component
ESDS552DBZR
Public Made by Adomby adom
Texas Instruments ESD And Surge Protection (TVS/ESD), SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
README
markdownESDS552DBZR
Texas Instruments · ESD And Surge Protection (TVS/ESD) · SOT-23
ESDS552DBZR from Texas Instruments, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IO 1 | bidirectional | Surge- and ESD-protected I/O pin for the bidirectional TVS, with input voltage between any two pins limited to -12 V to 12 V. |
| 2 | IO 2 | bidirectional | Surge- and ESD-protected I/O pin for the bidirectional TVS, with input voltage between any two pins limited to -12 V to 12 V. |
| 3 | GND | power_in | Ground pin; connect to ground. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOT-23 |
| Category | Circuit Protection |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse stand-off voltage | VRWM | -12 | 12 | V | IIO < 50nA | 4 | |
| Breakdown voltage, IO to GND and GND to IO | VBR | 13.2 | 18 | V | IIO = ±1mA | 4 | |
| Leakage current at VRWM | ILEAKAGE | 10 | 50 | nA | VIO = ±12V | 4 | |
| Line capacitance, IO to GND | CLine | 9.5 | 11 | pF | VIO = 0V, f = 1MHz | 4 | |
| Input voltage between any 2 pins | VIN | -12 | 12 | V | between any 2 pins | 3 | |
| Operating free-air temperature (recommended) | TA | -40 | 125 | °C | 3 | ||
| Operating free-air temperature (absolute maximum) | TA | -40 | 125 | °C | 3 | ||
| Storage temperature | Tstg | -65 | 155 | °C | 3 | ||
| Peak Pulse Power | PPP | 500 | W | IEC 61000-4-5 Surge (tp 8/20 µs) at 25 °C | 3 | ||
| Peak Pulse Current | IPP | 25 | A | IEC 61000-4-5 Surge (tp 8/20 µs) at 25 °C | 3 | ||
| Human body model ESD | V(ESD) | -2500 | 2500 | V | HBM, per ANSI/ESDA/JEDEC JS-001, all pins | 3 | |
| Charged device model ESD | V(ESD) | -1000 | 1000 | V | CDM, per JEDEC JS-002, all pins | 3 | |
| IEC 61000-4-2 contact discharge ESD | V(ESD) | -30000 | 30000 | V | IEC 61000-4-2 Contact Discharge, all pins | 3 | |
| IEC 61000-4-2 air discharge ESD | V(ESD) | -30000 | 30000 | V | IEC 61000-4-2 Air Discharge, all pins | 3 | |
| Surge clamping voltage, I/O to GND | VCLAMP | 19 | V | tp = 8/20µs, IPP = 1A, I/O to GND | 4 | ||
| Surge clamping voltage, GND to I/O | VCLAMP | 19 | V | tp = 8/20µs, IPP = 1A, GND to I/O | 4 | ||
| Surge clamping voltage, I/O to GND | VCLAMP | 23.5 | V | tp = 8/20µs, IPP = 20A, I/O to GND | 4 | ||
| Surge clamping voltage, GND to I/O | VCLAMP | 23.5 | V | tp = 8/20µs, IPP = 20A, GND to I/O | 4 | ||
| 8/20µs surge dynamic resistance, I/O to GND | RDYN | 0.4 | Ω | 8/20µs surge, I/O to GND | 4 | ||
| 8/20µs surge dynamic resistance, GND to I/O | RDYN | 0.38 | Ω | 8/20µs surge, GND to I/O | 4 | ||
| Junction-to-ambient thermal resistance | RθJA | 244.1 | °C/W | 3 | |||
| Junction-to-case (top) thermal resistance | RθJC(top) | 107.4 | °C/W | 3 | |||
| Junction-to-board thermal resistance | RθJB | 85.5 | °C/W | 3 | |||
| Junction-to-top characterization parameter | ΨJT | 12.8 | °C/W | 3 | |||
| Junction-to-board characterization parameter | ΨJB | 84.8 | °C/W | 3 |
CAD (KiCad official)
- Symbol:
ESDS552DBZR - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
esds552dbzr-etched.step/esds552dbzr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esds552dbzr.step/esds552dbzr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (14 pp, sha256
0f2ab62094ba9423, retrieved 2026-10-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).