component

ESP32-S3-MINI-1-N8

Public Made by Adom

by adom

Espressif Systems WiFi Modules, ESP32-S3-MINI-1. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentiot-communication modulesesp32-s3-mini-1-n8factory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
Download ZIP Propose a change
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20251024
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 7d ago
viewers esp32-s3-mini-1-n8: viewers · Ray 7d ago
esp32-s3-mini-1-n8-etched.glb esp32-s3-mini-1-n8: factory component page (tier=mfr) · Ray 7d ago
esp32-s3-mini-1-n8-etched.step esp32-s3-mini-1-n8: factory component page (tier=mfr) · Ray 7d ago
esp32-s3-mini-1-n8.glb Publish 0.1.0 · Ray 7d ago
esp32-s3-mini-1-n8.kicad_mod Publish 0.1.0 · Ray 7d ago
esp32-s3-mini-1-n8.kicad_sym Publish 0.1.0 · Ray 7d ago
esp32-s3-mini-1-n8.lbr Publish 0.1.0 · Ray 7d ago
esp32-s3-mini-1-n8.step Publish 0.1.0 · Ray 7d ago
package.json Publish 0.1.0 · Ray 7d ago
page.json Set visibility: public · Ray 7d ago
README.md Publish 0.1.0 · Ray 7d ago

ESP32-S3-MINI-1-N8

Espressif Systems · WiFi Modules · ESP32-S3-MINI-1

ESP32-S3-MINI-1-N8 from Espressif Systems, in a ESP32-S3-MINI-1. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin of the module.
2 GND power_in Ground pin of the module.
3 3V3 power_in Module power supply input; VDD33 is specified at 3.0 V min, 3.3 V typ, 3.6 V max, with at least 0.5 A delivered by the external supply.
4 IO0 bidirectional GPIO0 with RTC_GPIO0 function; strapping pin sampled at reset for chip boot mode, default weak pull-up.
5 IO1 bidirectional GPIO1 with RTC_GPIO1, TOUCH1 and ADC1_CH0 alternate functions.
6 IO2 bidirectional GPIO2 with RTC_GPIO2, TOUCH2 and ADC1_CH1 alternate functions.
7 IO3 bidirectional GPIO3 with RTC_GPIO3, TOUCH3 and ADC1_CH2 alternate functions; strapping pin for JTAG signal source, floating by default.
8 IO4 bidirectional GPIO4 with RTC_GPIO4, TOUCH4 and ADC1_CH3 alternate functions.
9 IO5 bidirectional GPIO5 with RTC_GPIO5, TOUCH5 and ADC1_CH4 alternate functions.
10 IO6 bidirectional GPIO6 with RTC_GPIO6, TOUCH6 and ADC1_CH5 alternate functions.
11 IO7 bidirectional GPIO7 with RTC_GPIO7, TOUCH7 and ADC1_CH6 alternate functions.
12 IO8 bidirectional GPIO8 with RTC_GPIO8, TOUCH8, ADC1_CH7 and SUBSPICS1 alternate functions.
13 IO9 bidirectional GPIO9 with RTC_GPIO9, TOUCH9, ADC1_CH8, FSPIHD and SUBSPIHD alternate functions.
14 IO10 bidirectional GPIO10 with RTC_GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4 and SUBSPICS0 alternate functions.
15 IO11 bidirectional GPIO11 with RTC_GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5 and SUBSPID alternate functions.
16 IO12 bidirectional GPIO12 with RTC_GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6 and SUBSPICLK alternate functions.
17 IO13 bidirectional GPIO13 with RTC_GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7 and SUBSPIQ alternate functions.
18 IO14 bidirectional GPIO14 with RTC_GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS and SUBSPIWP alternate functions.
19 IO15 bidirectional GPIO15 with RTC_GPIO15, U0RTS, ADC2_CH4 and XTAL_32K_P alternate functions.
20 IO16 bidirectional GPIO16 with RTC_GPIO16, U0CTS, ADC2_CH5 and XTAL_32K_N alternate functions.
21 IO17 bidirectional GPIO17 with RTC_GPIO17, U1TXD and ADC2_CH6 alternate functions.
22 IO18 bidirectional GPIO18 with RTC_GPIO18, U1RXD, ADC2_CH7 and CLK_OUT3 alternate functions.
23 IO19 bidirectional GPIO19 with RTC_GPIO19, U1RTS, ADC2_CH8, CLK_OUT2 and USB_D- alternate functions.
24 IO20 bidirectional GPIO20 with RTC_GPIO20, U1CTS, ADC2_CH9, CLK_OUT1 and USB_D+ alternate functions.
25 IO21 bidirectional GPIO21 with RTC_GPIO21 function.
26 IO26 bidirectional GPIO26 with SPICS1 function; on modules with -N4R2 part numbers it connects to the embedded PSRAM and is not available for other uses.
27 IO47 bidirectional GPIO47 with SPICLK_P_DIFF and SUBSPICLK_P_DIFF alternate functions.
28 IO33 bidirectional GPIO33 with SPIIO4, FSPIHD and SUBSPIHD alternate functions; default function is set by an eFuse bit.
29 IO34 bidirectional GPIO34 with SPIIO5, FSPICS0 and SUBSPICS0 alternate functions; default function is set by an eFuse bit.
30 IO48 bidirectional GPIO48 with SPICLK_N_DIFF and SUBSPICLK_N_DIFF alternate functions.
31 IO35 bidirectional GPIO35 with SPIIO6, FSPID and SUBSPID alternate functions; default function is set by an eFuse bit.
32 IO36 bidirectional GPIO36 with SPIIO7, FSPICLK and SUBSPICLK alternate functions; default function is set by an eFuse bit.
33 IO37 bidirectional GPIO37 with SPIDQS, FSPIQ and SUBSPIQ alternate functions; default function is set by an eFuse bit.
34 IO38 bidirectional GPIO38 with FSPIWP and SUBSPIWP alternate functions.
35 IO39 bidirectional GPIO39 with MTCK, CLK_OUT3 and SUBSPICS1 alternate functions.
36 IO40 bidirectional GPIO40 with MTDO and CLK_OUT2 alternate functions.
37 IO41 bidirectional GPIO41 with MTDI and CLK_OUT1 alternate functions.
38 IO42 bidirectional GPIO42 with MTMS alternate function.
39 TXD0 bidirectional GPIO43 with U0TXD and CLK_OUT1 alternate functions (UART0 transmit).
40 RXD0 bidirectional GPIO44 with U0RXD and CLK_OUT2 alternate functions (UART0 receive).
41 IO45 bidirectional GPIO45 general-purpose I/O; strapping pin for VDD_SPI voltage, default weak pull-down (bit value 0).
42 GND power_in Ground pin of the module.
43 GND power_in Ground pin of the module.
44 IO46 bidirectional GPIO46 general-purpose I/O; strapping pin for chip boot mode and ROM message printing, default weak pull-down (bit value 0).
45 EN input High enables the chip, low powers it off; do not leave this pin floating.
46 GND power_in Ground pin of the module.
47 GND power_in Ground pin of the module.
48 GND power_in Ground pin of the module.
49 GND power_in Ground pin of the module.
50 GND power_in Ground pin of the module.
51 GND power_in Ground pin of the module.
52 GND power_in Ground pin of the module.
53 GND power_in Ground pin of the module.
54 GND power_in Ground pin of the module.
55 GND power_in Ground pin of the module.
56 GND power_in Ground pin of the module.
57 GND power_in Ground pin of the module.
58 GND power_in Ground pin of the module.
59 GND power_in Ground pin of the module.
60 GND power_in Ground pin of the module.
61 GND power_in Ground pin; the schematic labels it EPAD, and soldering it to the base-board ground is optional but improves thermal performance.
62 GND power_in Ground pin of the module.
63 GND power_in Ground pin of the module.
64 GND power_in Ground pin of the module.
65 GND power_in Ground pin of the module.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package ESP32-S3-MINI-1
Category IoT/Communication Modules
Pins 65

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 27
Storage temperature TSTORE -40 105 °C 27
Power supply voltage VDD33 3 3.3 3.6 V 27
Current delivered by external power supply IVDD 0.5 A 27
Operating ambient temperature TA -40 85 °C 27
High-level input current IIH 50 nA 27
Low-level input current IIL 50 nA 27
Pin capacitance CIN 2 pF 27
High-level source current IOH 40 mA VDD = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3 27
Low-level sink current IOL 28 mA VDD = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3 27
Internal weak pull-up resistor RPU 45 kΩ 27
Internal weak pull-down resistor RPD 45 kΩ 27
Power supply voltage (1.8 V) VCC 1.65 1.8 2 V Flash, 1.8 V supply 30
Power supply voltage (3.3 V) VCC 2.7 3.3 3.6 V Flash, 3.3 V supply 30
Maximum clock frequency FC 80 MHz Flash 30
Program/erase cycles 100000 cycles Flash 30
Data retention time TRET 20 years Flash 30
Page program time TPP 0.8 5 ms Flash 30
Sector erase time (4 KB) TSE 70 500 ms Flash, 4 KB sector 30
Block erase time (32 KB) TBE1 0.2 2 s Flash, 32 KB block 30
Block erase time (64 KB) TBE2 0.3 3 s Flash, 64 KB block 30
Chip erase time (64 Mb) TCE 25 100 s Flash, 64 Mb (8 MB) 30
Internal crystal oscillator frequency 40 MHz Module-integrated 40 MHz crystal (Y1) 39
Internal crystal oscillator frequency tolerance -10 10 ppm Y1 40 MHz crystal, ±10 ppm as printed 39

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing THERMOPLASTIC HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; 43
contacts COPPER ALLOY gold CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 43
shell COPPER ALLOY gold SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; 43

CAD (KiCad official)

  • Symbol: ESP32-S3-MINI-1-N8
  • Footprint: PCM_Espressif:ESP32-S3-MINI-1
  • 3D model: ESP32-S3-MINI-1 (KiCad packages3D, STEP)
  • 3D model files: esp32-s3-mini-1-n8-etched.step / esp32-s3-mini-1-n8-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-s3-mini-1-n8.step / esp32-s3-mini-1-n8.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (53 pp, sha256 4d4b7f1c17b484c6, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF