# FDD044AN03L

**UMW** · MOSFETs · TO-252

FDD044AN03L from UMW, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the N-channel MOSFET; the datasheet rates gate-to-source voltage VGS at ±20 V. |
| 2 | D | passive | Drain terminal of the N-channel MOSFET; the datasheet rates drain-to-source voltage VDSS at 30 V and continuous drain current ID at 35 A (VGS=10 V, TC<168°C). |
| 3 | S | passive | Source terminal of the N-channel MOSFET; it is the reference for the 30 V VDSS and ±20 V VGS ratings. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | UMW |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain to Source Breakdown Voltage | BVDSS | 30 |  |  | V | ID=250µA, VGS=0V | 3 |
| Zero Gate Voltage Drain Current | IDSS |  |  | 1 | µA | VDS=25V | 3 |
| Gate to Source Leakage Current | IGSS | -100 |  | 100 | nA | VGS=±20V | 3 |
| Gate to Source Threshold Voltage | VGS(th) | 1.2 |  | 2.5 | V | VDS=VGS, ID=250µA | 3 |
| Drain to Source On Resistance | RDS(ON) |  | 3.2 | 3.9 | mΩ | ID=35A, VGS=10V | 3 |
| Drain to Source On Resistance | RDS(ON) |  | 3.6 | 4.4 | mΩ | ID=35A, VGS=4.5V | 3 |
| Drain to Source Voltage | VDSS |  |  | 30 | V | TC=25°C | 1 |
| Gate to Source Voltage | VGS | -20 |  | 20 | V | TC=25°C | 1 |
| Drain Current Continuous | ID |  |  | 35 | A | TC<168°C, VGS=10V | 1 |
| Drain Current Continuous | ID |  |  | 21 | A | Tamb=25°C, VGS=10V, with RθJA=52°C/W | 1 |
| Single Pulse Avalanche Energy | EAS |  |  | 690 | mJ | Starting TJ=25°C, L=1.77mH, IAS=28A (Note 1) | 1 |
| Power Dissipation | PD |  |  | 160 | W | TC=25°C | 1 |
| Operating and Storage Temperature | TJ, TSTG | -55 |  | 175 | °C |  | 1 |
| Thermal Resistance, Junction-to-Case TO-252 | RθJC |  | 0.94 |  | °C/W |  | 2 |
| Thermal Resistance, Junction-to-Ambient TO-252 | RθJA |  | 100 |  | °C/W |  | 2 |
| Thermal Resistance, Junction-to-Ambient TO-252, 1in² copper pad area | RθJA |  | 52 |  | °C/W | 1in² copper pad area | 2 |

## CAD (KiCad official)

- Symbol: `FDD044AN03L`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `fdd044an03l-etched.step` / `fdd044an03l-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `fdd044an03l.step` / `fdd044an03l.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [UMW datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8755876101497466880) (10 pp, sha256 `f25e94471c2f99d8`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/fdd044an03l-datasheet.pdf)