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ESD8D3.3C-HXY

HXY MOSFET · ESD Protection Devices · DFN1006-2

ESD8D3.3C-HXY from HXY MOSFET, in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of the single bi-directional ESD protection diode (VRWM 3.3 V max, VC 11 V max at IPP 9 A, 8/20 µs); connect to the protected line or to ground, since the part is symmetric.
2 2 passive Terminal 2 of the single bi-directional ESD protection diode (VRWM 3.3 V max, VC 11 V max at IPP 9 A, 8/20 µs); connect to the protected line or to ground, since the part is symmetric.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package DFN1006-2
Category TVS/Fuse/Board Level Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse working voltage VRWM 3.3 V 2
Breakdown voltage VBR 5 V @ IT = 1.0 mA (Note 1) 2
Reverse leakage current IR 0.05 µA @ VRWM 2
Clamping voltage VC 6.5 V @ IPP = 1 A (Note 2) 2
Clamping voltage at max IPP VC 11 V @ MAX IPP (Note 2) 2
Peak pulse current IPP 9 A Note 2, 8/20 µs 2
Peak pulse power PPK 100 W Note 2 2
Junction capacitance C 7 15 pF 2
Dynamic resistance RDYN 0.2 Ω @ tp = 100 ns (TLP) 2
Peak pulse power PPP 100 W tp = 8/20 µs, Tamb=25°C 1
Maximum lead temperature for soldering TL 260 °C 10 s 1
Storage temperature range Tstg -55 150 °C 1
Operating temperature range Top -55 150 °C 1
Maximum junction temperature Tj 150 °C 1
ESD air discharge -30 30 KV IEC61000-4-2 air discharge 1
ESD contact discharge -30 30 KV IEC61000-4-2 contact discharge 1
EFT 40 A IEC61000-4-4 (EFT) 1

CAD (KiCad official)

  • Symbol: ESD8D3.3C-HXY
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: DFN1006-2 (KiCad packages3D, STEP)
  • 3D model files: esd8d3-3c-hxy-etched.step / esd8d3-3c-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd8d3-3c-hxy.step / esd8d3-3c-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (4 pp, sha256 2cf5cf5ab7cb74c3, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF