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ESP32-S3R2

Espressif Systems · RF and Wireless · 56-VFQFN Exposed Pad

ESP32-S3R2 from Espressif Systems, in a 56-VFQFN Exposed Pad. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 LNA_IN bidirectional Low Noise Amplifier (RF LNA) input/output signal for the 2.4 GHz RF path.
2 VDD3P3 power_in Analog power domain supply input for the chip.
3 VDD3P3 power_in Analog power domain supply input for the chip.
4 CHIP_PU input High enables the chip and low disables (powers down) it; do not leave this pin floating.
5 GPIO0 bidirectional Strapping pin for chip boot mode (with GPIO46), with weak pull-up at reset (default bit value 1).
6 GPIO1 bidirectional General-purpose IO with IO MUX/GPIO Matrix functions and ADC1_CH0/TOUCH1 analog function; default drive 20 mA.
7 GPIO2 bidirectional General-purpose IO with IO MUX/GPIO Matrix functions and ADC1_CH1/TOUCH2 analog function; default drive 20 mA.
8 GPIO3 bidirectional Strapping pin for JTAG signal source selection, floating by default at reset (Table 3-1).
9 GPIO4 bidirectional General-purpose IO with IO MUX/GPIO Matrix functions and ADC1_CH3/TOUCH4 analog function; default drive 20 mA.
10 GPIO5 bidirectional General-purpose IO with IO MUX/GPIO Matrix functions and ADC1_CH4/TOUCH5 analog function; default drive 20 mA.
11 GPIO6 bidirectional General-purpose IO with IO MUX/GPIO Matrix functions and ADC1_CH5/TOUCH6 analog function; default drive 20 mA.
12 GPIO7 bidirectional General-purpose IO with IO MUX/GPIO Matrix functions and ADC1_CH6/TOUCH7 analog function; default drive 20 mA.
13 GPIO8 bidirectional General-purpose IO with IO MUX/GPIO Matrix functions and ADC1_CH7/TOUCH8 analog function; default drive 20 mA.
14 GPIO9 bidirectional General-purpose IO with IO MUX/GPIO Matrix functions and ADC1_CH8/TOUCH9 analog function; default drive 20 mA.
15 GPIO10 bidirectional General-purpose IO with IO MUX/GPIO Matrix functions and ADC1_CH9/TOUCH10 analog function; default drive 20 mA.
16 GPIO11 bidirectional General-purpose IO with IO MUX/GPIO Matrix functions and ADC2_CH0/TOUCH11 analog function; default drive 20 mA.
17 GPIO12 bidirectional General-purpose IO with IO MUX/GPIO Matrix functions and ADC2_CH1/TOUCH12 analog function; default drive 20 mA.
18 GPIO13 bidirectional General-purpose IO with IO MUX/GPIO Matrix functions and ADC2_CH2/TOUCH13 analog function; default drive 20 mA.
19 GPIO14 bidirectional General-purpose IO with IO MUX/GPIO Matrix functions and ADC2_CH3/TOUCH14 analog function; default drive 20 mA.
20 VDD3P3_RTC power_in Supply input for the RTC and part of the digital power domains, including RTC IO pins.
21 XTAL_32K_P bidirectional Positive 32 kHz clock connection to the chip's oscillator, also usable as ADC2_CH4 analog function (RTC_GPIO15).
22 XTAL_32K_N bidirectional Negative 32 kHz external clock input/output, also usable as ADC2_CH5 analog function (RTC_GPIO16).
23 GPIO17 bidirectional General-purpose IO with ADC2_CH6 analog function; default drive strength 10 mA.
24 GPIO18 bidirectional General-purpose IO with ADC2_CH7 analog function; default drive strength 10 mA.
25 GPIO19 bidirectional General-purpose IO that by default serves as USB_D- for the USB Serial/JTAG and USB OTG function; default drive strength 40 mA.
26 GPIO20 bidirectional General-purpose IO that by default serves as USB_D+ for the USB Serial/JTAG and USB OTG function; default drive strength 40 mA.
27 GPIO21 bidirectional General-purpose IO with IO MUX and RTC GPIO functions; default drive strength 20 mA.
28 SPICS1 bidirectional SPI chip select 1 powered by VDD_SPI, used to connect the in-package PSRAM and not recommended for other use.
29 VDD_SPI power_out Backup power line input or regulated output for the in-package flash/PSRAM and SPI IO, configurable as input or output.
30 SPIHD bidirectional SPI hold signal (SIO3 / DQ3) for the in-package flash/PSRAM, powered by VDD_SPI and not for other use.
31 SPIWP bidirectional SPI write-protect signal (SIO2 / DQ2) for the in-package flash/PSRAM, powered by VDD_SPI and not for other use.
32 SPICS0 bidirectional SPI chip select 0 for the in-package flash, powered by VDD_SPI and not for other use.
33 SPICLK bidirectional SPI clock for the in-package flash/PSRAM, powered by VDD_SPI and not for other use.
34 SPIQ bidirectional SPI data line (DO / SO / SIO1 / DQ1) for the in-package flash/PSRAM, powered by VDD_SPI and not for other use.
35 SPID bidirectional SPI data line (DI / SI / SIO0 / DQ0) for the in-package flash/PSRAM, powered by VDD_SPI and not for other use.
36 SPICLK_N bidirectional Negative differential SPI clock, powered by VDD_SPI or VDD3P3_CPU, reserved for in-package memory unless the chip is not connected to 8-line SPI memory.
37 SPICLK_P bidirectional Positive differential SPI clock, powered by VDD_SPI or VDD3P3_CPU, reserved for in-package memory unless the chip is not connected to 8-line SPI memory.
38 GPIO33 bidirectional Data line DQ4 for the in-package octal PSRAM/flash, powered by VDD_SPI or VDD3P3_CPU; usable as GPIO only if no 8-line SPI memory is connected.
39 GPIO34 bidirectional Data line DQ5 for the in-package octal PSRAM/flash, powered by VDD_SPI or VDD3P3_CPU; usable as GPIO only if no 8-line SPI memory is connected.
40 GPIO35 bidirectional Data line DQ6 for the in-package octal PSRAM/flash, powered by VDD_SPI or VDD3P3_CPU; usable as GPIO only if no 8-line SPI memory is connected.
41 GPIO36 bidirectional Data line DQ7 for the in-package octal PSRAM/flash, powered by VDD_SPI or VDD3P3_CPU; usable as GPIO only if no 8-line SPI memory is connected.
42 GPIO37 bidirectional Data strobe/data mask (DQS/DM) for the in-package octal memory, powered by VDD_SPI or VDD3P3_CPU; usable as GPIO only if no 8-line SPI memory is connected.
43 GPIO38 bidirectional General-purpose IO powered by VDD3P3_CPU, with FSPIWP and SUBSPIWP functions.
44 MTCK bidirectional JTAG test clock (default function), powered by VDD3P3_CPU; can be reassigned to GPIO39 via IO MUX.
45 MTDO bidirectional JTAG test data out (default function), powered by VDD3P3_CPU; can be reassigned to GPIO40 via IO MUX.
46 VDD3P3_CPU power_in Supply input for the digital power domain and digital IO pins.
47 MTDI bidirectional JTAG test data in (default function), powered by VDD3P3_CPU; can be reassigned to GPIO41 via IO MUX.
48 MTMS bidirectional JTAG test mode select (default function), powered by VDD3P3_CPU; can be reassigned to GPIO42 via IO MUX.
49 U0TXD bidirectional UART0 transmit (default function) with weak pull-up at reset, powered by VDD3P3_CPU; can be reassigned to GPIO43.
50 U0RXD bidirectional UART0 receive (default function) with weak pull-up at reset, powered by VDD3P3_CPU; can be reassigned to GPIO44.
51 GPIO45 bidirectional Strapping pin for VDD_SPI voltage selection, with weak pull-down at reset (default bit value 0).
52 GPIO46 bidirectional Strapping pin for chip boot mode and ROM message printing, with weak pull-down at reset (default bit value 0).
53 XTAL_N passive Negative external clock input/output connected to the chip's crystal or oscillator.
54 XTAL_P passive Positive external clock input/output connected to the chip's crystal or oscillator.
55 VDDA power_in Analog power domain supply input.
56 VDDA power_in Analog power domain supply input.
57 GND power_in External ground connection.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 56-VFQFN Exposed Pad
Category RF and Wireless
Pins 57

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Allowed input voltage -0.3 3.6 V 64
Cumulative IO output current Ioutput 1500 mA 64
Storage temperature TSTORE -40 150 °C 64
Recommended input voltage VDDA, VDD3P3 3 3.3 3.6 V 64
VDD_SPI (as input) VDD_SPI 1.8 3.3 3.6 V 64
Cumulative input current IVDD 0.5 A 64
Input current high-level IIH 50 nA 65
Input current low-level IIL 50 nA 65
Differential nonlinearity DNL -4 4 LSB 66
Integral nonlinearity INL -8 8 LSB 66
Sampling rate 100 kSPS 66
Total error -5 5 mV ATTEN0, effective measurement range of 0 ~ 850 66
Total error -6 6 mV ATTEN1, effective measurement range of 0 ~ 1100 66
Total error -10 10 mV ATTEN2, effective measurement range of 0 ~ 1600 66
Total error -50 50 mV ATTEN3, effective measurement range of 0 ~ 2900 66
Power supply voltage (1.8 V PSRAM) VCC 1.62 1.8 1.98 V 69
Power supply voltage (3.3 V PSRAM) VCC 2.7 3.3 3.6 V 69
Maximum clock frequency (PSRAM) FC 80 MHz 69
Time reserved for power rails to stabilize before CHIP_PU is pulled high tSTBL 50 µs 30
Time reserved for CHIP_PU to stay below VIL_nRST to reset the chip tRST 50 µs 30
Pin capacitance CIN 2 pF 65
High-level source current IOH 40 mA VDD = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3 65
Low-level sink current IOL 28 mA VDD = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3 65
Internal weak pull-up resistor RPU 45 kΩ 65
Internal weak pull-down resistor RPD 45 kΩ 65
VDD_SPI powered by VDD3P3_RTC via RSPI for 3.3 V flash/PSRAM RSPI 14 Ω 65
Output current when VDD_SPI is powered by Flash Voltage Regulator for 1.8 V flash/PSRAM ISPI 40 mA 65

CAD (KiCad official)

  • Symbol: ESP32-S3R2
  • Footprint: Package_DFN_QFN:QFN-56-1EP_7x7mm_P0.4mm_EP5.6x5.6mm
  • 3D model: 56-VFQFN Exposed Pad (KiCad packages3D, STEP)
  • 3D model files: esp32-s3r2-etched.step / esp32-s3r2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-s3r2.step / esp32-s3r2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (87 pp, sha256 2d5a7cb7fd559d8d, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF