# ESP32-C6-MINI-1-H4

**Espressif Systems** · New Arrivals · ESP32-C6-MINI-1

ESP32-C6-MINI-1-H4 from Espressif Systems, in a ESP32-C6-MINI-1. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground reference pin for the module. |
| 2 | GND | power_in | Ground reference pin for the module. |
| 3 | 3V3 | power_in | Module 3.3 V supply input; VDD33 recommended range is 3.0-3.3-3.6 V with absolute maximum 3.6 V, and the external supply must deliver at least 0.5 A. |
| 4 | NC | unconnected | Not connected (NC) per Table 3-1. |
| 5 | IO2 | bidirectional | GPIO2 (I/O/T) with alternate functions LP_GPIO2, LP_UART_RTSN, ADC1_CH2 and FSPIQ. |
| 6 | IO3 | bidirectional | GPIO3 (I/O/T) with alternate functions LP_GPIO3, LP_UART_CTSN and ADC1_CH3. |
| 7 | NC | unconnected | Not connected (NC) per Table 3-1. |
| 8 | EN | input | Chip enable input: high turns the chip on, low powers the chip off, and the pin must not be left floating. |
| 9 | IO4 | bidirectional | GPIO4 (I/O/T) also MTMS, a strapping pin by default floating, with alternate functions LP_GPIO4, LP_UART_RXD, ADC1_CH4 and FSPIHD. |
| 10 | IO5 | bidirectional | GPIO5 (I/O/T) also MTDI, a strapping pin by default floating, with alternate functions LP_GPIO5, LP_UART_TXD, ADC1_CH5 and FSPIWP. |
| 11 | GND | power_in | Ground reference pin for the module. |
| 12 | IO0 | bidirectional | GPIO0 (I/O/T) with alternate functions XTAL_32K_P, LP_GPIO0, LP_UART_DTRN and ADC1_CH0. |
| 13 | IO1 | bidirectional | GPIO1 (I/O/T) with alternate functions XTAL_32K_N, LP_GPIO1, LP_UART_DSRN and ADC1_CH1. |
| 14 | GND | power_in | Ground reference pin for the module. |
| 15 | IO6 | bidirectional | GPIO6 (I/O/T) also MTCK, with alternate functions LP_GPIO6, LP_I2C_SDA, ADC1_CH6 and FSPICLK. |
| 16 | IO7 | bidirectional | GPIO7 (I/O/T) also MTDO, with alternate functions LP_GPIO7, LP_I2C_SCL and FSPID. |
| 17 | IO12 | bidirectional | GPIO12 (I/O/T) with alternate function USB_D- (USB data line; extracted text is truncated, read as USB_D-). |
| 18 | IO13 | bidirectional | GPIO13 (I/O/T) with alternate function USB_D+. |
| 19 | IO14 | bidirectional | GPIO14 (I/O/T), general-purpose I/O. |
| 20 | IO15 | bidirectional | GPIO15 (I/O/T), also the JTAG signal source strapping pin, floating by default. |
| 21 | NC | unconnected | Not connected (NC) per Table 3-1. |
| 22 | IO8 | bidirectional | GPIO8 (I/O/T), also a chip boot and ROM message printing strapping pin, floating by default. |
| 23 | IO9 | bidirectional | GPIO9 (I/O/T), also the chip boot mode strapping pin, with a weak pull-up by default (bit value 1). |
| 24 | IO18 | bidirectional | GPIO18 (I/O/T) with alternate functions SDIO_CMD and FSPICS2. |
| 25 | IO19 | bidirectional | GPIO19 (I/O/T) with alternate functions SDIO_CLK and FSPICS3. |
| 26 | IO20 | bidirectional | GPIO20 (I/O/T) with alternate functions SDIO_DATA0 and FSPICS4. |
| 27 | IO21 | bidirectional | GPIO21 (I/O/T) with alternate functions SDIO_DATA1 and FSPICS5. |
| 28 | IO22 | bidirectional | GPIO22 (I/O/T) with alternate function SDIO_DATA2. |
| 29 | IO23 | bidirectional | GPIO23 (I/O/T) with alternate function SDIO_DATA3. |
| 30 | RXD0 | bidirectional | U0RXD (UART0 receive) also GPIO17 and FSPICS1 (I/O/T). |
| 31 | TXD0 | bidirectional | U0TXD (UART0 transmit) also GPIO16 and FSPICS0 (I/O/T). |
| 32 | NC | unconnected | Not connected (NC) per Table 3-1. |
| 33 | NC | unconnected | Not connected (NC) per Table 3-1. |
| 34 | NC | unconnected | Not connected (NC) per Table 3-1. |
| 35 | NC | unconnected | Not connected (NC) per Table 3-1. |
| 36 | GND | power_in | Ground reference pin for the module. |
| 37 | GND | power_in | Ground reference pin for the module. |
| 38 | GND | power_in | Ground reference pin for the module. |
| 39 | GND | power_in | Ground reference pin for the module. |
| 40 | GND | power_in | Ground reference pin for the module. |
| 41 | GND | power_in | Ground reference pin for the module. |
| 42 | GND | power_in | Ground reference pin for the module. |
| 43 | GND | power_in | Ground reference pin for the module. |
| 44 | GND | power_in | Ground reference pin for the module. |
| 45 | GND | power_in | Ground reference pin for the module. |
| 46 | GND | power_in | Ground reference pin for the module. |
| 47 | GND | power_in | Ground reference pin for the module. |
| 48 | GND | power_in | Ground reference pin for the module. |
| 49 | GND | power_in | Ground reference pad; soldering it to base-board ground is optional but improves thermal performance, and excess solder paste can degrade the adhesion of other pins. |
| 50 | GND | power_in | Ground reference pin for the module. |
| 51 | GND | power_in | Ground reference pin for the module. |
| 52 | GND | power_in | Ground reference pin for the module. |
| 53 | GND | power_in | Ground reference pin for the module. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Espressif Systems |
| Package | ESP32-C6-MINI-1 |
| Category | Others |
| Pins | 53 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Power supply voltage | VDD33 | -0.3 |  | 3.6 | V |  | 26 |
| Power supply voltage | VDD33 | 3 | 3.3 | 3.6 | V |  | 26 |
| Current delivered by external power supply | IVDD | 0.5 |  |  | A |  | 26 |
| Operating ambient temperature | TA | -40 |  | 105 | °C | 105 °C version | 26 |
| High-level input current | IIH |  |  | 50 | nA |  | 26 |
| Low-level input current | IIL |  |  | 50 | nA |  | 26 |
| Power supply voltage (3.3 V) | VCC | 2.7 | 3.3 | 3.6 | V |  | 28 |
| Maximum clock frequency | FC | 80 |  |  | MHz |  | 28 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | THERMOPLASTIC |  | HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; | 42 |
| contacts | COPPER ALLOY | gold | CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 42 |
| shell | COPPER ALLOY | gold | SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; | 42 |

## CAD (KiCad official)

- Symbol: `ESP32-C6-MINI-1-H4`
- Footprint: `PCM_Espressif:ESP32-C6-MINI-1`
- 3D model: ESP32-C6-MINI-1 (KiCad packages3D, STEP)
- 3D model files: `esp32-c6-mini-1-h4-etched.step` / `esp32-c6-mini-1-h4-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esp32-c6-mini-1-h4.step` / `esp32-c6-mini-1-h4.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Espressif Systems datasheet](https://www.espressif.com/sites/default/files/documentation/esp32-c6-mini-1_mini-1u_datasheet_en.pdf) (53 pp, sha256 `26691033f31cbebf`, retrieved 2026-10-28, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/esp32-c6-mini-1-h4-datasheet.pdf)