component

F12T4.5

Public Made by Adom

by adom

TLC Electronic Disposable Fuses, 1206. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentcircuit protectionf12t4.5factory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
f12t4-5 / README.md
History Download
Ray Publish 0.1.0 6162cbb 17d ago

F12T4.5

TLC Electronic · Disposable Fuses · 1206

F12T4.5 from TLC Electronic, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive One end-cap terminal of the non-polarized 4.5A, 32V DC slow-blow fuse, with 29 mOhm typical cold resistance and 50A DC breaking capacity.
2 2 passive Opposite end-cap terminal of the non-polarized 4.5A, 32V DC slow-blow fuse, interchangeable with the other terminal and soldered to a 1.52 x 2.03 mm land.

Key specifications

Parameter Value
Manufacturer TLC Electronic
Package 1206
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Opening time at rated current 1.0In (minimum) 4 hour At 1.0In rated current 2
Opening time at rated current 2.5In (maximum) 5 sec At 2.5In rated current 2
Opening time at rated current 3.0In 0.1 3 sec At 3.0In rated current 2
Opening time at rated current 10.0In 0.2 20 ms At 10.0In rated current 2
Operating temperature -55 125 °C With proper correction factor applied 6
Wave solder time in reservoir 10 sec Wave solder, reservoir temperature 260℃ 5
Infrared reflow time 30 sec Infrared reflow, temperature 260℃ 5
Preheat and soak temperature (Tsmin) Tsmin 150 °C Lead-free solder reflow profile, preheat and soak 5
Preheat and soak temperature (Tsmax) Tsmax 200 °C Lead-free solder reflow profile, preheat and soak 5
Preheat and soak time (tS) tS 60 120 sec Tsmin to Tsmax 5
Average ramp-up rate Tsmax to Tp 3 ℃/Second Lead-free solder reflow profile 5
Liquidous temperature (TL) TL 217 °C Lead-free solder reflow profile 5
Time at liquidous (tL) tL 60 150 sec Lead-free solder reflow profile 5
Average ramp-down rate (TP to Tsmax) 6 ℃/Second Lead-free solder reflow profile 5
Time from 25℃ to peak temperature 8 Minutes Lead-free solder reflow profile 5
Rated current 4.5 A 2
Rated voltage 32 V DC 2
Rated breaking capacity (DC interrupting rating) 50 A Measured at rated voltage, time constant of less than 50 microseconds, battery source 2
Typical cold resistance 29 mOhms Measured at <10% of rated current, ambient 25℃ 2
Typical voltage drop 164 mV 2
Typical pre-arcing I2t I2t 2.65 A2Sec Measured at 10In current 2
Wave solder reservoir temperature 260 ℃ Wave solder 5
Infrared reflow temperature 260 ℃ Infrared reflow 5
Peak package body temperature (TP) TP 260 ℃ Lead-free solder reflow profile 5
Time within 5℃ of classification temperature (tP) tP 30 Seconds Within 5℃ of TC 5

CAD (KiCad official)

  • Symbol: F12T4.5
  • Footprint: Fuse:Fuse_1206_3216Metric
  • 3D model: 1206 (KiCad packages3D, STEP)
  • 3D model files: f12t4-5-etched.step / f12t4-5-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); f12t4-5.step / f12t4-5.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TLC Electronic datasheet (6 pp, sha256 4e67f3bd8ce84db0, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF