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ESP32-C6-WROOM-1U-N8

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Espressif Systems RF and Wireless, 37-SMD Module. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ESP32-C6-WROOM-1U-N8

Espressif Systems · RF and Wireless · 37-SMD Module

ESP32-C6-WROOM-1U-N8 from Espressif Systems, in a 37-SMD Module. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference pin of the module.
2 3V3 power_in Power supply pin; the datasheet recommends a 3.0 to 3.6 V supply (VDD33, Table 6-2 on page 26).
3 EN input Chip enable: high turns the chip on, low powers it off, and the pin must not be left floating.
4 IO4 bidirectional GPIO4 also serves as MTMS, LP_GPIO4, LP_UART_RXD, ADC1_CH4 and FSPIHD; it is floating at reset as a strapping pin.
5 IO5 bidirectional GPIO5 also serves as MTDI, LP_GPIO5, LP_UART_TXD, ADC1_CH5 and FSPIWP; it is floating at reset as a strapping pin.
6 IO6 bidirectional GPIO6 also serves as MTCK, LP_GPIO6, LP_I2C_SDA, ADC1_CH6 and FSPICLK.
7 IO7 bidirectional GPIO7 also serves as MTDO, LP_GPIO7, LP_I2C_SCL and FSPID.
8 IO0 bidirectional GPIO0 also serves as XTAL_32K_P, LP_GPIO0, LP_UART_DTRN and ADC1_CH0.
9 IO1 bidirectional GPIO1 also serves as XTAL_32K_N, LP_GPIO1, LP_UART_DSRN and ADC1_CH1.
10 IO8 bidirectional GPIO8 is a general-purpose I/O and also a boot-mode strapping pin together with GPIO9, floating at reset.
11 IO10 bidirectional General-purpose I/O GPIO10.
12 IO11 bidirectional General-purpose I/O GPIO11.
13 IO12 bidirectional GPIO12 also serves as the USB D- signal.
14 IO13 bidirectional GPIO13 also serves as the USB D+ signal.
15 IO9 bidirectional GPIO9 is a general-purpose I/O and a boot-mode strapping pin with a default weak pull-up, sampled together with GPIO8 at reset.
16 IO18 bidirectional GPIO18 also serves as SDIO_CMD and FSPICS2.
17 IO19 bidirectional GPIO19 also serves as SDIO_CLK and FSPICS3.
18 IO20 bidirectional GPIO20 also serves as SDIO_DATA0 and FSPICS4.
19 IO21 bidirectional GPIO21 also serves as SDIO_DATA1 and FSPICS5.
20 IO22 bidirectional GPIO22 also serves as SDIO_DATA2.
21 IO23 bidirectional GPIO23 also serves as SDIO_DATA3.
22 NC unconnected Marked NC in Table 3-1; no function is assigned to this pin.
23 IO15 bidirectional GPIO15 is a strapping pin for JTAG signal source control; it has no internal pull resistors, so an external circuit must drive it and it cannot be left high-impedance.
24 RXD0 bidirectional UART0 receive pin U0RXD, also GPIO17 and FSPICS1.
25 TXD0 bidirectional UART0 transmit pin U0TXD, also GPIO16 and FSPICS0.
26 IO3 bidirectional GPIO3 also serves as LP_GPIO3, LP_UART_CTSN and ADC1_CH3.
27 IO2 bidirectional GPIO2 also serves as LP_GPIO2, LP_UART_RTSN, ADC1_CH2 and FSPIQ.
28 GND power_in Ground pin.
29 EPAD power_in Ground thermal pad; soldering it to the base-board ground is optional and improves thermal performance, but excess solder paste can lift the module.

