A (Note 2) | 4 | |
| Drain-Source Diode Forward Voltage (Q2) | VSD | -0.8 | -1.2 | V | VGS = 0 V, IS = -1.3 A (Note 2) | 4 | |
| Thermal Resistance, Junction-to-Ambient | RθJA | 78 | °C/W | Note 1a | 2 | ||
| Thermal Resistance, Junction-to-Case | RθJC | 40 | °C/W | Note 1 | 2 | ||
| Single Pulse Drain-Source Avalanche Energy (Q1) | WDSS | 90 | mJ | VDD = 30 V, ID = 4.5 A | 3 | ||
| Maximum Drain-Source Avalanche Current (Q1) | IAR | 4.5 | A | 3 | |||
| Breakdown Voltage Temperature Coefficient (Q1) | ∆BVDSS/∆TJ | 58 | mV/°C | ID = 250 µA, Referenced to 25°C | 3 | ||
| Breakdown Voltage Temperature Coefficient (Q2) | ∆BVDSS/∆TJ | -49 | mV/°C | ID = -250 µA, Referenced to 25°C | 3 | ||
| Gate Threshold Voltage Temperature Coefficient (Q1) | ∆VGS(th)/∆TJ | -5.5 | mV/°C | ID = 250 µA, Referenced to 25°C | 3 | ||
| Gate Threshold Voltage Temperature Coefficient (Q2) | ∆VGS(th)/∆TJ | 4 | mV/°C | ID = -250 µA, Referenced to 25°C | 3 | ||
| Forward Transconductance (Q1) | gFS | 14 | S | VDS = 10 V, ID = 4.5 A | 3 | ||
| Forward Transconductance (Q2) | gFS | 9 | S | VDS = -5 V, ID = -3 5 A | 3 | ||
| Input Capacitance (Q1) | Ciss | 650 | pF | 3 | |||
| Input Capacitance (Q2) | Ciss | 759 | pF | 3 | |||
| Output Capacitance (Q1) | Coss | 80 | pF | 3 | |||
| Output Capacitance (Q2) | Coss | 90 | pF | 3 | |||
| Reverse Transfer Capacitance (Q1) | Crss | 35 | pF | VDS = 25 V, VGS = 0 V, f = 1.0 MHz | 3 | ||
| Reverse Transfer Capacitance (Q2) | Crss | 39 | pF | VDS = -30 V, VGS = 0 V, f = 1.0 MHz | 3 |
CAD (KiCad official)
- Symbol:
FDS4559 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files:
fds4559-etched.step/fds4559-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);fds4559.step/fds4559.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (10 pp, sha256
301a69b67914a625, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).