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ESP32-S3-MINI-1-N8
Public Made by Adomby adom
Espressif Systems WiFi Modules, ESP32-S3-MINI-1. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ESP32-S3-MINI-1-N8
Espressif Systems · WiFi Modules · ESP32-S3-MINI-1
ESP32-S3-MINI-1-N8 from Espressif Systems, in a ESP32-S3-MINI-1. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin of the module. |
| 2 | GND | power_in | Ground pin of the module. |
| 3 | 3V3 | power_in | Module power supply input; VDD33 is specified at 3.0 V min, 3.3 V typ, 3.6 V max, with at least 0.5 A delivered by the external supply. |
| 4 | IO0 | bidirectional | GPIO0 with RTC_GPIO0 function; strapping pin sampled at reset for chip boot mode, default weak pull-up. |
| 5 | IO1 | bidirectional | GPIO1 with RTC_GPIO1, TOUCH1 and ADC1_CH0 alternate functions. |
| 6 | IO2 | bidirectional | GPIO2 with RTC_GPIO2, TOUCH2 and ADC1_CH1 alternate functions. |
| 7 | IO3 | bidirectional | GPIO3 with RTC_GPIO3, TOUCH3 and ADC1_CH2 alternate functions; strapping pin for JTAG signal source, floating by default. |
| 8 | IO4 | bidirectional | GPIO4 with RTC_GPIO4, TOUCH4 and ADC1_CH3 alternate functions. |
| 9 | IO5 | bidirectional | GPIO5 with RTC_GPIO5, TOUCH5 and ADC1_CH4 alternate functions. |
| 10 | IO6 | bidirectional | GPIO6 with RTC_GPIO6, TOUCH6 and ADC1_CH5 alternate functions. |
| 11 | IO7 | bidirectional | GPIO7 with RTC_GPIO7, TOUCH7 and ADC1_CH6 alternate functions. |
| 12 | IO8 | bidirectional | GPIO8 with RTC_GPIO8, TOUCH8, ADC1_CH7 and SUBSPICS1 alternate functions. |
| 13 | IO9 | bidirectional | GPIO9 with RTC_GPIO9, TOUCH9, ADC1_CH8, FSPIHD and SUBSPIHD alternate functions. |
| 14 | IO10 | bidirectional | GPIO10 with RTC_GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4 and SUBSPICS0 alternate functions. |
| 15 | IO11 | bidirectional | GPIO11 with RTC_GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5 and SUBSPID alternate functions. |
| 16 | IO12 | bidirectional | GPIO12 with RTC_GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6 and SUBSPICLK alternate functions. |
| 17 | IO13 | bidirectional | GPIO13 with RTC_GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7 and SUBSPIQ alternate functions. |
| 18 | IO14 | bidirectional | GPIO14 with RTC_GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS and SUBSPIWP alternate functions. |
| 19 | IO15 | bidirectional | GPIO15 with RTC_GPIO15, U0RTS, ADC2_CH4 and XTAL_32K_P alternate functions. |
| 20 | IO16 | bidirectional | GPIO16 with RTC_GPIO16, U0CTS, ADC2_CH5 and XTAL_32K_N alternate functions. |
| 21 | IO17 | bidirectional | GPIO17 with RTC_GPIO17, U1TXD and ADC2_CH6 alternate functions. |
| 22 | IO18 | bidirectional | GPIO18 with RTC_GPIO18, U1RXD, ADC2_CH7 and CLK_OUT3 alternate functions. |
| 23 | IO19 | bidirectional | GPIO19 with RTC_GPIO19, U1RTS, ADC2_CH8, CLK_OUT2 and USB_D- alternate functions. |
| 24 | IO20 | bidirectional | GPIO20 with RTC_GPIO20, U1CTS, ADC2_CH9, CLK_OUT1 and USB_D+ alternate functions. |
| 25 | IO21 | bidirectional | GPIO21 with RTC_GPIO21 function. |
| 26 | IO26 | bidirectional | GPIO26 with SPICS1 function; on modules with -N4R2 part numbers it connects to the embedded PSRAM and is not available for other uses. |
| 27 | IO47 | bidirectional | GPIO47 with SPICLK_P_DIFF and SUBSPICLK_P_DIFF alternate functions. |
| 28 | IO33 | bidirectional | GPIO33 with SPIIO4, FSPIHD and SUBSPIHD alternate functions; default function is set by an eFuse bit. |
| 29 | IO34 | bidirectional | GPIO34 with SPIIO5, FSPICS0 and SUBSPICS0 alternate functions; default function is set by an eFuse bit. |
| 30 | IO48 | bidirectional | GPIO48 with SPICLK_N_DIFF and SUBSPICLK_N_DIFF alternate functions. |
| 31 | IO35 | bidirectional | GPIO35 with SPIIO6, FSPID and SUBSPID alternate functions; default function is set by an eFuse bit. |
| 32 | IO36 | bidirectional | GPIO36 with SPIIO7, FSPICLK and SUBSPICLK alternate functions; default function is set by an eFuse bit. |
| 33 | IO37 | bidirectional | GPIO37 with SPIDQS, FSPIQ and SUBSPIQ alternate functions; default function is set by an eFuse bit. |
| 34 | IO38 | bidirectional | GPIO38 with FSPIWP and SUBSPIWP alternate functions. |
| 35 | IO39 | bidirectional | GPIO39 with MTCK, CLK_OUT3 and SUBSPICS1 alternate functions. |
| 36 | IO40 | bidirectional | GPIO40 with MTDO and CLK_OUT2 alternate functions. |
| 37 | IO41 | bidirectional | GPIO41 with MTDI and CLK_OUT1 alternate functions. |
| 38 | IO42 | bidirectional | GPIO42 with MTMS alternate function. |
| 39 | TXD0 | bidirectional | GPIO43 with U0TXD and CLK_OUT1 alternate functions (UART0 transmit). |
| 40 | RXD0 | bidirectional | GPIO44 with U0RXD and CLK_OUT2 alternate functions (UART0 receive). |
| 41 | IO45 | bidirectional | GPIO45 general-purpose I/O; strapping pin for VDD_SPI voltage, default weak pull-down (bit value 0). |
| 42 | GND | power_in | Ground pin of the module. |
| 43 | GND | power_in | Ground pin of the module. |
| 44 | IO46 | bidirectional | GPIO46 general-purpose I/O; strapping pin for chip boot mode and ROM message printing, default weak pull-down (bit value 0). |
| 45 | EN | input | High enables the chip, low powers it off; do not leave this pin floating. |
| 46 | GND | power_in | Ground pin of the module. |
| 47 | GND | power_in | Ground pin of the module. |
| 48 | GND | power_in | Ground pin of the module. |
| 49 | GND | power_in | Ground pin of the module. |
| 50 | GND | power_in | Ground pin of the module. |
| 51 | GND | power_in | Ground pin of the module. |
| 52 | GND | power_in | Ground pin of the module. |
| 53 | GND | power_in | Ground pin of the module. |
| 54 | GND | power_in | Ground pin of the module. |
| 55 | GND | power_in | Ground pin of the module. |
| 56 | GND | power_in | Ground pin of the module. |
| 57 | GND | power_in | Ground pin of the module. |
| 58 | GND | power_in | Ground pin of the module. |
| 59 | GND | power_in | Ground pin of the module. |
| 60 | GND | power_in | Ground pin of the module. |
| 61 | GND | power_in | Ground pin; the schematic labels it EPAD, and soldering it to the base-board ground is optional but improves thermal performance. |
| 62 | GND | power_in | Ground pin of the module. |
| 63 | GND | power_in | Ground pin of the module. |
| 64 | GND | power_in | Ground pin of the module. |
| 65 | GND | power_in | Ground pin of the module. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Espressif Systems |
| Package | ESP32-S3-MINI-1 |
| Category | IoT/Communication Modules |
| Pins | 65 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VDD33 | -0.3 | 3.6 | V | 27 | ||
| Storage temperature | TSTORE | -40 | 105 | °C | 27 | ||
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V | 27 | |
| Current delivered by external power supply | IVDD | 0.5 | A | 27 | |||
| Operating ambient temperature | TA | -40 | 85 | °C | 27 | ||
| High-level input current | IIH | 50 | nA | 27 | |||
| Low-level input current | IIL | 50 | nA | 27 | |||
| Pin capacitance | CIN | 2 | pF | 27 | |||
| High-level source current | IOH | 40 | mA | VDD = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3 | 27 | ||
| Low-level sink current | IOL | 28 | mA | VDD = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3 | 27 | ||
| Internal weak pull-up resistor | RPU | 45 | kΩ | 27 | |||
| Internal weak pull-down resistor | RPD | 45 | kΩ | 27 | |||
| Power supply voltage (1.8 V) | VCC | 1.65 | 1.8 | 2 | V | Flash, 1.8 V supply | 30 |
| Power supply voltage (3.3 V) | VCC | 2.7 | 3.3 | 3.6 | V | Flash, 3.3 V supply | 30 |
| Maximum clock frequency | FC | 80 | MHz | Flash | 30 | ||
| Program/erase cycles | 100000 | cycles | Flash | 30 | |||
| Data retention time | TRET | 20 | years | Flash | 30 | ||
| Page program time | TPP | 0.8 | 5 | ms | Flash | 30 | |
| Sector erase time (4 KB) | TSE | 70 | 500 | ms | Flash, 4 KB sector | 30 | |
| Block erase time (32 KB) | TBE1 | 0.2 | 2 | s | Flash, 32 KB block | 30 | |
| Block erase time (64 KB) | TBE2 | 0.3 | 3 | s | Flash, 64 KB block | 30 | |
| Chip erase time (64 Mb) | TCE | 25 | 100 | s | Flash, 64 Mb (8 MB) | 30 | |
| Internal crystal oscillator frequency | 40 | MHz | Module-integrated 40 MHz crystal (Y1) | 39 | |||
| Internal crystal oscillator frequency tolerance | -10 | 10 | ppm | Y1 40 MHz crystal, ±10 ppm as printed | 39 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | THERMOPLASTIC | HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; | 43 | |
| contacts | COPPER ALLOY | gold | CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 43 |
| shell | COPPER ALLOY | gold | SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 43 |
CAD (KiCad official)
- Symbol:
ESP32-S3-MINI-1-N8 - Footprint:
PCM_Espressif:ESP32-S3-MINI-1 - 3D model: ESP32-S3-MINI-1 (KiCad packages3D, STEP)
- 3D model files:
esp32-s3-mini-1-n8-etched.step/esp32-s3-mini-1-n8-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esp32-s3-mini-1-n8.step/esp32-s3-mini-1-n8.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Espressif Systems datasheet (53 pp, sha256
4d4b7f1c17b484c6, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ESP32-S3-MINI-1-N8
**Espressif Systems** · WiFi Modules · ESP32-S3-MINI-1
ESP32-S3-MINI-1-N8 from Espressif Systems, in a ESP32-S3-MINI-1. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin of the module. |
| 2 | GND | power_in | Ground pin of the module. |
| 3 | 3V3 | power_in | Module power supply input; VDD33 is specified at 3.0 V min, 3.3 V typ, 3.6 V max, with at least 0.5 A delivered by the external supply. |
| 4 | IO0 | bidirectional | GPIO0 with RTC_GPIO0 function; strapping pin sampled at reset for chip boot mode, default weak pull-up. |
| 5 | IO1 | bidirectional | GPIO1 with RTC_GPIO1, TOUCH1 and ADC1_CH0 alternate functions. |
| 6 | IO2 | bidirectional | GPIO2 with RTC_GPIO2, TOUCH2 and ADC1_CH1 alternate functions. |
| 7 | IO3 | bidirectional | GPIO3 with RTC_GPIO3, TOUCH3 and ADC1_CH2 alternate functions; strapping pin for JTAG signal source, floating by default. |
| 8 | IO4 | bidirectional | GPIO4 with RTC_GPIO4, TOUCH4 and ADC1_CH3 alternate functions. |
| 9 | IO5 | bidirectional | GPIO5 with RTC_GPIO5, TOUCH5 and ADC1_CH4 alternate functions. |
| 10 | IO6 | bidirectional | GPIO6 with RTC_GPIO6, TOUCH6 and ADC1_CH5 alternate functions. |
| 11 | IO7 | bidirectional | GPIO7 with RTC_GPIO7, TOUCH7 and ADC1_CH6 alternate functions. |
| 12 | IO8 | bidirectional | GPIO8 with RTC_GPIO8, TOUCH8, ADC1_CH7 and SUBSPICS1 alternate functions. |
| 13 | IO9 | bidirectional | GPIO9 with RTC_GPIO9, TOUCH9, ADC1_CH8, FSPIHD and SUBSPIHD alternate functions. |
| 14 | IO10 | bidirectional | GPIO10 with RTC_GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4 and SUBSPICS0 alternate functions. |
| 15 | IO11 | bidirectional | GPIO11 with RTC_GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5 and SUBSPID alternate functions. |
| 16 | IO12 | bidirectional | GPIO12 with RTC_GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6 and SUBSPICLK alternate functions. |
| 17 | IO13 | bidirectional | GPIO13 with RTC_GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7 and SUBSPIQ alternate functions. |
| 18 | IO14 | bidirectional | GPIO14 with RTC_GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS and SUBSPIWP alternate functions. |
| 19 | IO15 | bidirectional | GPIO15 with RTC_GPIO15, U0RTS, ADC2_CH4 and XTAL_32K_P alternate functions. |
| 20 | IO16 | bidirectional | GPIO16 with RTC_GPIO16, U0CTS, ADC2_CH5 and XTAL_32K_N alternate functions. |
| 21 | IO17 | bidirectional | GPIO17 with RTC_GPIO17, U1TXD and ADC2_CH6 alternate functions. |
| 22 | IO18 | bidirectional | GPIO18 with RTC_GPIO18, U1RXD, ADC2_CH7 and CLK_OUT3 alternate functions. |
| 23 | IO19 | bidirectional | GPIO19 with RTC_GPIO19, U1RTS, ADC2_CH8, CLK_OUT2 and USB_D- alternate functions. |
| 24 | IO20 | bidirectional | GPIO20 with RTC_GPIO20, U1CTS, ADC2_CH9, CLK_OUT1 and USB_D+ alternate functions. |
| 25 | IO21 | bidirectional | GPIO21 with RTC_GPIO21 function. |
| 26 | IO26 | bidirectional | GPIO26 with SPICS1 function; on modules with -N4R2 part numbers it connects to the embedded PSRAM and is not available for other uses. |
| 27 | IO47 | bidirectional | GPIO47 with SPICLK_P_DIFF and SUBSPICLK_P_DIFF alternate functions. |
| 28 | IO33 | bidirectional | GPIO33 with SPIIO4, FSPIHD and SUBSPIHD alternate functions; default function is set by an eFuse bit. |
| 29 | IO34 | bidirectional | GPIO34 with SPIIO5, FSPICS0 and SUBSPICS0 alternate functions; default function is set by an eFuse bit. |
| 30 | IO48 | bidirectional | GPIO48 with SPICLK_N_DIFF and SUBSPICLK_N_DIFF alternate functions. |
| 31 | IO35 | bidirectional | GPIO35 with SPIIO6, FSPID and SUBSPID alternate functions; default function is set by an eFuse bit. |
| 32 | IO36 | bidirectional | GPIO36 with SPIIO7, FSPICLK and SUBSPICLK alternate functions; default function is set by an eFuse bit. |
| 33 | IO37 | bidirectional | GPIO37 with SPIDQS, FSPIQ and SUBSPIQ alternate functions; default function is set by an eFuse bit. |
| 34 | IO38 | bidirectional | GPIO38 with FSPIWP and SUBSPIWP alternate functions. |
| 35 | IO39 | bidirectional | GPIO39 with MTCK, CLK_OUT3 and SUBSPICS1 alternate functions. |
| 36 | IO40 | bidirectional | GPIO40 with MTDO and CLK_OUT2 alternate functions. |
| 37 | IO41 | bidirectional | GPIO41 with MTDI and CLK_OUT1 alternate functions. |
| 38 | IO42 | bidirectional | GPIO42 with MTMS alternate function. |
| 39 | TXD0 | bidirectional | GPIO43 with U0TXD and CLK_OUT1 alternate functions (UART0 transmit). |
| 40 | RXD0 | bidirectional | GPIO44 with U0RXD and CLK_OUT2 alternate functions (UART0 receive). |
| 41 | IO45 | bidirectional | GPIO45 general-purpose I/O; strapping pin for VDD_SPI voltage, default weak pull-down (bit value 0). |
| 42 | GND | power_in | Ground pin of the module. |
| 43 | GND | power_in | Ground pin of the module. |
| 44 | IO46 | bidirectional | GPIO46 general-purpose I/O; strapping pin for chip boot mode and ROM message printing, default weak pull-down (bit value 0). |
| 45 | EN | input | High enables the chip, low powers it off; do not leave this pin floating. |
| 46 | GND | power_in | Ground pin of the module. |
| 47 | GND | power_in | Ground pin of the module. |
| 48 | GND | power_in | Ground pin of the module. |
| 49 | GND | power_in | Ground pin of the module. |
| 50 | GND | power_in | Ground pin of the module. |
| 51 | GND | power_in | Ground pin of the module. |
| 52 | GND | power_in | Ground pin of the module. |
| 53 | GND | power_in | Ground pin of the module. |
| 54 | GND | power_in | Ground pin of the module. |
| 55 | GND | power_in | Ground pin of the module. |
| 56 | GND | power_in | Ground pin of the module. |
| 57 | GND | power_in | Ground pin of the module. |
| 58 | GND | power_in | Ground pin of the module. |
| 59 | GND | power_in | Ground pin of the module. |
| 60 | GND | power_in | Ground pin of the module. |
| 61 | GND | power_in | Ground pin; the schematic labels it EPAD, and soldering it to the base-board ground is optional but improves thermal performance. |
| 62 | GND | power_in | Ground pin of the module. |
| 63 | GND | power_in | Ground pin of the module. |
| 64 | GND | power_in | Ground pin of the module. |
| 65 | GND | power_in | Ground pin of the module. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Espressif Systems |
| Package | ESP32-S3-MINI-1 |
| Category | IoT/Communication Modules |
| Pins | 65 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VDD33 | -0.3 | | 3.6 | V | | 27 |
| Storage temperature | TSTORE | -40 | | 105 | °C | | 27 |
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V | | 27 |
| Current delivered by external power supply | IVDD | 0.5 | | | A | | 27 |
| Operating ambient temperature | TA | -40 | | 85 | °C | | 27 |
| High-level input current | IIH | | | 50 | nA | | 27 |
| Low-level input current | IIL | | | 50 | nA | | 27 |
| Pin capacitance | CIN | | 2 | | pF | | 27 |
| High-level source current | IOH | | 40 | | mA | VDD = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3 | 27 |
| Low-level sink current | IOL | | 28 | | mA | VDD = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3 | 27 |
| Internal weak pull-up resistor | RPU | | 45 | | kΩ | | 27 |
| Internal weak pull-down resistor | RPD | | 45 | | kΩ | | 27 |
| Power supply voltage (1.8 V) | VCC | 1.65 | 1.8 | 2 | V | Flash, 1.8 V supply | 30 |
| Power supply voltage (3.3 V) | VCC | 2.7 | 3.3 | 3.6 | V | Flash, 3.3 V supply | 30 |
| Maximum clock frequency | FC | 80 | | | MHz | Flash | 30 |
| Program/erase cycles | | 100000 | | | cycles | Flash | 30 |
| Data retention time | TRET | 20 | | | years | Flash | 30 |
| Page program time | TPP | | 0.8 | 5 | ms | Flash | 30 |
| Sector erase time (4 KB) | TSE | | 70 | 500 | ms | Flash, 4 KB sector | 30 |
| Block erase time (32 KB) | TBE1 | | 0.2 | 2 | s | Flash, 32 KB block | 30 |
| Block erase time (64 KB) | TBE2 | | 0.3 | 3 | s | Flash, 64 KB block | 30 |
| Chip erase time (64 Mb) | TCE | | 25 | 100 | s | Flash, 64 Mb (8 MB) | 30 |
| Internal crystal oscillator frequency | | | 40 | | MHz | Module-integrated 40 MHz crystal (Y1) | 39 |
| Internal crystal oscillator frequency tolerance | | -10 | | 10 | ppm | Y1 40 MHz crystal, ±10 ppm as printed | 39 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | THERMOPLASTIC | | HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; | 43 |
| contacts | COPPER ALLOY | gold | CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 43 |
| shell | COPPER ALLOY | gold | SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 43 |
## CAD (KiCad official)
- Symbol: `ESP32-S3-MINI-1-N8`
- Footprint: `PCM_Espressif:ESP32-S3-MINI-1`
- 3D model: ESP32-S3-MINI-1 (KiCad packages3D, STEP)
- 3D model files: `esp32-s3-mini-1-n8-etched.step` / `esp32-s3-mini-1-n8-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esp32-s3-mini-1-n8.step` / `esp32-s3-mini-1-n8.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Espressif Systems datasheet](https://www.espressif.com/sites/default/files/documentation/esp32-s3-mini-1_mini-1u_datasheet_en.pdf) (53 pp, sha256 `4d4b7f1c17b484c6`, retrieved 2026-10-28, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/esp32-s3-mini-1-n8-datasheet.pdf)