Key specifications

Parameter Value
Manufacturer Espressif Systems
Package 37-SMD Module
Category RF and Wireless
Pins 29

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply voltage VDD33 -0.3 3.6 V 26
Storage temperature TSTORE -40 105 °C 26
Power supply voltage VDD33 3 3.3 3.6 V 26
Current delivered by external power supply IVDD 0.5 A 26
Operating ambient temperature TA -40 85 °C 85 °C version 26
Low-level input voltage VIL -0.3 V DC Characteristics (3.3 V, 25 °C) 26
High-level input current IIH 50 nA DC Characteristics (3.3 V, 25 °C) 26
Low-level input current IIL 50 nA DC Characteristics (3.3 V, 25 °C) 26
Chip reset voltage VIL_nRST -0.3 V CHIP_PU voltage is within the specified range 27
Power supply voltage (3.3 V) VCC 2.7 3.3 3.6 V 28
Maximum clock frequency (flash) FC 80 MHz 28
Program/erase cycles (flash) 100000 cycles 28
Data retention time (flash) TRET 20 years 28
Page program time (flash) TPP 0.8 5 ms 28
Sector erase time (4 KB, flash) TSE 70 500 ms 29
Block erase time (32 KB, flash) TBE1 0.2 2 s 29
Block erase time (64 KB, flash) TBE2 0.3 3 s 29
Chip erase time (64 Mb, flash) TCE 25 100 s 29
Center frequency range of operating channel (Wi-Fi) 2412 2484 MHz 30
TX EVM Limit, 802.11b, 1 Mbps, DSSS -25 -10 dB 30
TX EVM Limit, 802.11b, 11 Mbps, CCK -25 -10 dB 30
TX EVM Limit, 802.11g, 6 Mbps, OFDM -24 -5 dB 31
TX EVM Limit, 802.11g, 54 Mbps, OFDM -28 -25 dB 31
TX EVM Limit, 802.11n, HT20, MCS0 -27.5 -5 dB 31
TX EVM Limit, 802.11n, HT20, MCS7 -30 -27 dB 31
TX EVM Limit, 802.11n, HT40, MCS0 -27 -5 dB 31
TX EVM Limit, 802.11n, HT40, MCS7 -29.5 -27 dB 31
TX EVM Limit, 802.11ax, HE20, MCS0 -27 -5 dB 31
TX EVM Limit, 802.11ax, HE20, MCS9 -34 -32 dB 31
Center frequency range of operating channel (Bluetooth LE) 2402 2480 MHz 33
RF transmit power range (Bluetooth LE) -16 19 dBm 33
Bluetooth LE receiver sensitivity, 1 Mbps -98 dBm @30.8% PER 34
Bluetooth LE maximum received signal, 1 Mbps 8 dBm @30.8% PER 34
Bluetooth LE receiver sensitivity, 2 Mbps -95 dBm @30.8% PER 35
Bluetooth LE maximum received signal, 2 Mbps 8 dBm @30.8% PER 35
Bluetooth LE receiver sensitivity, 125 Kbps -105.5 dBm @30.8% PER 36
Bluetooth LE maximum received signal, 125 Kbps 8 dBm @30.8% PER 36
Bluetooth LE receiver sensitivity, 500 Kbps -101.5 dBm @30.8% PER 36
Bluetooth LE maximum received signal, 500 Kbps 8 dBm @30.8% PER 36
Center frequency range of operating channel (802.15.4) 2405 2480 MHz 36
RF transmit power range (802.15.4) -16 19 dBm 37
802.15.4 receiver sensitivity, 250 Kbps -104 dBm @1% PER 37
802.15.4 maximum received signal, 250 Kbps 8 dBm @1% PER 37

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Solder: Sn-Ag-Cu (SAC305) lead-free solder Temperature (°C) 46

CAD (KiCad official)

  • Symbol: ESP32-C6-WROOM-1U-N8
  • Footprint: PCM_Espressif:ESP32-C6-WROOM-1U
  • 3D model: 37-SMD Module (KiCad packages3D, STEP)
  • 3D model files: esp32-c6-wroom-1u-n8-etched.step / esp32-c6-wroom-1u-n8-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esp32-c6-wroom-1u-n8.step / esp32-c6-wroom-1u-n8.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Espressif Systems datasheet (52 pp, sha256 163020762fa6d499, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF