component
F12T4.5
Public Made by Adomby adom
TLC Electronic Disposable Fuses, 1206. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownF12T4.5
TLC Electronic · Disposable Fuses · 1206
F12T4.5 from TLC Electronic, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One end-cap terminal of the non-polarized 4.5A, 32V DC slow-blow fuse, with 29 mOhm typical cold resistance and 50A DC breaking capacity. |
| 2 | 2 | passive | Opposite end-cap terminal of the non-polarized 4.5A, 32V DC slow-blow fuse, interchangeable with the other terminal and soldered to a 1.52 x 2.03 mm land. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TLC Electronic |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Opening time at rated current 1.0In (minimum) | 4 | hour | At 1.0In rated current | 2 | |||
| Opening time at rated current 2.5In (maximum) | 5 | sec | At 2.5In rated current | 2 | |||
| Opening time at rated current 3.0In | 0.1 | 3 | sec | At 3.0In rated current | 2 | ||
| Opening time at rated current 10.0In | 0.2 | 20 | ms | At 10.0In rated current | 2 | ||
| Operating temperature | -55 | 125 | °C | With proper correction factor applied | 6 | ||
| Wave solder time in reservoir | 10 | sec | Wave solder, reservoir temperature 260℃ | 5 | |||
| Infrared reflow time | 30 | sec | Infrared reflow, temperature 260℃ | 5 | |||
| Preheat and soak temperature (Tsmin) | Tsmin | 150 | °C | Lead-free solder reflow profile, preheat and soak | 5 | ||
| Preheat and soak temperature (Tsmax) | Tsmax | 200 | °C | Lead-free solder reflow profile, preheat and soak | 5 | ||
| Preheat and soak time (tS) | tS | 60 | 120 | sec | Tsmin to Tsmax | 5 | |
| Average ramp-up rate Tsmax to Tp | 3 | ℃/Second | Lead-free solder reflow profile | 5 | |||
| Liquidous temperature (TL) | TL | 217 | °C | Lead-free solder reflow profile | 5 | ||
| Time at liquidous (tL) | tL | 60 | 150 | sec | Lead-free solder reflow profile | 5 | |
| Average ramp-down rate (TP to Tsmax) | 6 | ℃/Second | Lead-free solder reflow profile | 5 | |||
| Time from 25℃ to peak temperature | 8 | Minutes | Lead-free solder reflow profile | 5 | |||
| Rated current | 4.5 | A | 2 | ||||
| Rated voltage | 32 | V | DC | 2 | |||
| Rated breaking capacity (DC interrupting rating) | 50 | A | Measured at rated voltage, time constant of less than 50 microseconds, battery source | 2 | |||
| Typical cold resistance | 29 | mOhms | Measured at <10% of rated current, ambient 25℃ | 2 | |||
| Typical voltage drop | 164 | mV | 2 | ||||
| Typical pre-arcing I2t | I2t | 2.65 | A2Sec | Measured at 10In current | 2 | ||
| Wave solder reservoir temperature | 260 | ℃ | Wave solder | 5 | |||
| Infrared reflow temperature | 260 | ℃ | Infrared reflow | 5 | |||
| Peak package body temperature (TP) | TP | 260 | ℃ | Lead-free solder reflow profile | 5 | ||
| Time within 5℃ of classification temperature (tP) | tP | 30 | Seconds | Within 5℃ of TC | 5 |
CAD (KiCad official)
- Symbol:
F12T4.5 - Footprint:
Fuse:Fuse_1206_3216Metric - 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files:
f12t4-5-etched.step/f12t4-5-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);f12t4-5.step/f12t4-5.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TLC Electronic datasheet (6 pp, sha256
4e67f3bd8ce84db0, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).