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FDD044AN03L

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UMW MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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FDD044AN03L

UMW · MOSFETs · TO-252

FDD044AN03L from UMW, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the N-channel MOSFET; the datasheet rates gate-to-source voltage VGS at ±20 V.
2 D passive Drain terminal of the N-channel MOSFET; the datasheet rates drain-to-source voltage VDSS at 30 V and continuous drain current ID at 35 A (VGS=10 V, TC<168°C).
3 S passive Source terminal of the N-channel MOSFET; it is the reference for the 30 V VDSS and ±20 V VGS ratings.

Key specifications

Parameter Value
Manufacturer UMW
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain to Source Breakdown Voltage BVDSS 30 V ID=250µA, VGS=0V 3
Zero Gate Voltage Drain Current IDSS 1 µA VDS=25V 3
Gate to Source Leakage Current IGSS -100 100 nA VGS=±20V 3
Gate to Source Threshold Voltage VGS(th) 1.2 2.5 V VDS=VGS, ID=250µA 3
Drain to Source On Resistance RDS(ON) 3.2 3.9 mΩ ID=35A, VGS=10V 3
Drain to Source On Resistance RDS(ON) 3.6 4.4 mΩ ID=35A, VGS=4.5V 3
Drain to Source Voltage VDSS 30 V TC=25°C 1
Gate to Source Voltage VGS -20 20 V TC=25°C 1
Drain Current Continuous ID 35 A TC<168°C, VGS=10V 1
Drain Current Continuous ID 21 A Tamb=25°C, VGS=10V, with RθJA=52°C/W 1
Single Pulse Avalanche Energy EAS 690 mJ Starting TJ=25°C, L=1.77mH, IAS=28A (Note 1) 1
Power Dissipation PD 160 W TC=25°C 1
Operating and Storage Temperature TJ, TSTG -55 175 °C 1
Thermal Resistance, Junction-to-Case TO-252 RθJC 0.94 °C/W 2
Thermal Resistance, Junction-to-Ambient TO-252 RθJA 100 °C/W 2
Thermal Resistance, Junction-to-Ambient TO-252, 1in² copper pad area RθJA 52 °C/W 1in² copper pad area 2

CAD (KiCad official)

  • Symbol: FDD044AN03L
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: fdd044an03l-etched.step / fdd044an03l-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); fdd044an03l.step / fdd044an03l.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: UMW datasheet (10 pp, sha256 f25e94471c2f99d8, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF