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ESH3D-E3

Vishay Intertech · Fast Recovery / High Efficiency Diodes · DO-214AB(SMC)

ESH3D-E3 from Vishay Intertech, in a DO-214AB(SMC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode, marked by the color band on the package; the positive terminal of the 200 V, 3.0 A ultrafast rectifier (VRRM 200 V for ESH3D).
2 A passive Anode terminal of the single-diode rectifier, opposite the cathode band end of the SMC (DO-214AB) package.

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package DO-214AB(SMC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum repetitive peak reverse voltage VRMM 200 V TA = 25 °C 1
Maximum RMS voltage VRMS 140 V TA = 25 °C 1
Maximum DC blocking voltage VDC 200 V TA = 25 °C 1
Maximum average forward rectified current IF(AV) 3 A TA = 25 °C (fig. 1) 1
Peak forward surge current IFSM 125 A 8.3 ms single half sine-wave superimposed on rated load 1
Operating junction and storage temperature range TJ, TSTG -55 175 °C 1
Maximum instantaneous forward voltage VF 0.9 V IF = 3 A, pulse test 300 μs, 1 % duty cycle 2
Maximum DC reverse current IR 5 µA at rated DC blocking voltage, TA = 25 °C 2
Maximum DC reverse current IR 150 µA at rated DC blocking voltage, TA = 125 °C 2
Maximum reverse recovery time trr 25 ns IF = 0.5 A, IR = 1 A, Irr = 0.25 A 2
Typical reverse recovery time trr 40 ns IF = 3 A, VR = 30 V, dI/dt = 50 A/μs, Irr = 10 % IRM, TJ = 25 °C 2
Typical reverse recovery time trr 55 ns IF = 3 A, VR = 30 V, dI/dt = 50 A/μs, Irr = 10 % IRM, TJ = 100 °C 2
Typical stored charge Qrr 25 nC IF = 3 A, VR = 30 V, dI/dt = 50 A/μs, Irr = 10 % IRM, TJ = 25 °C 2
Typical stored charge Qrr 60 nC IF = 3 A, VR = 30 V, dI/dt = 50 A/μs, Irr = 10 % IRM, TJ = 100 °C 2
Typical junction capacitance CJ 70 pF 4.0 V, 1 MHz 2
Typical thermal resistance junction to ambient RθJA 50 °C/W Units mounted on PCB with 12.0 mm x 12.0 mm land areas 2
Typical thermal resistance junction to lead RθJL 15 °C/W Units mounted on PCB with 12.0 mm x 12.0 mm land areas 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 1

CAD (KiCad official)

  • Symbol: ESH3D-E3
  • Footprint: Diode_SMD:D_SMC
  • 3D model: DO-214AB(SMC) (KiCad packages3D, STEP)
  • 3D model files: esh3d-e3-etched.step / esh3d-e3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esh3d-e3.step / esh3d-e3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (5 pp, sha256 09597d321ca51c8a, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF