component
ESP32-C6-WROOM-1U-N8
Public Made by Adomby adom
Espressif Systems RF and Wireless, 37-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ESP32-C6-WROOM-1U-N8
Espressif Systems · RF and Wireless · 37-SMD Module
ESP32-C6-WROOM-1U-N8 from Espressif Systems, in a 37-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground reference pin of the module. |
| 2 | 3V3 | power_in | Power supply pin; the datasheet recommends a 3.0 to 3.6 V supply (VDD33, Table 6-2 on page 26). |
| 3 | EN | input | Chip enable: high turns the chip on, low powers it off, and the pin must not be left floating. |
| 4 | IO4 | bidirectional | GPIO4 also serves as MTMS, LP_GPIO4, LP_UART_RXD, ADC1_CH4 and FSPIHD; it is floating at reset as a strapping pin. |
| 5 | IO5 | bidirectional | GPIO5 also serves as MTDI, LP_GPIO5, LP_UART_TXD, ADC1_CH5 and FSPIWP; it is floating at reset as a strapping pin. |
| 6 | IO6 | bidirectional | GPIO6 also serves as MTCK, LP_GPIO6, LP_I2C_SDA, ADC1_CH6 and FSPICLK. |
| 7 | IO7 | bidirectional | GPIO7 also serves as MTDO, LP_GPIO7, LP_I2C_SCL and FSPID. |
| 8 | IO0 | bidirectional | GPIO0 also serves as XTAL_32K_P, LP_GPIO0, LP_UART_DTRN and ADC1_CH0. |
| 9 | IO1 | bidirectional | GPIO1 also serves as XTAL_32K_N, LP_GPIO1, LP_UART_DSRN and ADC1_CH1. |
| 10 | IO8 | bidirectional | GPIO8 is a general-purpose I/O and also a boot-mode strapping pin together with GPIO9, floating at reset. |
| 11 | IO10 | bidirectional | General-purpose I/O GPIO10. |
| 12 | IO11 | bidirectional | General-purpose I/O GPIO11. |
| 13 | IO12 | bidirectional | GPIO12 also serves as the USB D- signal. |
| 14 | IO13 | bidirectional | GPIO13 also serves as the USB D+ signal. |
| 15 | IO9 | bidirectional | GPIO9 is a general-purpose I/O and a boot-mode strapping pin with a default weak pull-up, sampled together with GPIO8 at reset. |
| 16 | IO18 | bidirectional | GPIO18 also serves as SDIO_CMD and FSPICS2. |
| 17 | IO19 | bidirectional | GPIO19 also serves as SDIO_CLK and FSPICS3. |
| 18 | IO20 | bidirectional | GPIO20 also serves as SDIO_DATA0 and FSPICS4. |
| 19 | IO21 | bidirectional | GPIO21 also serves as SDIO_DATA1 and FSPICS5. |
| 20 | IO22 | bidirectional | GPIO22 also serves as SDIO_DATA2. |
| 21 | IO23 | bidirectional | GPIO23 also serves as SDIO_DATA3. |
| 22 | NC | unconnected | Marked NC in Table 3-1; no function is assigned to this pin. |
| 23 | IO15 | bidirectional | GPIO15 is a strapping pin for JTAG signal source control; it has no internal pull resistors, so an external circuit must drive it and it cannot be left high-impedance. |
| 24 | RXD0 | bidirectional | UART0 receive pin U0RXD, also GPIO17 and FSPICS1. |
| 25 | TXD0 | bidirectional | UART0 transmit pin U0TXD, also GPIO16 and FSPICS0. |
| 26 | IO3 | bidirectional | GPIO3 also serves as LP_GPIO3, LP_UART_CTSN and ADC1_CH3. |
| 27 | IO2 | bidirectional | GPIO2 also serves as LP_GPIO2, LP_UART_RTSN, ADC1_CH2 and FSPIQ. |
| 28 | GND | power_in | Ground pin. |
| 29 | EPAD | power_in | Ground thermal pad; soldering it to the base-board ground is optional and improves thermal performance, but excess solder paste can lift the module. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Espressif Systems |
| Package | 37-SMD Module |
| Category | RF and Wireless |
| Pins | 29 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VDD33 | -0.3 | 3.6 | V | 26 | ||
| Storage temperature | TSTORE | -40 | 105 | °C | 26 | ||
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V | 26 | |
| Current delivered by external power supply | IVDD | 0.5 | A | 26 | |||
| Operating ambient temperature | TA | -40 | 85 | °C | 85 °C version | 26 | |
| Low-level input voltage | VIL | -0.3 | V | DC Characteristics (3.3 V, 25 °C) | 26 | ||
| High-level input current | IIH | 50 | nA | DC Characteristics (3.3 V, 25 °C) | 26 | ||
| Low-level input current | IIL | 50 | nA | DC Characteristics (3.3 V, 25 °C) | 26 | ||
| Chip reset voltage | VIL_nRST | -0.3 | V | CHIP_PU voltage is within the specified range | 27 | ||
| Power supply voltage (3.3 V) | VCC | 2.7 | 3.3 | 3.6 | V | 28 | |
| Maximum clock frequency (flash) | FC | 80 | MHz | 28 | |||
| Program/erase cycles (flash) | 100000 | cycles | 28 | ||||
| Data retention time (flash) | TRET | 20 | years | 28 | |||
| Page program time (flash) | TPP | 0.8 | 5 | ms | 28 | ||
| Sector erase time (4 KB, flash) | TSE | 70 | 500 | ms | 29 | ||
| Block erase time (32 KB, flash) | TBE1 | 0.2 | 2 | s | 29 | ||
| Block erase time (64 KB, flash) | TBE2 | 0.3 | 3 | s | 29 | ||
| Chip erase time (64 Mb, flash) | TCE | 25 | 100 | s | 29 | ||
| Center frequency range of operating channel (Wi-Fi) | 2412 | 2484 | MHz | 30 | |||
| TX EVM Limit, 802.11b, 1 Mbps, DSSS | -25 | -10 | dB | 30 | |||
| TX EVM Limit, 802.11b, 11 Mbps, CCK | -25 | -10 | dB | 30 | |||
| TX EVM Limit, 802.11g, 6 Mbps, OFDM | -24 | -5 | dB | 31 | |||
| TX EVM Limit, 802.11g, 54 Mbps, OFDM | -28 | -25 | dB | 31 | |||
| TX EVM Limit, 802.11n, HT20, MCS0 | -27.5 | -5 | dB | 31 | |||
| TX EVM Limit, 802.11n, HT20, MCS7 | -30 | -27 | dB | 31 | |||
| TX EVM Limit, 802.11n, HT40, MCS0 | -27 | -5 | dB | 31 | |||
| TX EVM Limit, 802.11n, HT40, MCS7 | -29.5 | -27 | dB | 31 | |||
| TX EVM Limit, 802.11ax, HE20, MCS0 | -27 | -5 | dB | 31 | |||
| TX EVM Limit, 802.11ax, HE20, MCS9 | -34 | -32 | dB | 31 | |||
| Center frequency range of operating channel (Bluetooth LE) | 2402 | 2480 | MHz | 33 | |||
| RF transmit power range (Bluetooth LE) | -16 | 19 | dBm | 33 | |||
| Bluetooth LE receiver sensitivity, 1 Mbps | -98 | dBm | @30.8% PER | 34 | |||
| Bluetooth LE maximum received signal, 1 Mbps | 8 | dBm | @30.8% PER | 34 | |||
| Bluetooth LE receiver sensitivity, 2 Mbps | -95 | dBm | @30.8% PER | 35 | |||
| Bluetooth LE maximum received signal, 2 Mbps | 8 | dBm | @30.8% PER | 35 | |||
| Bluetooth LE receiver sensitivity, 125 Kbps | -105.5 | dBm | @30.8% PER | 36 | |||
| Bluetooth LE maximum received signal, 125 Kbps | 8 | dBm | @30.8% PER | 36 | |||
| Bluetooth LE receiver sensitivity, 500 Kbps | -101.5 | dBm | @30.8% PER | 36 | |||
| Bluetooth LE maximum received signal, 500 Kbps | 8 | dBm | @30.8% PER | 36 | |||
| Center frequency range of operating channel (802.15.4) | 2405 | 2480 | MHz | 36 | |||
| RF transmit power range (802.15.4) | -16 | 19 | dBm | 37 | |||
| 802.15.4 receiver sensitivity, 250 Kbps | -104 | dBm | @1% PER | 37 | |||
| 802.15.4 maximum received signal, 250 Kbps | 8 | dBm | @1% PER | 37 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Solder: Sn-Ag-Cu (SAC305) lead-free solder Temperature (°C) | 46 |
CAD (KiCad official)
- Symbol:
ESP32-C6-WROOM-1U-N8 - Footprint:
PCM_Espressif:ESP32-C6-WROOM-1U - 3D model: 37-SMD Module (KiCad packages3D, STEP)
- 3D model files:
esp32-c6-wroom-1u-n8-etched.step/esp32-c6-wroom-1u-n8-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esp32-c6-wroom-1u-n8.step/esp32-c6-wroom-1u-n8.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Espressif Systems datasheet (52 pp, sha256
163020762fa6d499, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ESP32-C6-WROOM-1U-N8
**Espressif Systems** · RF and Wireless · 37-SMD Module
ESP32-C6-WROOM-1U-N8 from Espressif Systems, in a 37-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground reference pin of the module. |
| 2 | 3V3 | power_in | Power supply pin; the datasheet recommends a 3.0 to 3.6 V supply (VDD33, Table 6-2 on page 26). |
| 3 | EN | input | Chip enable: high turns the chip on, low powers it off, and the pin must not be left floating. |
| 4 | IO4 | bidirectional | GPIO4 also serves as MTMS, LP_GPIO4, LP_UART_RXD, ADC1_CH4 and FSPIHD; it is floating at reset as a strapping pin. |
| 5 | IO5 | bidirectional | GPIO5 also serves as MTDI, LP_GPIO5, LP_UART_TXD, ADC1_CH5 and FSPIWP; it is floating at reset as a strapping pin. |
| 6 | IO6 | bidirectional | GPIO6 also serves as MTCK, LP_GPIO6, LP_I2C_SDA, ADC1_CH6 and FSPICLK. |
| 7 | IO7 | bidirectional | GPIO7 also serves as MTDO, LP_GPIO7, LP_I2C_SCL and FSPID. |
| 8 | IO0 | bidirectional | GPIO0 also serves as XTAL_32K_P, LP_GPIO0, LP_UART_DTRN and ADC1_CH0. |
| 9 | IO1 | bidirectional | GPIO1 also serves as XTAL_32K_N, LP_GPIO1, LP_UART_DSRN and ADC1_CH1. |
| 10 | IO8 | bidirectional | GPIO8 is a general-purpose I/O and also a boot-mode strapping pin together with GPIO9, floating at reset. |
| 11 | IO10 | bidirectional | General-purpose I/O GPIO10. |
| 12 | IO11 | bidirectional | General-purpose I/O GPIO11. |
| 13 | IO12 | bidirectional | GPIO12 also serves as the USB D- signal. |
| 14 | IO13 | bidirectional | GPIO13 also serves as the USB D+ signal. |
| 15 | IO9 | bidirectional | GPIO9 is a general-purpose I/O and a boot-mode strapping pin with a default weak pull-up, sampled together with GPIO8 at reset. |
| 16 | IO18 | bidirectional | GPIO18 also serves as SDIO_CMD and FSPICS2. |
| 17 | IO19 | bidirectional | GPIO19 also serves as SDIO_CLK and FSPICS3. |
| 18 | IO20 | bidirectional | GPIO20 also serves as SDIO_DATA0 and FSPICS4. |
| 19 | IO21 | bidirectional | GPIO21 also serves as SDIO_DATA1 and FSPICS5. |
| 20 | IO22 | bidirectional | GPIO22 also serves as SDIO_DATA2. |
| 21 | IO23 | bidirectional | GPIO23 also serves as SDIO_DATA3. |
| 22 | NC | unconnected | Marked NC in Table 3-1; no function is assigned to this pin. |
| 23 | IO15 | bidirectional | GPIO15 is a strapping pin for JTAG signal source control; it has no internal pull resistors, so an external circuit must drive it and it cannot be left high-impedance. |
| 24 | RXD0 | bidirectional | UART0 receive pin U0RXD, also GPIO17 and FSPICS1. |
| 25 | TXD0 | bidirectional | UART0 transmit pin U0TXD, also GPIO16 and FSPICS0. |
| 26 | IO3 | bidirectional | GPIO3 also serves as LP_GPIO3, LP_UART_CTSN and ADC1_CH3. |
| 27 | IO2 | bidirectional | GPIO2 also serves as LP_GPIO2, LP_UART_RTSN, ADC1_CH2 and FSPIQ. |
| 28 | GND | power_in | Ground pin. |
| 29 | EPAD | power_in | Ground thermal pad; soldering it to the base-board ground is optional and improves thermal performance, but excess solder paste can lift the module. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Espressif Systems |
| Package | 37-SMD Module |
| Category | RF and Wireless |
| Pins | 29 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VDD33 | -0.3 | | 3.6 | V | | 26 |
| Storage temperature | TSTORE | -40 | | 105 | °C | | 26 |
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V | | 26 |
| Current delivered by external power supply | IVDD | 0.5 | | | A | | 26 |
| Operating ambient temperature | TA | -40 | | 85 | °C | 85 °C version | 26 |
| Low-level input voltage | VIL | -0.3 | | | V | DC Characteristics (3.3 V, 25 °C) | 26 |
| High-level input current | IIH | | | 50 | nA | DC Characteristics (3.3 V, 25 °C) | 26 |
| Low-level input current | IIL | | | 50 | nA | DC Characteristics (3.3 V, 25 °C) | 26 |
| Chip reset voltage | VIL_nRST | -0.3 | | | V | CHIP_PU voltage is within the specified range | 27 |
| Power supply voltage (3.3 V) | VCC | 2.7 | 3.3 | 3.6 | V | | 28 |
| Maximum clock frequency (flash) | FC | 80 | | | MHz | | 28 |
| Program/erase cycles (flash) | | 100000 | | | cycles | | 28 |
| Data retention time (flash) | TRET | 20 | | | years | | 28 |
| Page program time (flash) | TPP | | 0.8 | 5 | ms | | 28 |
| Sector erase time (4 KB, flash) | TSE | | 70 | 500 | ms | | 29 |
| Block erase time (32 KB, flash) | TBE1 | | 0.2 | 2 | s | | 29 |
| Block erase time (64 KB, flash) | TBE2 | | 0.3 | 3 | s | | 29 |
| Chip erase time (64 Mb, flash) | TCE | | 25 | 100 | s | | 29 |
| Center frequency range of operating channel (Wi-Fi) | | 2412 | | 2484 | MHz | | 30 |
| TX EVM Limit, 802.11b, 1 Mbps, DSSS | | | -25 | -10 | dB | | 30 |
| TX EVM Limit, 802.11b, 11 Mbps, CCK | | | -25 | -10 | dB | | 30 |
| TX EVM Limit, 802.11g, 6 Mbps, OFDM | | | -24 | -5 | dB | | 31 |
| TX EVM Limit, 802.11g, 54 Mbps, OFDM | | | -28 | -25 | dB | | 31 |
| TX EVM Limit, 802.11n, HT20, MCS0 | | | -27.5 | -5 | dB | | 31 |
| TX EVM Limit, 802.11n, HT20, MCS7 | | | -30 | -27 | dB | | 31 |
| TX EVM Limit, 802.11n, HT40, MCS0 | | | -27 | -5 | dB | | 31 |
| TX EVM Limit, 802.11n, HT40, MCS7 | | | -29.5 | -27 | dB | | 31 |
| TX EVM Limit, 802.11ax, HE20, MCS0 | | | -27 | -5 | dB | | 31 |
| TX EVM Limit, 802.11ax, HE20, MCS9 | | | -34 | -32 | dB | | 31 |
| Center frequency range of operating channel (Bluetooth LE) | | 2402 | | 2480 | MHz | | 33 |
| RF transmit power range (Bluetooth LE) | | -16 | | 19 | dBm | | 33 |
| Bluetooth LE receiver sensitivity, 1 Mbps | | | | -98 | dBm | @30.8% PER | 34 |
| Bluetooth LE maximum received signal, 1 Mbps | | | | 8 | dBm | @30.8% PER | 34 |
| Bluetooth LE receiver sensitivity, 2 Mbps | | | | -95 | dBm | @30.8% PER | 35 |
| Bluetooth LE maximum received signal, 2 Mbps | | | | 8 | dBm | @30.8% PER | 35 |
| Bluetooth LE receiver sensitivity, 125 Kbps | | | | -105.5 | dBm | @30.8% PER | 36 |
| Bluetooth LE maximum received signal, 125 Kbps | | | | 8 | dBm | @30.8% PER | 36 |
| Bluetooth LE receiver sensitivity, 500 Kbps | | | | -101.5 | dBm | @30.8% PER | 36 |
| Bluetooth LE maximum received signal, 500 Kbps | | | | 8 | dBm | @30.8% PER | 36 |
| Center frequency range of operating channel (802.15.4) | | 2405 | | 2480 | MHz | | 36 |
| RF transmit power range (802.15.4) | | -16 | | 19 | dBm | | 37 |
| 802.15.4 receiver sensitivity, 250 Kbps | | | | -104 | dBm | @1% PER | 37 |
| 802.15.4 maximum received signal, 250 Kbps | | | | 8 | dBm | @1% PER | 37 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | Solder: Sn-Ag-Cu (SAC305) lead-free solder Temperature (°C) | 46 |
## CAD (KiCad official)
- Symbol: `ESP32-C6-WROOM-1U-N8`
- Footprint: `PCM_Espressif:ESP32-C6-WROOM-1U`
- 3D model: 37-SMD Module (KiCad packages3D, STEP)
- 3D model files: `esp32-c6-wroom-1u-n8-etched.step` / `esp32-c6-wroom-1u-n8-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esp32-c6-wroom-1u-n8.step` / `esp32-c6-wroom-1u-n8.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Espressif Systems datasheet](https://www.espressif.com/sites/default/files/documentation/esp32-c6-wroom-1_wroom-1u_datasheet_en.pdf) (52 pp, sha256 `163020762fa6d499`, retrieved 2026-10-28, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/esp32-c6-wroom-1u-n8-datasheet.pdf)